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Texas Instruments BQ500101DPCR
- Part No.:
- BQ500101DPCR
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
BQ500101DPCR.pdf
- Description:
- IC HALF BRIDGE DRIVER 10A 8VSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,478
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Product details
Overview
BQ500101DPCR from Texas Instruments is a NexFET™ power stage IC optimized for wireless power transmitter applications, functioning as a synchronous buck gate driver with integrated high- and low-side MOSFETs. It delivers 98% system efficiency at 5 A, supports up to 10 A continuous / 15 A peak VSW current, operates at switching frequencies up to 600 kHz, and targets WPC v1.2-compliant 15-W transmitters.
For engineers reviewing the BQ500101DPCR datasheet, BQ500101DPCR pinout, BQ500101DPCR application, or BQ500101DPCR equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and electrical specifications, and real-world design guidance for Qi-compliant wireless power systems requiring high-density, low-loss power stages.
Technical Context
The BQ500101DPCR integrates a dual-MOSFET power stage with optimized gate drivers, shoot-through protection, and an integrated bootstrap diode-enabling direct PWM control without external level-shifting circuitry. Its architecture supports both fixed- and variable-frequency coil drivers in WPC v1.2 transmitters, with rail voltage control capability for medium-power (15-W) topologies.
It features undervoltage lockout (UVLO) with 4.15 V turn-on and 3.7 V turn-off thresholds, 3.3-V/5-V PWM-compatible tri-state input logic, and thermal management via ultra-low-inductance VSON-CLIP (DPC) package with exposed thermal pad. System-level performance is characterized by measured power loss curves-not just RDS(on)-across load, temperature, frequency, and inductance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous VSW Current | 10 A at VIN = 10 V, VDD = 5 V, fSW = 130 kHz, LSW = 6 µH - defines maximum sustained output drive capability in Qi transmitter coil driver or rail control stage |
| Peak VSW Current | 15 A - supports transient surge handling during startup or fault recovery in wireless power transmitters |
| Switching Frequency | Up to 600 kHz - enables compact magnetics and high-efficiency operation in space-constrained 15-W transmitter designs |
| System Efficiency | 98% at 5 A - measured under typical WPC v1.2 operating conditions, reducing thermal load and improving power density |
| Power Loss | 0.53 W at ISW = 5 A, TJ = 25°C - quantifies total device dissipation including conduction, switching, and gate drive losses |
| Input Voltage Range | Up to 24 V - accommodates wide-input DC bus architectures common in multi-standard wireless chargers |
| UVLO Threshold | 4.15 V (rising), 3.7 V (falling) - ensures robust start-up and shutdown sequencing in noisy automotive or industrial power environments |
Pinout & Package
The BQ500101DPCR uses a VSON-CLIP (DPC) 8-pin package with 3.5 mm × 4.5 mm body size, ultra-low inductance layout, and exposed thermal pad for enhanced PCB heat transfer. Pin 9 is the thermal pad (PGND-connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | VDD | Gate driver supply input (4.5–5.5 V); must be bypassed with ≥1 µF ceramic capacitor to PGND for stable high-speed switching |
| 3, 9 | PGND | Power ground return for FET sources and internal drivers; electrically tied to thermal pad for optimal thermal path |
| 4 | VSW | Switching node connection to inductor; carries full AC current and high dv/dt - requires minimal trace length and tight loop area |
| 5 | VIN | Main input supply (up to 24 V); connects to bulk capacitors placed adjacent to pins 3/5/9 to minimize input loop inductance |
| 6 | BOOT_R | Bootstrap return node; internally connected to VSW - forms low-impedance return path for bootstrap capacitor charge/discharge |
| 7 | BOOT | Bootstrap supply node; connects to CBOOT (0.1 µF, 16 V X5R) between BOOT and BOOT_R to drive high-side FET gate |
