STMicroelectronics STGD3NB60SDT4
- Part No.:
- STGD3NB60SDT4
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
STGD3NB60SDT4.pdf
- Description:
- IGBT 600V 6A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,747
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Product details
Overview
STGD3NB60SDT4 from STMicroelectronics is an N-channel 600 V, 3 A (continuous at TC = 100 °C) PowerMESH™ IGBT in DPAK (TO-252) package with integrated freewheeling diode, optimized for low-frequency (<1 kHz) motor control and static relay applications, featuring VCE(sat) = 1.2 V (typ.) at IC = 3 A and VGE = 15 V.
For engineers reviewing the STGD3NB60SDT4 datasheet, STGD3NB60SDT4 pinout, STGD3NB60SDT4 application, or STGD3NB60SDT4 equivalent, key selection criteria include confirmed 600 V blocking capability, integrated diode reverse recovery parameters (trr = 1700 ns, Qrr = 4500 nC at Tj = 125 °C), thermal resistance Rthj-case = 3.125 °C/W, and gate charge QG = 18 nC under 480 V/3 A switching conditions.
Technical Context
This IGBT employs ST's patented PowerMESH™ strip layout to minimize conduction losses while maintaining robust short-circuit ruggedness. Its "S" suffix denotes optimization for low VCE(sat) in <1 kHz switching, with tail current included in off-loss specification per JEDEC standard.
The integrated diode enables self-contained half-bridge operation in inductive loads; its reverse recovery behavior (IRRM = 9.5 A, trr = 1700 ns at di/dt = 100 A/µs) directly impacts turn-off loss and snubber design in motor drive circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCE(sat) | 1.2 V (typ.) at IC = 3 A, VGE = 15 V - defines conduction loss in linear region for thermal sizing |
| VCES | 600 V - maximum DC blocking voltage before avalanche breakdown |
| IC (cont.) | 3 A at TC = 100 °C - continuous safe operating current under heatsink-limited thermal condition |
| QG | 18 nC at VCE = 480 V, IC = 3 A - determines gate driver power and switching speed trade-off |
| Rthj-case | 3.125 °C/W - junction-to-case thermal resistance used to calculate ΔTj under steady-state power dissipation |
| trr | 1700 ns at IF = 3 A, VR = 200 V, Tj = 125 °C - critical for snubber sizing and EMI in inductive turn-off |
| Eoff | 1.15 mJ at VCC = 480 V, IC = 3 A, Tj = 25 °C - quantifies energy dissipated during turn-off, including tail current contribution |
Pinout & Package
Package: DPAK (TO-252), surface-mount, single-ended heat sink interface via exposed drain pad (Pin 2). Thermal pad electrically connected to collector.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Voltage-driven terminal requiring 15 V nominal drive; gate threshold VGE(th) = 2.5–4.5 V |
| 2 (Collector) | High-side power output | Connected to exposed thermal pad; carries full load current and dissipates heat to PCB copper |
| 3 (Emitter) | Power return / reference | Common node for gate drive return and load current path; referenced to driver ground |
Key Features
| Feature | Design Value |
|---|---|
| Integrated freewheeling diode | Enables compact inductive load switching without external diode; characterized with trr = 1700 ns and Qrr = 4500 nC |
| Low VCE(sat) | 1.2 V (typ.) at 3 A reduces conduction loss by >30% vs. comparable 600 V IGBTs, lowering heatsink requirements |
| PowerMESH™ strip layout | Patented cell structure delivering high current density (6 A pulsed) and stable SOA up to 175 °C junction |
| High input impedance | Voltage-controlled gate eliminates continuous base drive current, simplifying driver design and reducing quiescent power |
| Tail-current-inclusive Eoff | 1.15 mJ (25 °C) and 1.8 mJ (125 °C) reflect total turn-off loss per JEDEC standard, enabling accurate thermal modeling |
Applications
| Motor Control | Gas Discharge Lamp Ballast |
|---|---|
Use Scenario: Single-phase AC induction motor soft-start and speed regulation in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: High-side switch in half-bridge topology controlling mains-connected inductive load at <1 kHz PWM frequency. Use Value: Low VCE(sat) minimizes conduction loss at 3 A RMS, while integrated diode eliminates external flyback component count and layout area. | Use Scenario: High-voltage AC lamp ignition and current regulation in fluorescent and HID lighting systems. IC Role / Device Role / Timing Role: Main switching element in resonant inverter stage, handling 600 V peak line-referred voltages and 3 A lamp current. Use Value: 600 V VCES rating ensures margin over 400 V rectified mains; low switching loss (Eoff = 1.15 mJ) maintains efficiency at 20–50 kHz ballast frequencies. |
| Static Relay | Industrial Heater Control |
Use Scenario: Solid-state replacement for electromechanical relays in PLC output modules and building automation controllers. IC Role / Device Role / Timing Role: Zero-crossing–triggered or phase-angle–controlled switch isolating 230 V AC loads with no moving parts. Use Value: Integrated diode supports bidirectional current flow during zero-crossing commutation; 175 °C max Tj enables operation in sealed enclosures without forced air cooling. | Use Scenario: Phase-controlled power delivery to resistive heating elements in ovens, dryers, and process equipment. IC Role / Device Role / Timing Role: Line-synchronized switching device operating at 50/60 Hz with duty cycle modulation. Use Value: Confirmed 3 A continuous current at 100 °C case temperature allows direct mounting on aluminum chassis without additional heatsink, reducing BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRG4PH40KD-EP | VCE(sat) = 1.7 V (typ.) at 3 A; higher QG = 34 nC; TO-220FP package | Larger footprint and higher conduction loss; requires larger heatsink for same thermal budget | Prefer when legacy TO-220 footprint compatibility is required and higher VCE(sat) is acceptable |
| FGA25N120ANTD | VCE(sat) = 2.2 V (typ.) at 3 A; 1200 V rating; TO-3P package; no integrated diode | Higher voltage rating unnecessary for 230/400 V AC applications; external diode adds complexity and cost | Only select if system requires >600 V blocking or uses discrete diode architecture for thermal separation |
Compared with IRG4PH40KD-EP and FGA25N120ANTD, STGD3NB60SDT4 delivers lowest conduction loss and smallest PCB footprint among DPAK-packaged 600 V IGBTs with integrated diode, making it optimal for space-constrained, thermally sensitive motor and relay designs.
