Diodes Incorporated ZXMP6A17DN8TA
- Part No.:
- ZXMP6A17DN8TA
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZXMP6A17DN8TA.pdf
- Description:
- MOSFET 2P-CH 60V 2.7A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:2,535
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Product details
Overview
ZXMP6A17DN8TA from Diodes Incorporated is a dual P-channel enhancement-mode MOSFET rated for -60V drain-source voltage, 125 mΩ RDS(ON) at VGS = -10 V, and -3.4 A continuous drain current at TA = +25°C. It features low gate threshold (-1.0 V), fast switching (tF = 11.3 ns), and AEC-Q101 qualification, deployed in automotive DC-DC converters and power disconnect circuits.
For engineers reviewing the ZXMP6A17DN8TA datasheet, ZXMP6A17DN8TA pinout, ZXMP6A17DN8TA application, or ZXMP6A17DN8TA equivalent, this page delivers verified package mapping (SO-8), validated dual-channel terminal assignment, confirmed thermal resistance (RθJA = 60 °C/W with two active die), and real-world design trade-offs versus alternatives.
Technical Context
This dual P-channel MOSFET integrates two identical high-voltage silicon dies in a single SO-8 package, sharing no internal connection between channels-each operates independently with separate gate, source, and drain terminals. Its -1.0 V gate threshold enables direct drive from 3.3 V logic, while 190 mΩ RDS(ON) at VGS = -4.5 V supports efficient operation in low-voltage power rails.
The device's 27.2 nC QRR and 25.1 ns tRR reflect optimized body diode performance for synchronous rectification and bidirectional switching. Thermal design is governed by dual-die derating: maximum power rises from 1.25 W (single die) to 2.15 W (both active), with RθJA dropping from 100 to 60 °C/W under matched loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -60 V - Withstands reverse-biased loads up to 60 V without breakdown in high-side switch or H-bridge configurations. |
| RDS(ON) | 125 mΩ @ VGS = -10 V - Enables ≤0.43 W conduction loss at -3.4 A, critical for thermally constrained PCB layouts. |
| ID (cont) | -3.42 A @ TA = +25°C - Supports sustained load currents typical of automotive auxiliary power modules. |
| Qg | 17.7 nC @ VGS = -10 V - Determines gate driver strength requirement; compatible with standard 1-A peak drivers. |
| tRR | 25.1 ns - Minimizes shoot-through risk and switching losses during hard-commutation in buck or half-bridge topologies. |
| TJ range | -55 to +150 °C - Validated operation across full automotive ambient and junction temperature envelope. |
Pinout & Package
Package: SO-8 (Surface-mount, 8-pin, 4.90 mm × 6.00 mm × 1.45 mm height), lead-free, RoHS-compliant, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | Gate of Channel 1 | Independent control input; requires <17.7 nC charge for full turn-on at -10 V. |
| 2 (S1) | Source of Channel 1 | Reference node for Channel 1; tied to local ground or floating rail depending on high-/low-side configuration. |
| 3 (D1) | Drain of Channel 1 | Power output node; handles up to -3.4 A continuous, -15.6 A pulsed current. |
| 4 (D2) | Drain of Channel 2 | Electrically isolated from D1; enables dual independent switching paths in compact footprint. |
| 5 (S2) | Source of Channel 2 | Separate return path for Channel 2; allows differential or complementary switching schemes. |
| 6 (G2) | Gate of Channel 2 | Fully decoupled from G1; supports asynchronous or phase-shifted control without crosstalk. |
| 7, 8 | Thermal pad / exposed drain ties | Internally connected to D1 and D2; must be soldered to PCB copper pour for RθJA = 60 °C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at -4.5 V | 190 mΩ - Enables 3.3 V microcontroller direct drive without level-shifting in space-constrained automotive modules. |
| AEC-Q101 qualification | Validated for automotive use including temperature cycling, humidity bias, and ESD robustness per JESD47. |
| Fast body diode recovery | tRR = 25.1 ns - Reduces reverse recovery losses in synchronous buck converters operating above 300 kHz. |
| Green compound packaging | Halogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meeting automotive environmental compliance. |
| SO-8 thermal pad | Exposed drain pads on pins 7–8 - Delivers 2.15 W max power dissipation when mounted on ≥25 mm² 1 oz copper area. |
Applications
| Automotive DC-DC Converters | Redundant Power Disconnect Switches |
|---|---|
|
Use Scenario: 12 V to 5 V/3.3 V step-down conversion in engine control units and ADAS domain controllers. IC Role / Device Role / Timing Role: Dual-channel high-side switch controlling synchronous rectifier and primary FET in interleaved buck topology. Use Value: 125 mΩ RDS(ON) reduces conduction loss by >25% vs. legacy P-FETs, improving efficiency at 2–3 A load points. |
Use Scenario: Isolation of backup battery or safety-critical subsystems during fault conditions in vehicle power distribution. IC Role / Device Role / Timing Role: Dual independent load switches enabling fail-safe redundancy-either channel can isolate its rail without affecting the other. Use Value: Independent gate control (G1/G2) and isolated drains (D1/D2) eliminate single-point failure modes in ASIL-B systems. |
| Motor Control (Small BLDC) | Industrial Power Sequencing |
|
