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Texas Instruments BQ500101DPCT
- Part No.:
- BQ500101DPCT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
BQ500101DPCT.pdf
- Description:
- IC HALF BRIDGE DRIVER 10A 8VSON
- Quantity:
- Payment:
- Shipping:
Inventory:200
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Product details
Overview
BQ500101DPCT from Texas Instruments is a NexFET™ power stage IC optimized for WPC v1.2-compliant 15-W wireless power transmitters, functioning as a synchronous buck switching stage with integrated high- and low-side MOSFETs, gate drivers, and bootstrap diode. It delivers 98% system efficiency at 5 A, supports up to 10 A continuous / 15 A peak VSW current, and operates at input voltages up to 24 V with PWM-compatible control.
For engineers reviewing the BQ500101DPCT datasheet, BQ500101DPCT pinout, BQ500101DPCT application, or BQ500101DPCT equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and electrical specifications, real-world efficiency curves, and two rigorously cross-checked alternative parts for wireless power transmitter designs.
Technical Context
The BQ500101DPCT integrates a parametrically tuned control FET and sync FET pair with a high-speed gate driver, enabling operation up to 600 kHz switching frequency and supporting both fixed- and variable-frequency wireless power topologies. Its internal bootstrap switch replaces an external diode, maintaining BOOT–VSW voltage near VDD to minimize conduction loss in the high-side FET.
Undervoltage lockout (UVLO) ensures safe startup and shutdown: device enables only when VDD rises above 4.15 V and disables when VDD falls below 3.7 V, with 0.2 V hysteresis. The tri-state PWM interface accepts 3.3-V/5-V logic levels and includes shoot-through protection to prevent simultaneous FET conduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Continuous VSW Current | 10 A at VIN = 10 V, VDD = 5 V, fSW = 130 kHz, duty cycle = 50% - defines maximum sustained output capability without thermal derating |
| Peak VSW Current | 15 A - supports transient load demands in Qi-compliant transmitter burst-mode operation |
| System Efficiency | 98% at 5 A - measured under typical WPC 15-W operating conditions, directly reducing thermal load and heatsink requirements |
| Switching Frequency Range | Up to 600 kHz - enables smaller magnetics and faster dynamic response in resonant and buck-based transmitter stages |
| Input Voltage Range | 2 V to 24 V - accommodates wide-input DC rails from battery-backed or regulated supplies in portable and industrial transmitters |
| Thermal Resistance (Junction-to-Board) | 2.5 °C/W - enables direct PCB copper plane cooling, critical for compact wireless charging pads with limited airflow |
| UVLO Thresholds | VDD rising = 4.15 V, falling = 3.7 V - prevents erratic operation during brown-out or soft-start sequences |
Pinout & Package
VSON-CLIP (DPC) package, 8-pin, 3.5 mm × 4.5 mm outline with exposed thermal pad (Pin 9). Designed for low-inductance, high-current PCB routing and optimized thermal transfer via bottom-side copper fill and thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | VDD | Gate drive supply input (4.5–5.5 V); requires local 1-µF ceramic bypass to PGND for stable driver operation |
| 3, 9 | PGND | Power ground return path for high-current switching loop; must be low-impedance connection to PCB ground plane |
| 4 | VSW | Switch node connecting internal FETs to external inductor; carries full AC switching current and high dv/dt |
| 5 | VIN | Main input supply (up to 24 V); requires tight-layout ceramic capacitors (≥6×10 µF total) adjacent to minimize ringing |
| 6 | BOOT_R | Bootstrap capacitor reference; internally connected to VSW - forms low-ESR charge reservoir for high-side FET gate drive |
| 7 | BOOT | Bootstrap capacitor positive terminal; connects to CBOOT (0.1 µF, 16 V X5R) between BOOT and BOOT_R |
| 8 | PWM | Tri-state PWM input (3.3/5-V compatible); logic high drives control FET on/sync FET off, logic low reverses, open/high-Z disables both |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Switch | Replaces external bootstrap diode with low-VF FET, reducing conduction loss and improving reliability over temperature |
| Shoot-Through Protection | Hardware-level dead-time enforcement prevents simultaneous high- and low-side FET conduction, eliminating destructive shoot-through current |
| Ultra-Low Inductance Package | SON-CLIP construction minimizes source inductance (<0.5 nH), enabling clean 10 kV/µs switching edges and reduced EMI |
| System-Optimized PCB Footprint | Pre-characterized land pattern and thermal via layout reduces design iteration time for Qi-compliant 15-W transmitter boards |
| RoHS & Halogen-Free | Lead-free NiPdAu terminal plating and halogen-free molding compound meet global environmental compliance requirements |
Applications
| WPC Qi 15-W Transmitter | Proprietary Wireless Charging Pad |
|---|---|
Use Scenario: High-efficiency power stage in certified Qi v1.2 medium-power transmitter for smartphones and wearables. IC Role / Device Role / Timing Role: Synchronous buck controller driving series-resonant tank; regulates rail voltage or coil current based on receiver feedback. Use Value: 98% efficiency at 5 A reduces thermal rise by >30% vs discrete solutions, enabling fanless, slim-profile enclosures. |
Use Scenario: Custom 10–20 W wireless charger for medical IoT sensors requiring EMI-controlled operation. IC Role / Device Role / Timing Role: High-frequency (≤600 kHz) power stage enabling compact ferrite-core inductors and precise burst-mode timing control. Use Value: Integrated shoot-through protection and UVLO ensure fail-safe operation during intermittent communication gaps with proprietary receivers. |
| Industrial Wireless Power Module | Medical Equipment Charging Base |
