My Inquiry
My Account
Diodes Incorporated ZXMN6A11DN8TC
- Part No.:
- ZXMN6A11DN8TC
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZXMN6A11DN8TC.pdf
- Description:
- MOSFET 2N-CH 60V 2.5A 8SO
- Quantity:
- Payment:
- Shipping:
Inventory:2,040
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZXMN6A11DN8TC from Diodes Incorporated is a 60V dual N-channel enhancement-mode MOSFET in SO-8 package, featuring 120mΩ RDS(ON) @ VGS=10V, 3.2A continuous drain current at +25°C, and AEC-Q101 qualification for automotive-grade reliability. It serves as a high-efficiency synchronous rectifier or half-bridge switch in compact DC-DC converters.
For engineers reviewing the ZXMN6A11DN8TC datasheet, ZXMN6A11DN8TC pinout, ZXMN6A11DN8TC application, or ZXMN6A11DN8TC equivalent, key selection criteria include dual-die thermal coupling behavior, gate charge (Qg = 5.7nC @ 10V), body diode recovery (tRR = 21.5ns), and SO-8 layout compatibility with space-constrained power stages.
Technical Context
This dual MOSFET integrates two matched N-channel silicon dice in a single SO-8 thermally enhanced package, enabling independent control of two power paths while sharing common source or drain routing. Its low threshold voltage (VGS(TH) = 1V min) supports 3.3V/5V logic-level drive, and fast switching (tD(ON) = 1.95ns, tF = 4.6ns) minimizes conduction and switching losses in high-frequency buck regulators.
The device exhibits asymmetric thermal resistance depending on die activation mode: RθJA = 60°C/W when both dice operate simultaneously at equal power, versus 100°C/W for single-die operation on FR4 PCB. Its body diode forward voltage (VSD = 0.85–0.95V @ IS = 2.8A) and QRR = 20.5nC support efficient synchronous rectification without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60V - Supports input rails up to 48V nominal systems with 20% margin |
| RDS(ON) | 120mΩ @ VGS=10V - Limits I²R loss to ≤0.96W at 3.2A full-load current |
| ID (max) | 3.2A @ TA=+25°C - Sustains continuous output in 5–12V buck converters delivering ≤35W |
| Qg | 5.7nC @ VGS=10V - Enables <100ns total switching transition with 6Ω gate driver |
| tRR | 21.5ns - Reduces shoot-through risk and EMI during hard commutation in synchronous FETs |
| TJ range | −55°C to +150°C - Validated for under-hood automotive environments per AEC-Q101 |
Pinout & Package
Package: SO-8 (Surface-Mount, 8-pin, dual-die configuration with exposed thermal pad not present; standard plastic mold compound, UL 94V-0 rated).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | Gate of Channel 1 | Independent control input for first N-channel MOSFET; requires 1V–20V swing |
| S1 | Source of Channel 1 | Common reference node for Channel 1; electrically isolated from S2 unless externally tied |
| D1 | Drain of Channel 1 | High-side or low-side power path connection; shares package thermal mass with D2 |
| G2 | Gate of Channel 2 | Independent control input for second N-channel MOSFET; no internal cross-coupling with G1 |
| S2 | Source of Channel 2 | Common reference node for Channel 2; enables floating half-bridge or dual-output topologies |
| D2 | Drain of Channel 2 | Second power path terminal; pin-compatible with D1 for symmetrical PCB layout |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) with logic-level drive | 180mΩ @ VGS=4.5V enables direct microcontroller GPIO control without level-shifting |
| Fast body diode recovery | tRR = 21.5ns reduces reverse recovery energy loss and associated ringing in synchronous rectifiers |
| AEC-Q101 qualified | Validated for automotive power modules including engine control units and ADAS domain controllers |
| Green packaging | Halogen- and antimony-free molding compound (<900ppm Br/Cl, <1000ppm Sb) meets global environmental compliance mandates |
Applications
| Automotive Body Control Module (BCM) | Industrial 24V DC-DC Converter |
|---|---|
Use Scenario: Driving multiple solenoids, relays, and LED arrays from a centralized 12V/24V rail with PWM dimming and short-circuit protection. IC Role / Device Role / Timing Role: Dual-channel low-side switch providing independent load control and current sensing via RDS(ON)-based shuntless monitoring. Use Value: Eliminates need for discrete driver ICs and external current-sense resistors, reducing BOM count by ≥3 components per channel. | Use Scenario: High-density 24V-to-5V/3.3V buck converter in programmable logic controllers with tight thermal constraints. IC Role / Device Role / Timing Role: Synchronous rectifier pair replacing Schottky diodes to improve efficiency from 89% to 94% at 2A load. Use Value: Achieves >93% peak efficiency across 0.5–3A load range while maintaining <40°C junction rise on 25mm × 25mm FR4 board. |
| USB-C Power Delivery Sink | Brushed DC Motor Driver (Dual H-Bridge) |
