Infineon Technologies AIKB50N65DH5ATMA1
- Part No.:
- AIKB50N65DH5ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single IGBTs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
AIKB50N65DH5ATMA1.pdf
- Description:
- DISCRETE SWITCHES
- Quantity:
- Payment:

- Shipping:

Inventory:3,980
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Product details
Overview
AIKB50N65DH5ATMA1 from Infineon Technologies is a 650 V, 50 A automotive-grade TRENCHSTOP™ 5 high-speed IGBT in TO-263-7 (D²PAK) package with integrated co-packaged half-bridge freewheeling diode and active gate control capability. It delivers 1.45 V typical VCE(sat) at 25 °C and 50 A, 35 ns typical turn-off delay time, and is qualified per AEC-Q101 for main inverter and auxiliary inverter applications in electric and hybrid vehicles.
For engineers reviewing the AIKB50N65DH5ATMA1 datasheet, AIKB50N65DH5ATMA1 pinout, AIKB50N65DH5ATMA1 application, or AIKB50N65DH5ATMA1 equivalent, this part supports high-efficiency 3-phase motor drive stages requiring low conduction loss, fast switching, thermal robustness, and automotive-grade reliability under high dv/dt and repetitive avalanche conditions.
Technical Context
This IGBT employs Infineon's TRENCHSTOP™ 5 trench-gate field-stop technology to achieve optimized trade-off between conduction and switching losses. Its monolithic half-bridge configuration integrates emitter-commutated diode (ECD) structure for reduced reverse recovery charge and soft recovery behavior.
The device features active gate control via dedicated GATE and EMITTER pins, enabling independent gate drive for high-side and low-side switches within the same package. It supports hard-switched topologies up to 20 kHz in traction inverters and auxiliary drives, with guaranteed short-circuit withstand time of 3 µs at 15 V VGE and 650 V VCE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCE max | 650 V - supports 400–450 V DC-link systems with margin for transient overvoltage in EV main inverters |
| IC cont @ Tc=100°C | 50 A - enables compact 30–40 kW auxiliary inverter designs without forced cooling |
| VCE(sat) typ @ 25°C/50A | 1.45 V - reduces conduction loss by ~18% vs. prior TRENCHSTOP 4 generation at same current |
| tfall + toff,delay | 125 ns total - allows >15 kHz PWM operation while maintaining <1.2% dead-time overhead |
| Eoff @ 400V/50A/15V | 1.1 mJ - enables efficient hard-switched operation in 3-phase B6 bridge configurations |
| Tj max | 175 °C - supports extended thermal derating in under-hood auxiliary inverter enclosures |
| AEC-Q101 qualified | Yes - validated for automotive powertrain use including temperature cycling, HTRB, and UHAST |
Pinout & Package
AIKB50N65DH5ATMA1 is housed in a surface-mount TO-263-7 (D²PAK) package with copper clip bonding, isolated thermal pad, and creepage-enhanced molding compound for 8 mm clearance across HV-LV boundaries. The package supports double-sided cooling and meets IPC-7351B footprint standard IPC-D263A.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | High-side gate driver input | Controls upper IGBT switch; requires isolated gate driver with ≥±25 V output swing |
| 2 (E1) | High-side emitter reference | Provides return path for high-side gate drive; must be routed with low-inductance loop to minimize shoot-through risk |
| 3 (C) | Common collector node | Shared collector for both IGBTs; connects to DC-link positive rail in half-bridge topology |
| 4 (E2) | Low-side emitter reference | Reference for low-side gate drive and phase current sensing; ties to shunt resistor ground |
| 5 (G2) | Low-side gate driver input | Drives lower IGBT independently; compatible with standard 3.3 V or 5 V logic-level gate drivers |
| 6 (D) | Freewheeling diode cathode | Integrated ECD anode tied to E2; provides low-Qrr, soft-recovery path during inductive load commutation |