Use Scenario: Sealed, convection-cooled transmitter module powering factory-floor tools with metal housings. IC Role / Device Role / Timing Role: Robust power stage handling 10 A continuous current under 40°C ambient with no forced airflow. Use Value: 2.5 °C/W RθJB enables direct thermal coupling to aluminum chassis, eliminating need for thermal interface materials or heatsinks. |
Use Scenario: Low-noise, safety-certified charging station for implantable device programmers and diagnostic handhelds. IC Role / Device Role / Timing Role: Isolated power stage with controlled dv/dt and integrated ESD protection (±2 kV HBM) for IEC 60601-1 compliance. Use Value: Ultra-low package inductance minimizes radiated emissions, simplifying Class B EMC pre-compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar wireless power transmitter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ5071GQ-A | Monolithic 12-V/10-A buck converter with integrated inductor; lacks VSW node access and bootstrap flexibility | Best suited for space-constrained, fixed-output DC-DC conversion-not for resonant tank driving or variable-frequency control | Select when board area is primary constraint and Qi compliance is not required |
| LM5113SD | High-speed dual gate driver (no FETs); requires external high- and low-side MOSFETs and bootstrap diode | Offers full layout and FET selection freedom but increases BOM count, layout complexity, and EMI risk | Select when custom FET optimization or >24 V operation is needed beyond BQ500101DPCT's rating |
Compared with MPQ5071GQ-A and LM5113SD, the BQ500101DPCT uniquely combines integrated NexFET silicon, bootstrap switch, and Qi-optimized efficiency curves-enabling faster time-to-prototype for 15-W WPC transmitters without compromising thermal or EMI performance.
Availability
BQ500101DPCT is available at Aetrix Electronics and suitable for WPC-compliant wireless chargers, industrial power modules, and medical equipment charging bases requiring stable component supply across production lifecycles.
Supply support for BQ500101DPCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with over 50 years of innovation in power management and signal chain solutions.
The BQ500101DPCT belongs to TI's wireless power transmitter controller product line, designed specifically to accelerate development of WPC Qi v1.2–compliant 5-W and 15-W transmitters with minimal external components and proven thermal performance.
FAQ
What is the maximum recommended junction temperature for continuous operation of the BQ500101DPCT?
The BQ500101DPCT is rated for continuous operation up to TJ = 125°C, as confirmed in Section 6.3 Recommended Operating Conditions. Thermal derating begins above this point, and the Safe Operating Area curves in the datasheet (Figure 5–6) are measured at this maximum junction temperature under defined PCB and airflow conditions.
Does the BQ500101DPCT require an external bootstrap diode?
No, the BQ500101DPCT integrates a bootstrap switch (FET) that replaces the traditional external bootstrap diode. As detailed in Section 7.3.3, this internal switch is gated by the DRVL signal and reduces forward voltage drop and leakage, improving efficiency and reliability compared to discrete diode solutions.
Can the BQ500101DPCT be used in non-wireless applications such as standard synchronous buck converters?
Yes, the BQ500101DPCT is explicitly qualified for synchronous buck applications per Section 7.1 Overview. Its 2–24 V input range, 10 A continuous current rating, and tri-state PWM interface make it suitable for general-purpose high-efficiency DC-DC conversion where its thermal and switching performance advantages apply.
What is the minimum PWM on-time specification for reliable operation of the BQ500101DPCT?
The minimum PWM on-time for the BQ500101DPCT is 40 ns, as specified in Section 6.3 Recommended Operating Conditions. This enables stable operation at high switching frequencies (up to 600 kHz) and supports precise duty-cycle control required in burst-mode wireless power regulation.
How does the BQ500101DPCT handle shoot-through prevention?
The BQ500101DPCT implements hardware-level shoot-through protection by enforcing dead time between high- and low-side FET gate signals. This is intrinsic to its gate driver architecture and does not rely on external timing circuits or controller-level delays, ensuring robust prevention even under fast PWM edge transitions.
BQ500101DPCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 10A
- Current - Peak Output:
- 15A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 24V (Max)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
BQ500101DPCT FAQ
1.How can I place an order for BQ500101DPCT through Aetrix?
Please submit a Request for Quotation (RFQ) for BQ500101DPCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BQ500101DPCT reliable?
The price and inventory of BQ500101DPCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BQ500101DPCT is usually 5 days.
3.What payment methods are accepted for BQ500101DPCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BQ500101DPCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BQ500101DPCT?
BQ500101DPCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BQ500101DPCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BQ500101DPCT?
For technical support, including BQ500101DPCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BQ500101DPCT requirements.
6.How does Aetrix verify that BQ500101DPCT is sourced from the original manufacturer or authorized distributors?
All BQ500101DPCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BQ500101DPCT meets industry standards.
7.What is the process for return or replacement of BQ500101DPCT?
All BQ500101DPCT units undergo pre-shipment inspection (PSI). If there is an issue with BQ500101DPCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BQ500101DPCT part is unused and in its original packaging.
Return procedure for BQ500101DPCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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