| 8 | PWM | Tri-state PWM input (3.3/5 V compatible); logic high drives Control FET on/Sync FET off, logic low reverses, open/high-Z disables both |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diode | Eliminates external bootstrap diode, reducing BOM count and PCB footprint while maintaining reliable high-side gate drive |
| Shoot-Through Protection | Hardware-level dead-time enforcement prevents simultaneous high- and low-side FET conduction, avoiding destructive shoot-through current |
| System-Optimized PCB Footprint | Minimizes high-current loop area and parasitic inductance - critical for EMI control and stability at >10 kV/µs dv/dt |
| RoHS Compliant & Halogen Free | Meets global environmental compliance requirements for industrial, medical, and consumer wireless charging equipment |
| Optimized for 15-W Wireless Power | Parametrically tuned FETs and gate drivers deliver lowest system-level power loss in WPC v1.2 medium-power transmitter reference designs |
Applications
| WPC v1.2 15-W Transmitter | Proprietary Multi-Coil Charger |
|---|---|
Use Scenario: Qi-certified desktop wireless charging pad delivering 15 W to smartphones and wearables using fixed-frequency resonant topology. IC Role / Device Role / Timing Role: Serves as primary coil driver power stage, converting regulated DC bus to high-frequency AC for magnetic coupling; synchronized to controller's PWM signal. Use Value: Enables 98% efficiency at 5 A load, reducing thermal rise and allowing fanless enclosure design while meeting WPC v1.2 EMI limits. |
Use Scenario: Industrial handheld tool charger with dual-coil alignment flexibility and foreign object detection (FOD) support. IC Role / Device Role / Timing Role: Functions as rail voltage regulator in variable-frequency transmitter, dynamically adjusting coil drive amplitude based on load and position feedback. Use Value: High-frequency capability (up to 600 kHz) allows rapid modulation for precise FOD sensing and adaptive power control without sacrificing efficiency. |
| Medical Device Wireless Power | Automotive In-Car Transmitter |
Use Scenario: Cordless surgical instrument docking station requiring isolated, low-noise, and thermally robust power delivery in sterile environments. IC Role / Device Role / Timing Role: Acts as isolated secondary-side power stage in galvanically separated transmitter, driven by opto-isolated PWM signal. Use Value: Ultra-low package inductance and integrated shoot-through protection ensure clean switching waveforms critical for EMI-sensitive medical EMC compliance. |
Use Scenario: Integrated center console wireless charger supporting fast-charging protocols across multiple vehicle platforms. IC Role / Device Role / Timing Role: Implements rail voltage control for multi-standard (Qi + PMA) compatibility, adapting switching behavior per protocol negotiation. Use Value: Wide VIN range (up to 24 V) and -40°C to +125°C operating temperature enable direct integration into automotive 12-V battery-fed systems without intermediate regulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP8765GQ-Z (Monolithic Power Systems) | Single-channel 12-V input, 10-A rated buck converter with integrated inductor; lacks tri-state PWM interface and bootstrap integration | Targeted at simpler DC-DC conversion, not wireless power coil driving; no VSW node access or shoot-through protection | Select when board space permits integrated inductor and system does not require direct coil driver control or WPC compliance |
| LM5113SDX/NOPB (Texas Instruments) | High-speed dual gate driver (no FETs); supports 100-V high-side, 5-MHz max frequency; requires external MOSFETs and bootstrap diode | Used in custom high-voltage or high-frequency buck/boost stages where discrete FET selection is required for thermal or reliability optimization | Select when design demands independent FET selection, higher voltage rating (>24 V), or operation beyond 600 kHz switching frequency |
Compared with MP8765GQ-Z and LM5113SDX/NOPB, the BQ500101DPCR uniquely combines integrated FETs, tri-state PWM control, and WPC-optimized efficiency in a single 3.5 × 4.5 mm package-reducing component count, layout complexity, and validation effort specifically for 15-W wireless power transmitters.
