Texas Instruments CSD95372AQ5M
- Part No.:
- CSD95372AQ5M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerLFDFN
- Datasheet:
-
CSD95372AQ5M.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 12LSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CSD95372AQ5M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single SON 5 mm × 6 mm package. It delivers 60 A continuous output current, achieves 92.4% system efficiency at 30 A (VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz), and supports up to 2 MHz switching frequency for high-density VR12.x and VR11.x point-of-load converters in server and graphics card applications.
For engineers reviewing the CSD95372AQ5M datasheet, CSD95372AQ5M pinout, CSD95372AQ5M application, or CSD95372AQ5M equivalent, key selection considerations include tri-state PWM compatibility with 3.3 V/5 V controllers, integrated thermal analog output (TAO) for multiphase temperature monitoring, diode emulation mode with FCCM control, and ultra-low power loss of 3.3 W at 30 A under nominal conditions.
Technical Context
The CSD95372AQ5M implements a high-frequency synchronous buck power stage with integrated gate driver, HS/LS NexFET MOSFETs, and analog temperature sensing. Its functional block includes a trimmable dead-time controller optimized to prevent shoot-through, a zero-crossing comparator enabling diode emulation mode, and an internal 3.3 V LDO for TAO fault reporting.
It operates with external VDD supply (4.5–5.5 V), accepts tri-state PWM inputs with 30 ns falling propagation delay and 50 ns rising delay, and features active thermal shutdown at 150–165 °C with 25 °C hysteresis. The device requires bootstrap capacitor (≥0.1 µF X7R) between BOOT and BOOT_R and supports input voltages up to 16 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VRMs |
| Peak Output Current | 90 A for tp = 50 µs - sustains transient loads without derating in server VR applications |
| System Efficiency | 92.4% at 30 A, VIN = 12 V, VOUT = 1.2 V - reduces thermal load and improves power density in compact PCB layouts |
| Power Loss | 3.3 W at 30 A, TJ = 25°C - enables natural convection cooling in 400 LFM airflow environments |
| Switching Frequency | Up to 2000 kHz - allows smaller output inductors (e.g., 0.22 µH) and faster transient response |
| Junction-to-Board RθJB | 2 °C/W - facilitates direct thermal coupling to PCB copper planes for efficient heat spreading |
| Thermal Shutdown Threshold | 150–165 °C with 25 °C hysteresis - provides robust overtemperature protection while minimizing false trips |
Pinout & Package
Package: SON 5 mm × 6 mm, 13-pin exposed-pad surface-mount package with PGND-connected thermal pad. Optimized for low-inductance layout and high-density multiphase VRMs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PGND (13) | Power ground reference | Primary return path for high-current HS/LS switching; must be connected to large copper pour for thermal and EMI performance |
| VIN (7) | Main input voltage supply | Connects to bulk input capacitors; high di/dt node requiring short, wide traces and local ceramic decoupling |
| VSW (6) | Phase node | HS source / LS drain connection; directly interfaces with output inductor; critical for voltage slew rate and ringing control |
| VDD (5) | Gate driver supply | 4.5–5.5 V supply for internal logic and gate drivers; requires 1 µF X5R ceramic bypass to PGND |
| PWM (12) | Tri-state PWM input | Accepts 3.3 V/5 V logic; open/high-Z forces both gates low after 30 ns hold-off; supports seamless disable sequencing |
| ENABLE (3) | Global enable control | TTL-compatible input with 100 kΩ internal pull-down; asserts active-low gate discharge when disabled |
| FCCM (10) | Forced CCM/Diode Emulation mode select | Pull-high enables continuous conduction; pull-low activates zero-cross detection for light-load efficiency optimization |
| TAO/FAULT (11) | Analog temperature output / fault flag | 0.6 V @ 25°C, 8 mV/°C slope; pulled to 3.3 V during thermal shutdown; OR-wired in multiphase systems |
| BOOT (9) / BOOT_R (8) | Bootstrap supply terminals | Integrated bootstrap switch; requires ≥0.1 µF 16 V X7R cap between pins to sustain HS FET turn-on |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete gate driver layout complexity and parasitic mismatches; enables <5 ns dead-time tuning |
| Diode Emulation Mode with FCCM control | Reduces light-load power loss by disabling LS FET during reverse inductor current, improving efficiency below 10% load |
| Analog temperature output (TAO) | Provides ±2°C junction temperature accuracy without external sensors; simplifies thermal management in multi-phase VRMs |
| Tri-state PWM input with 30 ns hold-off | Enables safe, glitch-free disable/enable sequencing with external controllers; prevents shoot-through during state transitions |
| Optimized PCB footprint and ultra-low inductance | SON 5×6 mm package with exposed PGND pad minimizes loop inductance (<0.5 nH) for clean 2 MHz switching |
Applications
| Server VR12.x Voltage Regulator | Graphics Card GPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient CPU core power delivery in dual-socket rack servers with VR12.x compliance requirements. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in 3+1 phase VRM; handles full 60 A continuous per phase with 2 MHz switching for sub-100 ns load-step response. Use Value: Enables 92.4% efficiency at 30 A, reducing board-level heat density and allowing fanless or low-noise thermal solutions in dense 1U chassis. | Use Scenario: Point-of-load conversion for high-performance discrete GPUs requiring dynamic voltage scaling and rapid load transients. IC Role / Device Role / Timing Role: Multiphase buck stage delivering up to 90 A peak current per phase; synchronized via tri-state PWM to match GPU DVFS timing windows. Use Value: Diode emulation mode extends battery life in mobile workstations; TAO bus simplifies thermal throttling across 4-phase GPU VRMs. |
| Desktop VR11.x Core Supply | Memory Module DDR5 VDDQ Regulation |