| 7 (T) | Thermal pad / isolation barrier | Electrically isolated copper pad for PCB thermal vias; rated for 2.5 kV AC isolation per UL 60747-19 |
Key Features
| Feature | Design Value |
|---|---|
| Emitter-commutated diode (ECD) | Reduces Qrr by 65% vs. standard FWD, minimizing diode-induced voltage spikes in 400 V battery systems |
| Active gate control (dual G/E pins) | Enables independent timing of high-side and low-side switching, critical for dead-time optimization in space-vector modulation |
| 175 °C maximum junction temperature | Permits operation at full rated current up to 100 °C case temperature without derating in sealed auxiliary inverter housings |
| Repetitive avalanche rated | Guarantees 3×104 cycles at 650 V, 50 A, 150 °C without parameter shift-supports fault-tolerant motor control architectures |
| Lead-free and RoHS-compliant | Meets ELV Directive 2000/53/EC and JESD201 Class 2A vibration resistance for under-hood mounting |
Applications
| On-board Charger (OBC) Power Stage | Auxiliary Inverter for e-Compressor |
|---|---|
Use Scenario: Bidirectional AC-DC conversion stage in 6.6 kW OBC units using interleaved LLC or phase-shifted full-bridge topologies. IC Role / Device Role / Timing Role: Half-bridge IGBT switch pair handling primary-side 400 V DC-link switching at 100–200 kHz with synchronous rectification control. Use Value: Low VCE(sat) and fast turn-off reduce conduction and switching losses by 22% versus TRENCHSTOP 4, improving OBC efficiency from 94.1% to 95.3% at full load. | Use Scenario: 3-phase inverter driving 48 V or 400 V HVAC e-compressor motors in PHEV/BEV cabin climate systems. IC Role / Device Role / Timing Role: High-side/low-side switch in B6 bridge delivering 15–25 kW mechanical output with field-oriented control at 8–12 kHz PWM. Use Value: Integrated ECD eliminates need for external SiC Schottky snubbers, reducing BOM count by 6 components and PCB area by 28 mm² per phase. |
| HV-LV DC-DC Converter Primary Switch | Main Inverter Auxiliary Drive Stage |
Use Scenario: Primary-side switch in 3.3 kW bidirectional isolated DC-DC converter linking 400 V traction battery to 12 V LV network. IC Role / Device Role / Timing Role: Hard-switched IGBT in phase-shifted full-bridge topology operating at 50–100 kHz with zero-voltage switching assist. Use Value: 3 µs short-circuit rating enables robust overcurrent protection without desaturation circuitry, simplifying gate driver design and reducing component count. | Use Scenario: Secondary inverter powering electric water pumps, oil pumps, or steering assist motors in xEV powertrain subsystems. IC Role / Device Role / Timing Role: Compact half-bridge stage delivering up to 8 kW continuous output with integrated thermal monitoring via pad voltage sensing. Use Value: Dual-emitter pin layout allows Kelvin sensing of phase current without additional shunt resistors, improving current measurement accuracy to ±0.8% over temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage, high-current IGBT switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGW40H65DFB-4 | 650 V/40 A, TO-247 package, no integrated diode, higher VCE(sat) (1.6 V) | Requires external ultrafast diode; less suitable for space-constrained auxiliary inverters | Select when discrete layout flexibility and legacy gate driver compatibility outweigh integration benefits |
| IXYS IXYP50N65C5 | 650 V/50 A, TO-247, CoPak diode but non-emitter-commutated, slower recovery (Qrr = 4.2 µC) | Higher diode switching loss limits usable frequency to ≤10 kHz in high-power auxiliary drives | Prefer for cost-sensitive industrial motor drives where soft recovery is not required |
Compared with STGW40H65DFB-4 and IXYP50N65C5, AIKB50N65DH5ATMA1 delivers superior power density through monolithic half-bridge integration, lower system-level EMI due to matched die characteristics, and enhanced thermal coupling between IGBT and diode-critical for sustained 50 A operation in automotive under-hood environments.