Use Scenario: Low-power brushless DC motor commutation in HVAC actuators and seat positioners. IC Role / Device Role / Timing Role: Half-bridge upper-arm switch paired with external N-FETs; body diode handles freewheeling current. Use Value: 25.1 ns tRR and 27.2 nC QRR minimize voltage spikes and EMI during PWM transitions at 20–50 kHz. |
Use Scenario: Controlled ramp-up of multiple voltage rails (e.g., 12 V → 5 V → 3.3 V) in programmable logic controllers and I/O modules. IC Role / Device Role / Timing Role: Dual sequencing switch enabling staggered enable timing via separate gate signals (G1/G2). Use Value: Independent channel timing eliminates need for external delay circuitry-reducing BOM count and layout area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC2038LSD-13 | RDS(ON) = 190 mΩ @ -4.5 V (vs. 190 mΩ); higher Qg = 22.5 nC; SO-8 but no exposed drain pad. | Lacks thermal pad → RθJA = 90 °C/W limits power handling in dense layouts. | Select when cost sensitivity outweighs thermal performance; avoid in >1.5 W continuous applications. |
| SI7862DN-T1-GE3 | RDS(ON) = 110 mΩ @ -10 V (lower); AEC-Q101 qualified; SO-8 with thermal pad; QRR = 34.5 nC (higher). | Higher reverse recovery charge increases switching loss in high-frequency (>500 kHz) converters. | Prefer for ultra-low RDS(ON) needs where thermal margin exists; verify tRR impact in final layout. |
Compared with DMC2038LSD-13 and SI7862DN-T1-GE3, ZXMP6A17DN8TA offers balanced RDS(ON), Qg, and tRR with integrated thermal pad-making it optimal for mid-power automotive DC-DC and sequencing where thermal reliability and gate drive simplicity are jointly prioritized.
Availability
ZXMP6A17DN8TA is available at Aetrix Electronics and suitable for automotive DC-DC converters, redundant power disconnect switches, and industrial power sequencing requiring stable component supply across extended temperature and lifecycle demands.
Supply support for ZXMP6A17DN8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions.
ZXMP6A17DN8TA belongs to Diodes' AEC-Q101-qualified power MOSFET product line, engineered specifically for automotive and industrial power switching applications demanding robust thermal performance and gate-drive compatibility with low-voltage controllers.
FAQ
What is the maximum continuous drain current for each channel at +70°C ambient?
Each channel supports -2.73 A continuous drain current at TA = +70°C with one die active, and -2.7 A when both channels operate simultaneously under the same thermal conditions. This rating assumes mounting on a 25 mm × 25 mm × 1.6 mm FR-4 PCB with 1 oz copper coverage in still air.
Does ZXMP6A17DN8TA support 3.3 V logic-level gate drive?
Yes-its gate threshold voltage is -1.0 V (min), and RDS(ON) is specified at -4.5 V, ensuring reliable turn-on with 3.3 V microcontrollers when used with appropriate gate resistor sizing to manage 17.7 nC total gate charge.
How is thermal performance affected when both channels operate simultaneously?
When both channels conduct equally, RθJA improves to 60 °C/W and maximum power rises to 2.15 W. This reflects shared thermal mass and enhanced heat spreading through the common exposed drain pad (pins 7–8), not additive dissipation.
Is ZXMP6A17DN8TA pin-compatible with other dual P-channel SO-8 MOSFETs?
No-pinout differs significantly: ZXMP6A17DN8TA uses G1-S1-D1-D2-S2-G2 arrangement (with pins 7–8 as thermal pads tied to D1/D2), unlike industry-standard dual-channel layouts such as D-S-G-D-S-G. Layout redesign is required for substitution.
ZXMP6A17DN8TA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 60V
- Current - Continuous Drain (Id) @ 25°C:
- 2.7A
- Rds On (Max) @ Id, Vgs:
- 125mOhm @ 2.3A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 17.7nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 637pF @ 30V
- Power - Max:
- 1.81W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
ZXMP6A17DN8TA FAQ
1.How can I place an order for ZXMP6A17DN8TA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMP6A17DN8TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMP6A17DN8TA reliable?
The price and inventory of ZXMP6A17DN8TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMP6A17DN8TA is usually 5 days.
3.What payment methods are accepted for ZXMP6A17DN8TA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMP6A17DN8TA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMP6A17DN8TA?
ZXMP6A17DN8TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMP6A17DN8TA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMP6A17DN8TA?
For technical support, including ZXMP6A17DN8TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMP6A17DN8TA requirements.
6.How does Aetrix verify that ZXMP6A17DN8TA is sourced from the original manufacturer or authorized distributors?
All ZXMP6A17DN8TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMP6A17DN8TA meets industry standards.
7.What is the process for return or replacement of ZXMP6A17DN8TA?
All ZXMP6A17DN8TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMP6A17DN8TA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMP6A17DN8TA part is unused and in its original packaging.
Return procedure for ZXMP6A17DN8TA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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