Texas Instruments CSD95372BQ5MC
- Part No.:
- CSD95372BQ5MC
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD95372BQ5MC.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 12VSON
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CSD95372BQ5MC from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual Power MOSFETs in a single VSON-CLIP (DMC) package. It delivers 60-A continuous output current, achieves 93.4% system efficiency at 30 A, supports up to 1.25 MHz switching frequency, and provides bidirectional temperature-compensated current sensing - designed for high-density, high-current POL DC-DC converters in server VR12.x and CPU core power applications.
For engineers reviewing the CSD95372BQ5MC datasheet, CSD95372BQ5MC pinout, CSD95372BQ5MC application, or CSD95372BQ5MC equivalent, this page delivers verified technical context, validated pin functions, confirmed thermal and electrical specifications, real-world multiphase implementation details, and two rigorously cross-checked alternative power stages for VR12.x and high-current buck designs.
Technical Context
The CSD95372BQ5MC implements a fully integrated synchronous buck power stage with internal high-side and low-side NexFET™ MOSFETs driven by an optimized gate driver. It features tri-state PWM input compatibility with 3.3-V/5-V logic, integrated bootstrap diode, and programmable Diode Emulation Mode via FCCM pin for light-load efficiency optimization.
Current sensing is implemented via differential IOUT/REFIN interface with temperature compensation, while TAO/FAULT provides analog die temperature output (600 mV at 0°C) and fault reporting. Thermal protection includes overtemperature shutdown, high-side short detection, and overcurrent monitoring - all operating within –40°C to +125°C ambient range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VDD = 5 V, VOUT = 3.3 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU cores |
| Peak Output Current | 90 A for tp = 50 µs - sustains transient load steps without dropout in VR12.x compliance applications |
| Switching Frequency | Up to 1250 kHz - allows compact magnetics and fast transient response in space-constrained server boards |
| System Efficiency | 93.4% at 30 A, VIN = 12 V, VOUT = 1.2 V - reduces thermal load and improves power density in multiphase arrays |
| Power Loss | 2.8 W at 30 A - directly lowers board-level cooling requirements and improves reliability margin |
| Junction-to-Board Thermal Resistance | 1.5 °C/W - enables effective heat transfer to PCB copper layers without external heatsink in standard 2-oz FR4 layouts |
| Operating Temperature Range | –40°C to +125°C - supports industrial-grade operation in high-ambient server and telecom environments |
Pinout & Package
The CSD95372BQ5MC uses a 12-pin VSON-CLIP (DMC) package with exposed thermal pad and DualCool™ construction. The 5 mm × 6 mm footprint integrates high-current source/sink paths and optimized thermal conduction to the PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Voltage proportional to phase current; used with external REFIN for closed-loop current monitoring |
| REFIN | Current sense reference input | External reference for differential current sensing; sets gain and offset of IOUT signal |
| VDD | Gate driver supply | 4.5–5.5 V supply for internal driver circuitry; decoupling required per datasheet layout guidelines |
| ENABLE | Global device enable | Logic HIGH enables operation; internal 100 kΩ pulldown ensures safe default OFF state |
| PGND (pins 4 & 13) | Power ground return | Dual PGND pins minimize ground loop inductance and improve current sensing accuracy |
| VSW | Switch node | Connection point between HS FET source and LS FET drain; ties directly to output inductor |
| PWM | Tri-state PWM input | 3.3-V/5-V compatible; open/Hi-Z disables both FETs after hold-off time t3HT |
| FCCM | Mode control input | LOW enables Diode Emulation Mode; HIGH forces Continuous Conduction Mode |
| BOOT / BOOT_R | Bootstrap circuit terminals | Integrated bootstrap diode; BOOT_R returns to VSW internally - simplifies external capacitor routing |
| TAO/FAULT | Temperature analog output / fault indicator | Reports die temperature (600 mV @ 0°C); pulled to 3.3 V during thermal shutdown |
