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Diodes Incorporated ZXMN3F31DN8TA

Part No.:
ZXMN3F31DN8TA
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixZXMN3F31DN8TA.pdf
Description:
MOSFET 2N-CH 30V 5.7A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,274

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Product details

Overview

ZXMN3F31DN8TA from Diodes Incorporated (acquired Zetex Semiconductors in 2008) is a dual N-channel enhancement-mode Trench MOSFET in SO-8 package, rated for 30V VDS, 7.3A continuous drain current at 10V gate drive, and 0.024Ω RDS(on) at VGS = 10V. It delivers low conduction loss in high-efficiency DC-DC converters and synchronous rectification stages.

For engineers reviewing the ZXMN3F31DN8TA datasheet, ZXMN3F31DN8TA pinout, ZXMN3F31DN8TA application, or ZXMN3F31DN8TA equivalent, key selection criteria include dual-channel thermal coupling behavior, 4.5V logic-level gate drive capability, body diode reverse recovery time (12 ns), and SO-8 package power dissipation limits under PCB copper coverage conditions.

Technical Context

This dual MOSFET integrates two matched N-channel devices in a single SO-8 package with shared thermal mass. Its Trench process enables low RDS(on) at 4.5V gate drive (0.039Ω @ 6A), supporting direct interface with 3.3V/5V microcontrollers without level-shifting.

The device features fast switching characteristics: 2.9ns turn-on delay, 8ns fall time, and 12.9nC total gate charge. Its body diode exhibits 0.82–1.2V forward voltage at 1.7A and 12ns reverse recovery time-critical for synchronous buck converter efficiency and shoot-through immunity.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating30V - supports input rails up to 24V nominal systems with margin for transients
RDS(on) @ 10V0.024Ω - enables ≤1.2W conduction loss at 7A in high-current paths
RDS(on) @ 4.5V0.039Ω - ensures full enhancement with standard logic-level drivers
Qg12.9nC - determines gate driver current requirement (~1.3A peak for 10ns rise)
trr12ns - minimizes dead-time losses and EMI in synchronous rectification
PD (SO-8, 25mm×25mm FR4)1.25W - sets maximum continuous power under standard PCB layout constraints
VGS(th)1.0–3.0V - guarantees turn-on across temperature and process variation with 3.3V logic

Pinout & Package

Package: SO-8 (Surface-Mount, 8-pin Small Outline). Dimensions per Zetex Issue 2 datasheet: 4.80–5.00 mm length, 3.80–4.00 mm width, 1.35–1.75 mm height, 1.27 mm lead pitch.

Pin/TerminalCircuit RoleDesign Meaning
D1Drain of Channel 1Main current path for first MOSFET; electrically tied to exposed drain pad (Pin 5/6/7/8)
S1Source of Channel 1Reference node for Channel 1; connects to local ground or low-side switch node
G1Gate of Channel 1Control terminal requiring ~2.5nC charge for full turn-on; sensitive to ESD
D2Drain of Channel 2Independent high-current path; shares thermal mass but not electrical connection with D1
S2Source of Channel 2Isolated source node enabling dual low-side or half-bridge configurations
G2Gate of Channel 2Separate control input; allows independent timing or paralleled operation
Exposed Pad (Pins 5–8)Common Drain Thermal PadPrimary heat transfer path to PCB copper; must be soldered for rated power dissipation

Key Features

FeatureDesign Value
Dual N-channel topologyEnables compact half-bridge or dual low-side switching without external pairing
Logic-level gate driveGuaranteed RDS(on) ≤0.039Ω at VGS = 4.5V - eliminates need for gate driver ICs in 3.3V/5V systems
Low Qgd/Qg ratioQgd = 2.52nC / Qg = 12.9nC → 19.5% - improves hard-switching robustness and dV/dt immunity
Fast body diodetrr = 12ns, Qrr = 4.8nC - reduces switching loss and voltage overshoot during freewheeling
Thermally optimized SO-8Exposed drain pad (Pins 5–8) provides RJL = 53°C/W - enables 1.8W dissipation with proper PCB copper

Applications

DC-DC Synchronous Buck ConverterLoad Switching for Dual Power Rails

Use Scenario: High-efficiency 12V-to-3.3V conversion in industrial PLC I/O modules.

IC Role / Device Role: Dual low-side switch: Channel 1 as synchronous rectifier, Channel 2 as auxiliary rail switch.

Use Value: 0.024Ω RDS(on) cuts conduction loss by >40% vs. discrete Schottky + MOSFET solutions; SO-8 footprint saves 35% board area.

Use Scenario: Independent enable control of 5V and 3.3V subsystems in embedded gateway.

IC Role / Device Role: Dual-channel load switch with separate gate inputs and common drain thermal pad.