Use Scenario: Compact, cost-optimized VR11.x implementation for enthusiast desktop motherboards supporting Intel Core i9 processors. IC Role / Device Role / Timing Role: Single-phase or 2-phase core supply stage operating at 1.2 V output with 500 kHz–1 MHz switching; ENABLE-controlled for power-state coordination. Use Value: SON 5×6 mm footprint saves >30% PCB area vs. discrete solutions; integrated bootstrap eliminates external diode and capacitor. | Use Scenario: High-efficiency, low-noise VDDQ regulation for DDR5 memory modules requiring tight voltage tolerance and minimal EMI. IC Role / Device Role / Timing Role: Dedicated buck stage supplying 1.25 V to DDR5 chips; leverages FCCM pin to force CCM during burst writes and DEM during idle periods. Use Value: 3.3 W power loss at 30 A reduces module temperature rise by ~8°C vs. legacy solutions, improving signal integrity and JEDEC compliance margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372AQ5MT | Same die and electrical specs; shipped in 7-inch reel (250 pcs) vs. 13-inch reel (2500 pcs); identical pinout and thermal performance | Targeted for prototyping and low-volume production; same PCB design and firmware integration | Select for evaluation, NPI, or small-batch builds where inventory turnover favors smaller reels |
| MP87653GQZ | 60 A rated, but uses different gate driver architecture; no integrated TAO output; requires external temperature monitoring; 2.5 MHz max fSW | Suitable for cost-sensitive industrial DC-DC where thermal telemetry is not required; lacks multiphase TAO OR-ing capability | Choose only if TAO functionality is unnecessary and higher switching frequency (2.5 MHz) outweighs loss and thermal monitoring trade-offs |
Compared with CSD95372AQ5MT, the CSD95372AQ5M offers identical performance with volume-optimized packaging; versus MP87653GQZ, it provides superior thermal visibility and light-load efficiency via diode emulation and analog TAO, at the cost of slightly lower max fSW.
Availability
CSD95372AQ5M is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery, desktop motherboard designs, and DDR5 memory regulation requiring stable component supply and long-term production continuity.
Supply support for CSD95372AQ5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and precision analog signal chains.
The CSD95372AQ5M belongs to TI's NexFET™ power stage product line, engineered specifically for high-current, high-frequency synchronous buck converters in computing and graphics applications where thermal performance, layout simplicity, and multiphase scalability are critical.
FAQ
What is the maximum input voltage rating for the CSD95372AQ5M?
The CSD95372AQ5M has an absolute maximum VIN-to-PGND rating of 25 V for transient conditions (<10 ns) and 16 V for continuous operation. Its recommended operating input voltage is up to 16 V, making it suitable for 12 V input systems common in server and desktop VRMs. Exceeding 16 V continuously risks exceeding safe operating area limits and accelerating wear-out mechanisms in the integrated MOSFETs.
How does the TAO pin function during thermal shutdown in the CSD95372AQ5M?
During thermal shutdown, the CSD95372AQ5M pulls the TAO pin to 3.3 V to signal fault condition. This voltage level is distinct from its normal analog temperature output (0.6 V at 25°C, 8 mV/°C slope). The internal ORing diode ensures that in multiphase configurations, only the highest-temperature CSD95372AQ5M drives the shared TAO bus, enabling centralized thermal monitoring without additional logic.
Can the CSD95372AQ5M operate with a 3.3 V PWM controller?
Yes, the CSD95372AQ5M supports 3.3 V PWM controllers. Its PWM input thresholds are VPWML = 0.7–0.9 V (low) and VPWMH = 2.3–2.7 V (high), accommodating both 3.3 V and 5 V logic families. The tri-state function remains fully operational, and propagation delays (tPDL = 30 ns, tPDH = 3 µs) are specified across the full VDD range of 4.5–5.5 V, ensuring reliable timing at either logic level.
What is the purpose of the FCCM pin on the CSD95372AQ5M?
The FCCM pin on the CSD95372AQ5M selects between forced continuous conduction mode (FCCM) and diode emulation mode (DEM). When FCCM is driven high (>2.0 V), the device operates in CCM regardless of inductor current polarity. When FCCM is pulled low (<0.8 V), zero-cross detection activates, and DEM engages after three consecutive zero-cross events-improving light-load efficiency in VR applications without external circuitry.
Is external bootstrap diode required for the CSD95372AQ5M?
No, the CSD95372AQ5M integrates the bootstrap diode internally. Only an external ceramic capacitor (≥0.1 µF, 16 V X7R) between BOOT and BOOT_R pins is required to sustain high-side FET gate drive. This eliminates discrete diode placement, reduces BOM count, and avoids reverse recovery losses associated with external Schottky diodes.
CSD95372AQ5M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerLFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Over Temperature, Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-LSON-CLIP (5x6)
CSD95372AQ5M FAQ
1.How can I place an order for CSD95372AQ5M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95372AQ5M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95372AQ5M reliable?
The price and inventory of CSD95372AQ5M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95372AQ5M is usually 5 days.
3.What payment methods are accepted for CSD95372AQ5M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95372AQ5M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95372AQ5M?
CSD95372AQ5M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95372AQ5M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95372AQ5M?
For technical support, including CSD95372AQ5M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95372AQ5M requirements.
6.How does Aetrix verify that CSD95372AQ5M is sourced from the original manufacturer or authorized distributors?
All CSD95372AQ5M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95372AQ5M meets industry standards.
7.What is the process for return or replacement of CSD95372AQ5M?
All CSD95372AQ5M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95372AQ5M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95372AQ5M part is unused and in its original packaging.
Return procedure for CSD95372AQ5M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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