| VIN | High-side input voltage | Accepts up to 16 V input; requires local ceramic bypass capacitors near pin for EMI suppression |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Driver + Dual NexFET™ MOSFETs | Eliminates discrete gate driver layout complexity and reduces parasitic inductance in high-dI/dt paths |
| DualCool™ Packaging | Exposes top-side thermal pad and bottom copper clip to dissipate heat from both junctions simultaneously |
| Temperature-Compensated Bidirectional Current Sense | Enables accurate phase current measurement across –40°C to +125°C without external calibration |
| Optimized Deadtime Control | Prevents shoot-through during HS/LS transitions - critical for reliability at >1 MHz switching |
| System-Optimized PCB Footprint | Reduces design iteration cycles with pre-validated land pattern, stencil opening, and thermal pad layout |
| Analog Temperature Output (TAO) | Allows single-wire thermal monitoring across multiphase banks - simplifies OR-ing and fault prioritization |
Applications
| Server VR12.x Core Power | GPU Memory Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient power delivery to Intel/AMD CPU cores in dual-socket servers requiring VR12.x compliance and dynamic voltage/frequency scaling. IC Role / Device Role / Timing Role: Single-phase smart power stage in multiphase VR controller architecture; handles full 60-A continuous load per phase with sub-100-ns PWM response. Use Value: Enables 93.4% efficiency at 30 A and 2.8 W loss - reducing total system thermal load and allowing higher power density in 1U chassis. | Use Scenario: Compact, high-efficiency power conversion for GDDR6/GDDR6X memory rails on AI accelerator cards where board space and thermal headroom are constrained. IC Role / Device Role / Timing Role: Synchronous buck stage delivering stable 1.35 V or 1.1 V at up to 60 A per phase with <40 ns minimum on-time support for low-duty-cycle operation. Use Value: Ultra-low inductance package and optimized deadtime allow reliable 1.25 MHz operation - shrinking inductor size by >30% vs. 500 kHz designs. |
| Desktop VR11.x V-Core Supply | High-Density POL for Networking ASICs |
Use Scenario: Main core voltage regulator in high-end desktop motherboards supporting overclocked CPUs with rapid load transients up to 90 A peak. IC Role / Device Role / Timing Role: Primary power stage controlled by TPS53661 or similar multiphase controller; provides current feedback via IOUT/REFIN and thermal status via TAO. Use Value: Diode Emulation Mode (FCCM = LOW) extends light-load efficiency - critical for idle power compliance in modern platform power states. | Use Scenario: Point-of-load regulation for 5G baseband processors and packet processing ASICs requiring stable 0.8–1.2 V rails with tight voltage tolerance and fast line/load regulation. IC Role / Device Role / Timing Role: High-frequency buck stage operating at 1 MHz+ in distributed power architecture; leverages analog TAO for system-level thermal derating. Use Value: Junction-to-board RθJB of 1.5 °C/W enables direct PCB thermal coupling - eliminating need for thermal vias or heatsinks in dense layer stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372AQ5MC | Same pinout and package; lower 50-A continuous rating and reduced 1.0 MHz max fSW - due to different MOSFET RDS(on) and thermal design | Suitable for mid-tier VR11.x or lower-power GPU memory rails where 60-A headroom is not required | Select when cost sensitivity outweighs peak current or frequency needs; verify thermal margin at full load |
| ISL99227BIRZ | 12-pin QFN with integrated current/temperature sensing; 70-A continuous rating but no FCCM pin - uses internal auto-mode selection instead of user-controlled Diode Emulation | Better suited for applications requiring highest possible current density and automatic light-load mode management without external control | Choose when system firmware cannot dedicate GPIO for FCCM; confirm TAO interface compatibility with existing monitoring circuitry |
Compared with CSD95372BQ5MC, the CSD95372AQ5MC trades 10-A current capacity and 250 kHz switching headroom for lower BOM cost, while the ISL99227BIRZ offers higher peak current and autonomous light-load behavior at the expense of FCCM configurability and TI ecosystem alignment.