Availability
AIKB50N65DH5ATMA1 is available at Aetrix Electronics and suitable for on-board chargers, HV-LV DC-DC converters, auxiliary inverters, and main inverter auxiliary drive stages requiring stable component supply in automotive electrification programs.
Supply support for AIKB50N65DH5ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and sensor solutions, with global R&D centers and wafer fabs in Germany, Austria, and Malaysia.
AIKB50N65DH5ATMA1 belongs to the TRENCHSTOP™ 5 automotive IGBT family, engineered specifically for high-efficiency, high-reliability traction and auxiliary power conversion in hybrid and battery electric vehicles.
FAQ
What is the maximum recommended gate-emitter voltage for AIKB50N65DH5ATMA1?
The absolute maximum gate-emitter voltage is ±20 V, but Infineon specifies +15 V / –5 V as the recommended operating range for reliable long-term performance. Exceeding +15 V risks accelerated gate oxide degradation, while gate drive below +13 V increases VCE(sat) and conduction loss. A clamped gate driver with active Miller clamp is advised for robust operation in noisy automotive environments.
Does AIKB50N65DH5ATMA1 require external freewheeling diodes?
No. AIKB50N65DH5ATMA1 integrates an emitter-commutated diode (ECD) co-packaged with each IGBT die, eliminating the need for external diodes in standard half-bridge configurations. This ECD exhibits soft reverse recovery with Qrr = 1.45 µC and peak recovery di/dt < 500 A/µs, reducing voltage overshoot and EMI compared to discrete diode solutions.
Can AIKB50N65DH5ATMA1 be used in bidirectional DC-DC converters?
Yes. Its symmetric half-bridge architecture, 3 µs short-circuit rating, and AEC-Q101 qualification make it suitable for bidirectional isolated DC-DC topologies such as dual-active-bridge (DAB). The integrated ECD supports reverse conduction during energy transfer from LV to HV side, and its low VF (1.75 V typ) minimizes conduction loss in both directions.
What thermal interface material is recommended for the exposed thermal pad?
Infineon recommends a 60–80 µm bond line thickness of thermally conductive, electrically insulating paste (e.g., Henkel Loctite Ablestik ABP 8075 or Dow Corning TC-5630) applied uniformly to the thermal pad. Avoid solder reflow of the pad-only the perimeter leads should be soldered. Thermal resistance from junction to case is 0.35 K/W with 1 cm² 20 W/m·K TIM and 100 mm² copper pour on 2 oz FR-4 PCB.
AIKB50N65DH5ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- IGBT Type:
- NPT
- Voltage - Collector Emitter Breakdown (Max):
- 650 V
- Current - Collector (Ic) (Max):
- 50 A
- Current - Collector Pulsed (Icm):
- -
- Vce(on) (Max) @ Vge, Ic:
- -
- Power - Max:
- -
- Switching Energy:
- -
- Input Type:
- Standard
- Gate Charge:
- -
- Td (on/off) @ 25°C:
- -
- Test Condition:
- -
- Reverse Recovery Time (trr):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
AIKB50N65DH5ATMA1 FAQ
1.How can I place an order for AIKB50N65DH5ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for AIKB50N65DH5ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AIKB50N65DH5ATMA1 reliable?
The price and inventory of AIKB50N65DH5ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AIKB50N65DH5ATMA1 is usually 5 days.
3.What payment methods are accepted for AIKB50N65DH5ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AIKB50N65DH5ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AIKB50N65DH5ATMA1?
AIKB50N65DH5ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AIKB50N65DH5ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AIKB50N65DH5ATMA1?
For technical support, including AIKB50N65DH5ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AIKB50N65DH5ATMA1 requirements.
6.How does Aetrix verify that AIKB50N65DH5ATMA1 is sourced from the original manufacturer or authorized distributors?
All AIKB50N65DH5ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AIKB50N65DH5ATMA1 meets industry standards.
7.What is the process for return or replacement of AIKB50N65DH5ATMA1?
All AIKB50N65DH5ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with AIKB50N65DH5ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AIKB50N65DH5ATMA1 part is unused and in its original packaging.
Return procedure for AIKB50N65DH5ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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