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Texas Instruments CSD95372BQ5MT
- Part No.:
- CSD95372BQ5MT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerLFDFN
- Datasheet:
-
CSD95372BQ5MT.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 12LSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,431
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Product details
Overview
CSD95372BQ5MT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single LSON-CLIP (DQP) package. It delivers 60 A continuous output current, achieves 93.4% system efficiency at 30 A (VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz), and supports up to 1.25 MHz switching for high-density VR12.x and VR11.x voltage regulator applications in server CPU cores.
For engineers reviewing the CSD95372BQ5MT datasheet, CSD95372BQ5MT pinout, CSD95372BQ5MT application, or CSD95372BQ5MT equivalent, key selection criteria include its integrated bi-directional current sense with temperature compensation, tri-state PWM compatibility (3.3 V/5 V), fault monitoring (HS short, overcurrent, overtemperature), and optimized 5 mm × 6 mm footprint for multiphase POL DC-DC designs.
Technical Context
The CSD95372BQ5MT implements a high-frequency synchronous buck topology with integrated gate driver, control FET, and sync FET in a thermally enhanced LSON-CLIP package. Its internal bootstrap diode, optimized deadtime control, and FCCM/diode emulation mode enable efficient light-load operation and shoot-through protection across 4.5–5.5 V VDD and 16 V max VIN.
Current sensing is implemented via differential IOUT/REFIN interface with temperature-compensated gain, while TAO/FAULT provides analog die temperature output (600 mV at 0°C) and thermal shutdown indication. The device operates across –40°C to 125°C ambient with RθJB = 1.5°C/W and supports multiphase interleaving via shared TAO bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU core rails |
| Peak Output Current | 90 A for tp = 50 µs - sustains transient load steps without derating in VR12.x compliance designs |
| Switching Frequency | Up to 1250 kHz - allows smaller external inductors (e.g., 0.225 µH) and faster transient response |
| System Efficiency | 93.4% at 30 A - reduces thermal load and improves power density in space-constrained server modules |
| Power Loss | 2.8 W at 30 A - directly measurable loss enabling accurate thermal margining in multilayer PCB layouts |
| Thermal Resistance | RθJB = 1.5°C/W - enables direct board-level heat dissipation without heatsinks in standard FR4 stacks |
| Operating Junction Temp | –55°C to 150°C - supports industrial and extended-temperature server environments |
Pinout & Package
LSON-CLIP (DQP) package, 12-pin, 5 mm × 6 mm outline with exposed thermal pad; optimized for low-inductance layout and high-current PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Provides voltage proportional to phase current (IOUT – REFIN ∝ IL); enables closed-loop current monitoring |
| REFIN | Current sense reference input | External reference node for bi-directional current sense amplifier; sets zero-current baseline |
| VDD | Gate driver supply | 4.5–5.5 V supply for internal logic and gate drivers; decoupling required per TI layout guidelines |
| ENABLE | Global enable control | Logic HIGH enables operation; internal 100-kΩ pulldown ensures safe default OFF state |
| PGND | Power ground (x2 pins) | Dual PGND pins (pins 4 & 13) reduce ground loop inductance and improve current return path integrity |
| VSW | Switch node | Connects HS source and LS drain; ties directly to output inductor; critical for EMI and ringing control |
| PWM | 3-state PWM input | Accepts 3.3 V/5 V logic; High-Z state forces both FETs OFF after t3HT hold-off time for controlled shutdown |
| FCCM | Mode select (FCCM/Diode Emulation) | LOW enables diode emulation for discontinuous conduction; internal 5 µA pull-up defaults to FCCM |
| TAO/FAULT | Temperature analog output / fault indicator | Outputs 600 mV at 0°C; pulled to 3.3 V during thermal shutdown; supports wired-OR in multiphase systems |
| BOOT | Bootstrap capacitor connection | Requires ≥0.1 µF X7R ceramic to BOOT_R; supplies charge for HS FET gate drive |
| BOOT_R | Bootstrap return | Internally connected to VSW; completes bootstrap charging loop for high-side driver |
| VIN | Main input supply | 16 V max rating; requires local ceramic input capacitors placed adjacent to pin 7 per layout best practices |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ power stage | Combines driver, control FET, and sync FET in one package-eliminates discrete gate drive design complexity and layout sensitivity |
| Temperature-compensated bi-directional current sense | Enables accurate phase current measurement across –40°C to 125°C without external calibration or compensation circuitry |
| Analog temperature output (TAO) | 600 mV at 0°C with linear slope; allows real-time die temperature monitoring and thermal throttling without ADC overhead |
| Fault monitoring suite | Detects high-side short, overcurrent, and overtemperature events; asserts TAO/FAULT pin for system-level fault reporting |
| Tri-state PWM input with hold-off timer | Supports seamless transition between active PWM control and forced shutdown without external logic or timing circuits |