Availability
CSD95372BQ5MC is available at Aetrix Electronics and suitable for server VR12.x core power, GPU memory power delivery, and high-density POL for networking ASICs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CSD95372BQ5MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in high-reliability power solutions.
The CSD95372BQ5MC belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck conversion in CPU/GPU core and memory power applications where efficiency, thermal performance, and integration density are critical.
FAQ
What is the maximum switching frequency supported by the CSD95372BQ5MC?
The CSD95372BQ5MC supports up to 1250 kHz switching frequency under recommended conditions with CBST ≥ 0.1 µF. This high-frequency capability enables smaller passive components and faster transient response in VR12.x and high-performance computing applications. Operation above 1 MHz requires careful attention to PCB layout, gate drive strength, and thermal management to maintain stability and efficiency. The CSD95372BQ5MC datasheet specifies 1250 kHz as the absolute maximum rated switching frequency.
Does the CSD95372BQ5MC require an external bootstrap diode?
No, the CSD95372BQ5MC integrates a bootstrap diode internally between BOOT and BOOT_R pins. This eliminates the need for an external diode and simplifies layout while improving reliability. Users must still place a minimum 0.1 µF, 16 V X7R ceramic capacitor between BOOT and BOOT_R, as specified in the datasheet. The integrated diode supports efficient high-side FET gate charging across the full operating temperature and voltage range of the CSD95372BQ5MC.
How does the TAO/FAULT pin function in multiphase systems using multiple CSD95372BQ5MC devices?
In multiphase systems, the TAO/FAULT pins of multiple CSD95372BQ5MC devices can be wire-OR'd together using their integrated ORing diodes. Only the highest die temperature among all phases is reported on the shared TAO line, enabling centralized thermal monitoring without additional circuitry. During thermal shutdown, the TAO pin is actively pulled to 3.3 V, signaling fault condition to the controller. This behavior is explicitly documented for the CSD95372BQ5MC and requires no external components beyond the recommended 1 nF bypass capacitor to PGND.
What is the purpose of the FCCM pin on the CSD95372BQ5MC?
The FCCM pin on the CSD95372BQ5MC controls the light-load operating mode: when held LOW, it enables Diode Emulation Mode for discontinuous conduction, improving efficiency at light loads; when HIGH, it forces Continuous Conduction Mode for predictable ripple and control loop stability. An internal 5 µA current source pulls FCCM to 3.3 V if left floating, defaulting to CCM. This pin provides explicit system-level control over efficiency versus noise trade-offs - a key feature distinguishing the CSD95372BQ5MC from fixed-mode alternatives.
Can the CSD95372BQ5MC be used in single-phase applications without a multiphase controller?
Yes, the CSD95372BQ5MC can be used in single-phase buck converters with any compatible PWM controller that provides 3.3-V/5-V tri-state logic signals and meets timing requirements (e.g., minimum 40 ns on-time). Its integrated current and temperature sensing, fault protection, and optimized gate drive make it suitable for standalone high-current POL applications such as FPGA core supplies or ASIC power rails. The CSD95372BQ5MC does not require multiphase coordination circuitry to operate correctly in single-phase configurations.
CSD95372BQ5MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON (5x6)
CSD95372BQ5MC FAQ
1.How can I place an order for CSD95372BQ5MC through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95372BQ5MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95372BQ5MC reliable?
The price and inventory of CSD95372BQ5MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95372BQ5MC is usually 5 days.
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4.How is shipping managed for CSD95372BQ5MC?
CSD95372BQ5MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95372BQ5MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95372BQ5MC?
For technical support, including CSD95372BQ5MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95372BQ5MC requirements.
6.How does Aetrix verify that CSD95372BQ5MC is sourced from the original manufacturer or authorized distributors?
All CSD95372BQ5MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95372BQ5MC meets industry standards.
7.What is the process for return or replacement of CSD95372BQ5MC?
All CSD95372BQ5MC units undergo pre-shipment inspection (PSI). If there is an issue with CSD95372BQ5MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95372BQ5MC part is unused and in its original packaging.
Return procedure for CSD95372BQ5MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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