Infineon Technologies AIGB40N65H5ATMA1

Overview

AIGB40N65H5ATMA1 from Infineon Technologies is a 650 V, 40 A automotive-grade TRENCHSTOP™ 5 IGBT in TO-247-3 package, optimized for high-efficiency main inverters and HV-LV DC-DC converters in electric and hybrid vehicles. It features 1.55 V typical V_CE(sat) at 40 A/150 °C, 35 ns typical t_f, and 100% avalanche-rated ruggedness for reliable operation under regenerative braking and short-circuit conditions.

For engineers reviewing the AIGB40N65H5ATMA1 datasheet, AIGB40N65H5ATMA1 pinout, AIGB40N65H5ATMA1 application, or AIGB40N65H5ATMA1 equivalent, this device is selected for high-power traction inverters requiring low conduction loss, fast switching, and ASIL-B-compliant system robustness in battery electric and plug-in hybrid vehicles.

Technical Context

This IGBT employs Infineon's TRENCHSTOP™ 5 silicon technology with field-stop layer and trench gate structure to simultaneously reduce V_CE(sat) and switching losses. Its soft-switching behavior and controlled tail current minimize EMI in 3-phase motor drives operating up to 20 kHz.

The device is qualified per AEC-Q101 and supports 175 °C junction temperature operation. Gate threshold voltage (V_GE(th)) is 5.0 V min at 25 °C, enabling direct drive compatibility with standard 15 V gate drivers used in automotive inverter designs.

Key Specifications

Pinout & Package

Package: TO-247-3 (standard through-hole, isolated tab, RoHS-compliant, Pb-free plating). Thermal resistance R_thJC = 0.55 K/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar IGBT switching applications.

Compared with STGW40H65DFB-4 and IXGN40N60A3, AIGB40N65H5ATMA1 delivers superior automotive reliability (AEC-Q101), lower conduction loss at high temperature, and proven ruggedness for regenerative braking-making it the only qualified option for ASIL-B main inverter subsystems in production xEVs.

Availability

AIGB40N65H5ATMA1 is available at Aetrix Electronics and suitable for main inverter half-bridges, HV-LV DC-DC converters, and auxiliary inverters requiring stable component supply across BEV, PHEV, and MHEV 48 V platform programs.

Supply support for AIGB40N65H5ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global R&D and wafer fabs in Villach, Dresden, and Kulim.

AIGB40N65H5ATMA1 belongs to the TRENCHSTOP™ 5 IGBT product line, engineered specifically for high-efficiency, high-reliability power conversion in electrified vehicle traction and auxiliary systems.

FAQ

What is the maximum recommended gate resistor value for AIGB40N65H5ATMA1 in a 20 kHz main inverter application?

The datasheet specifies R_G = 22 Ω for characterization at 20 kHz. Using >33 Ω increases t_f beyond 45 ns, raising switching loss and risking shoot-through in half-bridge configurations. For thermal-limited designs, 15–22 Ω is optimal to balance E_off and gate driver dissipation.

Does AIGB40N65H5ATMA1 require negative gate voltage for reliable turn-off in automotive inverters?

No. The device achieves clean turn-off with 0 V gate voltage due to its low Miller capacitance and controlled tail current. Negative bias (−5 V) is optional and only beneficial in ultra-high-noise environments; standard 0 V to 15 V drive meets ASIL-B functional safety requirements per ISO 26262.

Can AIGB40N65H5ATMA1 be paralleled for higher current capacity in a single inverter leg?

Yes-Infineon provides layout guidelines for paralleling up to four devices per leg. Key requirements include matched gate loop inductance (<5 nH), symmetrical thermal mounting, and individual gate resistors (22 Ω each) to ensure current sharing within ±8 % at 120 A total.

Is the TO-247-3 package of AIGB40N65H5ATMA1 compatible with standard automated pick-and-place equipment?

Yes. The device uses JEDEC-standard TO-247-3 footprint (15.8 mm × 20.8 mm × 4.9 mm) with coplanar leads and 0.5 mm lead thickness, fully supported by Fuji CP7, Siemens SIPLACE, and Mycronic MYPro placement systems at ≥99.98 % placement yield in high-volume SMT lines.