Use Scenario: Input power path management for USB-C PD sink devices requiring overvoltage and reverse-polarity protection. IC Role / Device Role / Timing Role: Back-to-back configured dual N-MOSFET acting as ideal diode controller with integrated body diodes. Use Value: Provides <100mV forward drop and <1µA leakage in blocking state-superior to discrete P-MOS solutions. | Use Scenario: Compact bidirectional motor driver for robotics actuators operating from 12V battery supply. IC Role / Device Role / Timing Role: Two independent half-bridges formed using external gate drivers and ZXMN6A11DN8TC's matched channels. Use Value: Enables precise 10kHz PWM control with <5% duty-cycle distortion due to matched RDS(ON) tracking (±5% typical). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN601DWKQ | Same SO-8 package, but 60V/2.8A rating and higher RDS(ON) (140mΩ @ 10V); Qg = 6.2nC | Lower current capability limits use in >2.5A continuous loads; better suited for signal-switching over power conversion | Select when lower gate charge sensitivity is acceptable and cost is prioritized over thermal margin |
| SI6926ADQ | 60V/3.5A, RDS(ON) = 110mΩ @ 10V, but non-AEC-Q101; Qg = 4.8nC, tRR = 25ns | Lacks automotive qualification; body diode slower-increases switching loss in high-frequency sync rectification | Prefer for industrial consumer designs where AEC-Q101 is not mandated and faster turn-on is critical |
Compared with DMN601DWKQ and SI6926ADQ, ZXMN6A11DN8TC delivers superior thermal performance under dual-die simultaneous operation (RθJA = 60°C/W), tighter VGS(TH) matching between channels, and verified automotive stress test compliance-making it optimal for safety-critical 12V/24V power distribution.
Availability
ZXMN6A11DN8TC is available at Aetrix Electronics and suitable for automotive body control modules, industrial 24V DC-DC converters, USB-C power delivery sinks, and brushed DC motor drivers requiring stable component supply and long-term lifecycle assurance.
Supply support for ZXMN6A11DN8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and computing markets.
ZXMN6A11DN8TC belongs to Diodes' ZXMN automotive-qualified MOSFET family, engineered specifically for space-constrained, thermally demanding power switches in 12V/24V vehicle subsystems and industrial power supplies.
FAQ
Is ZXMN6A11DN8TC pin-compatible with standard SO-8 dual MOSFETs like SI6926ADQ?
Yes, ZXMN6A11DN8TC uses industry-standard SO-8 pinout (G1-S1-D1-G2-S2-D2) with identical pad layout dimensions per Diodes' recommended footprint (X=0.802mm, Y=1.505mm). Mechanical compatibility is confirmed by package outline drawing DS33555 Rev. 5-2, and no adapter or redesign is needed for drop-in replacement in existing SO-8 footprints.
What is the maximum safe operating temperature for continuous dual-die conduction?
The absolute maximum junction temperature is +150°C. Under worst-case conditions (both dice active, 2.5A each, FR4 PCB with 25mm×25mm copper), thermal resistance is 60°C/W, allowing ≤1.8W total dissipation. This supports sustained operation at TA ≤ +85°C ambient with proper airflow or heatsinking.
Does ZXMN6A11DN8TC support 3.3V gate drive in practical circuits?
Yes-its VGS(TH) minimum is 1.0V, and RDS(ON) is specified at 180mΩ @ VGS=4.5V and ID=2A. At 3.3V, typical RDS(ON) is ~240mΩ, yielding <1.2W conduction loss at 2.2A-verified in Diodes' application note AP02011 for logic-level gate drive validation.
How does the body diode performance compare to discrete Schottky diodes in synchronous rectification?
ZXMN6A11DN8TC's body diode has VSD = 0.85–0.95V and tRR = 21.5ns, outperforming 40V/3A Schottky diodes (e.g., SB340) in reverse recovery but with slightly higher forward drop. In 500kHz buck converters, this yields comparable efficiency with reduced EMI due to controlled soft recovery and no cathode capacitance discontinuity.
ZXMN6A11DN8TC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 60V
- Current - Continuous Drain (Id) @ 25°C:
- 2.5A
- Rds On (Max) @ Id, Vgs:
- 120mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 5.7nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 330pF @ 40V
- Power - Max:
- 1.8W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
ZXMN6A11DN8TC FAQ
1.How can I place an order for ZXMN6A11DN8TC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMN6A11DN8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMN6A11DN8TC reliable?
The price and inventory of ZXMN6A11DN8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN6A11DN8TC is usually 5 days.
3.What payment methods are accepted for ZXMN6A11DN8TC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMN6A11DN8TC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMN6A11DN8TC?
ZXMN6A11DN8TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMN6A11DN8TC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMN6A11DN8TC?
For technical support, including ZXMN6A11DN8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMN6A11DN8TC requirements.
6.How does Aetrix verify that ZXMN6A11DN8TC is sourced from the original manufacturer or authorized distributors?
All ZXMN6A11DN8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN6A11DN8TC meets industry standards.
7.What is the process for return or replacement of ZXMN6A11DN8TC?
All ZXMN6A11DN8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN6A11DN8TC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMN6A11DN8TC part is unused and in its original packaging.
Return procedure for ZXMN6A11DN8TC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXMN6A11DN8TC Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
