Diodes Incorporated ZXMN6A25KTC
- Part No.:
- ZXMN6A25KTC
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
ZXMN6A25KTC.pdf
- Description:
- MOSFET N-CH 60V 7A TO252-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,052
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Product details
Overview
ZXMN6A25KTC from Zetex Semiconductors is a 60V, 10.7A N-channel enhancement-mode trench MOSFET in DPAK package, optimized for high-efficiency power management with RDS(on) = 0.050 Ω @ VGS = 10V and fast switching (td(off) = 26.2 ns). It serves as a main switch in DC-DC converters and motor control H-bridge legs.
For engineers reviewing the ZXMN6A25KTC datasheet, ZXMN6A25KTC pinout, ZXMN6A25KTC application, or ZXMN6A25KTC equivalent, key selection criteria include its low gate charge (Qg = 20.4 nC), body diode recovery (trr = 22.0 ns), thermal resistance (RJA = 12.7 °C/W on 50 mm × 50 mm PCB), and 60V V(BR)DSS rating for industrial power stage design.
Technical Context
This MOSFET employs a trench-gate structure to simultaneously minimize conduction loss and switching loss. Its low RDS(on) and fast turn-off delay (26.2 ns) enable high-frequency operation in synchronous buck converters up to 500 kHz.
The device integrates a robust body diode with VSD = 0.95 V at 5.5 A and trr = 22.0 ns, supporting efficient freewheeling in half-bridge topologies without external Schottky diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 60 V - Maximum blocking voltage for 24/48 V bus applications with 20% margin |
| RDS(on) | 0.050 Ω @ VGS = 10 V - Enables <1 W conduction loss at 4.5 A continuous drain current |
| ID (continuous) | 10.7 A @ Tamb = 25°C - Supports >100 W power stages with standard PCB copper area |
| Qg | 20.4 nC @ VGS = 10 V - Reduces gate driver power demand and enables 3.3 V logic-level drive compatibility |
| td(off) | 26.2 ns - Limits dead-time requirements in synchronous rectification, improving efficiency above 200 kHz |
| trr | 22.0 ns - Minimizes reverse recovery loss during hard-switched transitions in motor drives |
| RJA | 12.7 °C/W - Allows 9.85 W power dissipation on 50 mm × 50 mm 2 oz FR4, enabling compact heatsink-free layout |
Pinout & Package
DPAK (TO-252) surface-mount package with exposed drain pad for thermal and electrical connection; 3-pin configuration optimized for high-current PCB routing and thermal relief.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main current path output terminal | Connected to exposed metal tab - must be soldered to large copper pour for thermal and current handling |
| Source (S) | Reference node for gate drive and current return | Low-inductance connection point for sense resistor placement and gate driver ground reference |
| Gate (G) | Control input for channel conduction | High-impedance node requiring <20.4 nC charge for full enhancement; sensitive to ESD |
Key Features
| Feature | Design Value |
|---|---|
| Trench-gate architecture | Enables simultaneous optimization of RDS(on) and Qg, reducing total power loss in high-frequency SMPS |
| Low gate threshold voltage | VGS(th) = 1–3 V - Ensures reliable turn-on with 3.3 V or 5 V microcontroller GPIOs |
| Fast body diode recovery | trr = 22.0 ns - Reduces shoot-through risk and EMI in half-bridge configurations |
| Thermally enhanced DPAK | RJA = 12.7 °C/W - Eliminates need for external heatsink in 10–15 W industrial power modules |
Applications
| DC-DC Converters | Motor Control |
|---|---|
Use Scenario: Synchronous buck converter in 24 V industrial PLC power supply. IC Role / Device Role / Timing Role: High-side main switch operating at 300 kHz with forced CCM mode. Use Value: 0.050 Ω RDS(on) limits conduction loss to 1.0 W at 4.5 A, enabling >94% efficiency at full load. | Use Scenario: H-bridge leg in 24 V brushed DC motor driver for factory automation. IC Role / Device Role / Timing Role: Low-side switch with active freewheeling via integrated body diode. Use Value: 22.0 ns trr prevents cross-conduction during PWM commutation, reducing heat generation by 18% vs. discrete diode solution. |
| Power Management Functions | Disconnect Switches |
Use Scenario: OR-ing FET in redundant 48 V telecom power distribution unit. IC Role / Device Role / Timing Role: Load-switching element controlling backplane power rail integrity. Use Value: 60 V V(BR)DSS provides 25% overvoltage margin against transients, ensuring system-level reliability. | Use Scenario: Hot-swap protection in modular server power shelf. IC Role / Device Role / Timing Role: Inrush-limited main power disconnect controlled by PMBus interface. Use Value: 10.7 A ID rating supports 50 W hot-plug insertion without derating, simplifying thermal design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN601DWK-7 | RDS(on) = 0.045 Ω @ 10 V but higher Qg = 24.5 nC; same DPAK package | Slightly better conduction loss but slower switching due to +20% gate charge | Prefer for low-frequency, high-current applications where thermal margin dominates switching loss |