Availability
BQ500101DPCR is available at Aetrix Electronics and suitable for WPC-compliant wireless charging pads, proprietary multi-coil transmitters, and medical-grade cordless docking stations requiring stable component supply, long-term lifecycle support, and RoHS/halogen-free compliance.
Supply support for BQ500101DPCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless technologies, with leadership in power management and high-reliability industrial solutions.
The BQ500101DPCR belongs to TI's NexFET™ power stage product line, engineered specifically for high-efficiency, high-density wireless power transmitter designs targeting WPC v1.2 medium-power (15-W) specifications.
FAQ
What is the maximum continuous current rating for the BQ500101DPCR?
The BQ500101DPCR is rated for 10 A continuous VSW current under recommended operating conditions: VIN = 10 V, VDD = 5 V, duty cycle = 50%, fSW = 130 kHz, and LSW = 6 µH at TA = 25°C. This rating is validated by TI's system-level power loss measurements-not extrapolated from RDS(on). The BQ500101DPCR also supports 15 A peak current for short-duration transients.
Does the BQ500101DPCR require an external bootstrap diode?
No, the BQ500101DPCR integrates a bootstrap switch (FET-based) between VDD and BOOT, eliminating the need for an external bootstrap diode. The BOOT_R pin is internally connected to VSW, forming a complete bootstrap circuit with only an external 0.1 µF ceramic capacitor (CBOOT) required between BOOT and BOOT_R. This reduces component count and improves reliability in wireless power applications.
What is the purpose of the tri-state PWM input on the BQ500101DPCR?
The tri-state PWM input (Pin 8) allows three operational states: logic high (Control FET on, Sync FET off), logic low (Control FET off, Sync FET on), and high-impedance/open (both FETs off after t3HT timeout). This enables precise dead-time control, safe startup/shutdown sequencing, and fault-handling capability-critical for preventing shoot-through and ensuring robust operation in WPC v1.2 transmitters. The BQ500101DPCR implements hardware-enforced dead time without external timing components.
Can the BQ500101DPCR be used outside of wireless power applications?
Yes-the BQ500101DPCR is explicitly documented by TI for synchronous buck applications beyond wireless power, including general-purpose high-efficiency DC-DC conversion. Its 24-V input rating, 10-A continuous current, and 600-kHz switching capability make it suitable for industrial motor drives, LED drivers, and point-of-load regulators where compact size and low loss are prioritized. However, its pinout and feature set remain optimized for coil driver and rail control roles found in BQ500101DPCR-based transmitter designs.
What thermal management considerations apply to the BQ500101DPCR?
The BQ500101DPCR relies on its exposed thermal pad (Pin 9) for primary heat dissipation, with RθJB = 2.5–5°C/W to the PCB. Designers must use ≥6 thermal vias (10-mil drill, 16-mil pad, tented) under the pad, connect to inner-layer GND planes, and maintain minimum 1-inch² copper area. TI's SOA curves assume a 4" × 3.5" × 0.062" 6-layer board; derating is required for smaller or lower-copper-thickness layouts. The BQ500101DPCR junction temperature must not exceed 150°C.
BQ500101DPCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 10A
- Current - Peak Output:
- 15A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 24V (Max)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
BQ500101DPCR FAQ
1.How can I place an order for BQ500101DPCR through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ500101DPCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ500101DPCR reliable?
The price and inventory of BQ500101DPCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ500101DPCR is usually 5 days.
3.What payment methods are accepted for BQ500101DPCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ500101DPCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ500101DPCR?
BQ500101DPCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ500101DPCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ500101DPCR?
For technical support, including BQ500101DPCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ500101DPCR requirements.
6.How does Aetrix verify that BQ500101DPCR is sourced from the original manufacturer or authorized distributors?
All BQ500101DPCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ500101DPCR meets industry standards.
7.What is the process for return or replacement of BQ500101DPCR?
All BQ500101DPCR units undergo pre-shipment inspection (PSI). If there is an issue with BQ500101DPCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ500101DPCR part is unused and in its original packaging.
Return procedure for BQ500101DPCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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