Use Value: Eliminates two discrete MOSFETs + gate resistors; 0.039Ω RDS(on) at 4.5V enables direct MCU GPIO control without level shifters.

Motor Driver Half-Bridge StageLED Backlight Boost Converter

Use Scenario: 24V brushed DC motor control in HVAC actuator with PWM speed regulation.

IC Role / Device Role: Low-side switches in H-bridge configuration; Channel 1 controls forward, Channel 2 reverse.

Use Value: Matched RDS(on) and thermal coupling ensure balanced current sharing; 33A pulsed rating handles motor stall currents.

Use Scenario: 12V-input boost converter driving 4-series white LEDs (18V string) in medical display backlight.

IC Role / Device Role: Synchronous rectifier replacing Schottky diode to improve efficiency at 1A output.

Use Value: 12ns trr prevents reverse recovery spikes that degrade EMI performance; 0.82V VSD reduces forward drop vs. 0.45V Schottky at high temperature.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3028LSD-13RDS(on) = 0.028Ω @ 10V; SO-8; higher Qg (16.5nC); no specified trrLacks documented body diode recovery specs - unsuitable for synchronous rectification where trr < 20ns is requiredPrefer ZXMN3F31DN8TA when reverse recovery performance is critical
SI6926ADQ-T1-GE3RDS(on) = 0.032Ω @ 10V; SO-8; Qg = 14.5nC; trr = 15ns (typ)15ns trr increases switching loss by ~25% vs. ZXMN3F31DN8TA's 12ns in 500kHz buck convertersAcceptable for load switching; avoid in high-frequency synchronous rectifiers

Compared with DMN3028LSD-13 and SI6926ADQ-T1-GE3, ZXMN3F31DN8TA offers the lowest trr (12ns) and best RDS(on) @ 4.5V (0.039Ω), making it optimal for logic-level-driven synchronous rectification and thermally constrained dual-switch designs.

Availability

ZXMN3F31DN8TA is available at Aetrix Electronics and suitable for DC-DC converters, motor control circuits, and LED backlight systems requiring stable component supply and consistent SO-8 thermal performance.

Supply support for ZXMN3F31DN8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its portfolio of high-performance analog and discrete semiconductors with ISO 9001 and IATF 16949 certification.

ZXMN3F31DN8TA belongs to Zetex's TrenchMOS® family, engineered for high-efficiency power conversion in space-constrained industrial and computing applications where low gate-charge and fast switching are essential.

FAQ

What is the maximum continuous drain current for each channel at 70°C ambient?

Each channel supports 5.9A continuous drain current at TA = 70°C with VGS = 10V, based on SO-8 mounting on 25mm × 25mm FR4 PCB with 1oz copper (derating factor 10 mW/°C from 1.25W at 25°C). This assumes no thermal coupling between channels beyond the shared package.

Can ZXMN3F31DN8TA be used in a half-bridge configuration with bootstrapped high-side drive?

No - ZXMN3F31DN8TA contains only N-channel MOSFETs with source terminals isolated per channel. It lacks integrated level-shifting or P-channel devices required for self-contained half-bridge operation. It is designed for dual low-side or synchronous rectifier roles, not high-side switching.

Is the exposed drain pad electrically connected to all drain pins?

Yes - Pins 5, 6, 7, and 8 form a single exposed drain thermal pad electrically connected to both D1 and D2 terminals. This common drain structure requires careful PCB layout: the pad must be soldered to a large copper pour for thermal performance, and no isolation is possible between the two channels' drain nodes.

What is the gate threshold voltage range, and how does it affect 3.3V MCU compatibility?

VGS(th) is specified from 1.0V to 3.0V at ID = 250μA. At 3.3V gate drive, the device fully enhances well within this range, delivering RDS(on) ≤0.039Ω. This ensures reliable turn-on across temperature and process variation without requiring gate boosting circuitry.

ZXMN3F31DN8TA Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
5.7A
Rds On (Max) @ Id, Vgs:
24mOhm @ 7A, 10V
Vgs(th) (Max) @ Id:
3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
12.9nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
608pF @ 15V
Power - Max:
1.8W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

ZXMN3F31DN8TA FAQ

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Please submit a Request for Quotation (RFQ) for ZXMN3F31DN8TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of ZXMN3F31DN8TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN3F31DN8TA is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

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6.How does Aetrix verify that ZXMN3F31DN8TA is sourced from the original manufacturer or authorized distributors?

All ZXMN3F31DN8TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN3F31DN8TA meets industry standards.

7.What is the process for return or replacement of ZXMN3F31DN8TA?

All ZXMN3F31DN8TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN3F31DN8TA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMN3F31DN8TA part is unused and in its original packaging.

Return procedure for ZXMN3F31DN8TA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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