Availability
STGD3NB60SDT4 is available at Aetrix Electronics and suitable for motor control, gas discharge lamp ballasts, and static relay applications requiring stable component supply, long-term industrial lifecycle support, and traceable manufacturing origin.
Supply support for STGD3NB60SDT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
STGD3NB60SDT4 belongs to the PowerMESH™ IGBT product line, engineered specifically for high-efficiency, low-frequency (<1 kHz) power switching in motor drives, lighting, and solid-state relay systems where low VCE(sat) and integrated diode functionality are critical.
FAQ
What is the maximum continuous collector current at 100 °C case temperature?
The STGD3NB60SDT4 supports 3 A continuous collector current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This rating assumes proper PCB copper area for thermal conduction from the exposed drain pad (Pin 2) and accounts for derating beyond 25 °C using the 0.32 W/°C factor.
Does the integrated diode support bidirectional conduction in AC applications?
Yes-the integrated freewheeling diode conducts forward current up to 3 A (continuous) and 25 A (pulsed), enabling use in AC phase-control and zero-crossing switching. Its reverse recovery characteristics (trr = 1700 ns, Qrr = 4500 nC at 125 °C) are fully characterized and must be considered in snubber design for reliable commutation.
Is STGD3NB60SDT4 suitable for 20 kHz switching in lamp ballasts?
Yes-though optimized for <1 kHz, its switching performance (Eon = 1100 µJ, Eoff = 1.15 mJ at 25 °C) supports 20–50 kHz operation in resonant lamp ballasts. However, thermal design must account for increased switching loss at higher frequencies; derating to ≤2 A average current is recommended above 10 kHz.
What is the gate threshold voltage range and how does it affect drive design?
VGE(th) is 2.5–4.5 V at IC = 250 µA. This wide range necessitates a minimum 12 V gate drive to ensure full enhancement across temperature and process variation. A 15 V drive is recommended to maintain low VCE(sat) and avoid partial turn-on during transients or noise coupling.
STGD3NB60SDT4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- PowerMESH™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 6 A
- Current - Collector Pulsed (Icm):
- 25 A
- Vce(on) (Max) @ Vge, Ic:
- 1.5V @ 15V, 3A
- Power - Max:
- 48 W
- Switching Energy:
- 1.15mJ (off)
- Input Type:
- Standard
- Gate Charge:
- 18 nC
- Td (on/off) @ 25°C:
- 125µs/-
- Test Condition:
- 480V, 3A, 1kOhm, 15V
- Reverse Recovery Time (trr):
- 1.7 µs
- Operating Temperature:
- 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
STGD3NB60SDT4 FAQ
1.How can I place an order for STGD3NB60SDT4 through Aetrix?
Please submit a Request for Quotation (RFQ) for STGD3NB60SDT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGD3NB60SDT4 reliable?
The price and inventory of STGD3NB60SDT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGD3NB60SDT4 is usually 5 days.
3.What payment methods are accepted for STGD3NB60SDT4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGD3NB60SDT4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGD3NB60SDT4?
STGD3NB60SDT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGD3NB60SDT4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGD3NB60SDT4?
For technical support, including STGD3NB60SDT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGD3NB60SDT4 requirements.
6.How does Aetrix verify that STGD3NB60SDT4 is sourced from the original manufacturer or authorized distributors?
All STGD3NB60SDT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGD3NB60SDT4 meets industry standards.
7.What is the process for return or replacement of STGD3NB60SDT4?
All STGD3NB60SDT4 units undergo pre-shipment inspection (PSI). If there is an issue with STGD3NB60SDT4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGD3NB60SDT4 part is unused and in its original packaging.
Return procedure for STGD3NB60SDT4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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