| IRFZ44NPBF | RDS(on) = 0.028 Ω @ 10 V but larger TO-220 package; no specified trr | Lower conduction loss but requires heatsink and lacks documented body diode performance | Prefer only when board space allows TO-220 and thermal design accommodates higher peak power |
Compared with DMN601DWK-7 and IRFZ44NPBF, ZXMN6A25KTC delivers optimal balance of low RDS(on), fast td(off), and verified body diode recovery-making it uniquely suited for compact, high-frequency industrial power stages where both efficiency and layout density matter.
Availability
ZXMN6A25KTC is available at Aetrix Electronics and suitable for DC-DC converters, motor control circuits, and power management functions requiring stable component supply across industrial OEM production cycles.
Supply support for ZXMN6A25KTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Zetex Semiconductors (now part of Diodes Incorporated) is an ISO 9001/TS16949-certified UK-based analog and power semiconductor manufacturer focused on high-reliability industrial and automotive components.
ZXMN6A25KTC belongs to Zetex's trench-MOSFET product line, engineered specifically for high-efficiency, high-frequency power conversion in space-constrained industrial equipment.
FAQ
Is ZXMN6A25KTC suitable for 3.3 V logic-level gate drive?
Yes. With VGS(th) ranging from 1 V to 3 V and RDS(on) = 0.070 Ω at VGS = 4.5 V, it achieves full enhancement using standard 3.3 V microcontroller outputs. Gate charge of 20.4 nC ensures minimal driver loading at typical PWM frequencies below 1 MHz.
What is the maximum continuous drain current at 70°C ambient?
At Tamb = 70°C with standard mounting on 50 mm × 50 mm FR4 PCB, the continuous drain current is 8.6 A. This is derived from the 9.85 W power dissipation rating and linear derating factor of 78.7 mW/°C, validated per datasheet absolute maximum ratings table.
Does ZXMN6A25KTC include a built-in body diode, and is it rated for reverse recovery?
Yes. It features an integrated source-drain body diode with forward voltage VSD = 0.95 V at 5.5 A and fully characterized reverse recovery parameters: trr = 22.0 ns and Qrr = 21.4 nC at Tj = 25°C, enabling use in synchronous rectification without external diodes.
Can ZXMN6A25KTC be used in parallel configurations?
Yes, but with caution. Its positive temperature coefficient for RDS(on) supports current sharing; however, layout symmetry, gate drive matching, and thermal coupling must be strictly controlled. Derating to ≤70% of total rated current per device is recommended to ensure balanced conduction and avoid thermal runaway.
ZXMN6A25KTC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 7A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 3.6A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 20.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1063 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.11W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252-3
ZXMN6A25KTC FAQ
1.How can I place an order for ZXMN6A25KTC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMN6A25KTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMN6A25KTC reliable?
The price and inventory of ZXMN6A25KTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN6A25KTC is usually 5 days.
3.What payment methods are accepted for ZXMN6A25KTC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMN6A25KTC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMN6A25KTC?
ZXMN6A25KTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMN6A25KTC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMN6A25KTC?
For technical support, including ZXMN6A25KTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMN6A25KTC requirements.
6.How does Aetrix verify that ZXMN6A25KTC is sourced from the original manufacturer or authorized distributors?
All ZXMN6A25KTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN6A25KTC meets industry standards.
7.What is the process for return or replacement of ZXMN6A25KTC?
All ZXMN6A25KTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN6A25KTC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMN6A25KTC part is unused and in its original packaging.
Return procedure for ZXMN6A25KTC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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