| Ultra-low inductance LSON-CLIP package | Reduces switching loop inductance by >30% vs. standard QFN-minimizes VSW ringing and EMI in high-dV/dt applications |
Applications
| Server CPU Core VR | GPU Memory VR |
|---|---|
Use Scenario: High-current, fast-transient regulation for Intel VR12.x-compliant CPU cores in dual-socket servers. IC Role / Device Role / Timing Role: Single-phase smart power stage delivering up to 60 A continuous current with <40 ns minimum on-time support. Use Value: Enables compact, high-efficiency 1.2 V core rail with 93.4% efficiency at 30 A-reducing thermal envelope and improving power delivery density. |
Use Scenario: Multiphase POL converter for GDDR6 memory subsystems requiring tight voltage tolerance and rapid load-step response. IC Role / Device Role / Timing Role: Phase-leg module synchronized via external controller (e.g., TPS53661) with shared TAO bus for thermal balancing. Use Value: Bi-directional current sense and diode emulation mode maintain regulation accuracy during deep sleep states and burst-mode operation. |
| Desktop VRM Modules | AI Accelerator Power Rails |
Use Scenario: Compact VRM solution for high-end desktop motherboards supporting AMD Ryzen processors with VR11.x compliance. IC Role / Device Role / Timing Role: Synchronous buck stage operating at 1 MHz with FCCM mode for stable light-load efficiency. Use Value: Integrated bootstrap diode and optimized deadtime eliminate external components-reducing BOM count and layout area by ~15%. |
Use Scenario: Distributed power delivery for FPGA-based AI inference cards with multiple independent 0.8–1.2 V rails. IC Role / Device Role / Timing Role: Independent phase-leg in multi-rail architecture; TAO/FAULT pin enables centralized thermal management across all rails. Use Value: RθJB = 1.5°C/W allows direct PCB copper pour cooling-enabling fanless operation in edge AI enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck smart power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372AQ5MT | Lower 50 A continuous current rating; identical pinout and feature set except reduced current capability and slightly lower efficiency (92.7% @ 30 A) | Suitable for cost-sensitive mid-tier desktop VRMs where peak current demand ≤50 A | Select when thermal budget allows higher loss or system current requirement is capped below 55 A |
| MP86957GQZ | Monolithic 70 A buck converter (integrated controller + FETs); no separate PWM interface-requires PMBus/I2C configuration | Targeted at fully integrated, digitally programmable VRMs rather than controller-driven multiphase systems | Choose only if migrating from external controller architecture to digital, self-contained power solution |
Compared with CSD95372BQ5MT, CSD95372AQ5MT offers identical integration and layout compatibility at reduced current capacity, while MP86957GQZ replaces the controller+power-stage architecture with a monolithic digital solution-requiring firmware integration and sacrificing multiphase flexibility.
Availability
CSD95372BQ5MT is available at Aetrix Electronics and suitable for server CPU VR, GPU memory regulation, desktop VRM modules, AI accelerator power rails, and high-density POL DC-DC converters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95372BQ5MT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in high-reliability power solutions.
The CSD95372BQ5MT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current multiphase buck converters in computing and datacenter applications demanding minimal footprint and maximum thermal performance.
FAQ
What is the maximum input voltage rating for the CSD95372BQ5MT?
The CSD95372BQ5MT has an absolute maximum VIN-to-PGND rating of 25 V, with a recommended operating limit of 16 V. Exceeding 16 V increases switch-node (VSW) overshoot risk during transients; system design must ensure VSW-to-PGND remains within the 20 V absolute max rating under all conditions. The CSD95372BQ5MT datasheet specifies this limit in Section 6.1 Absolute Maximum Ratings.
Does the CSD95372BQ5MT support diode emulation mode, and how is it enabled?
Yes, the CSD95372BQ5MT supports diode emulation mode via the FCCM pin. When FCCM is held LOW, the sync FET operates in diode emulation for discontinuous conduction mode (DCM), improving light-load efficiency. An internal 5 µA current source pulls FCCM to 3.3 V by default, so a dedicated pull-down is required to activate diode emulation. This behavior is documented in the Pin Functions table for FCCM in Section 5 of the CSD95372BQ5MT datasheet.
How does the TAO/FAULT pin function in multiphase configurations using multiple CSD95372BQ5MT devices?
In multiphase systems, the TAO/FAULT pins of multiple CSD95372BQ5MT units are wired together in a wired-OR configuration. Only the highest die temperature among all phases is reported on the shared line due to integrated ORing diodes. During thermal shutdown, the affected CSD95372BQ5MT pulls TAO/FAULT to 3.3 V, signaling system-level fault. This architecture eliminates need for external multiplexing and is explicitly supported per the TAO/FAULT pin description in Section 5 of the CSD95372BQ5MT datasheet.
What is the purpose of the dual PGND pins (pins 4 and 13) on the CSD95372BQ5MT?
The CSD95372BQ5MT features two dedicated PGND pins (4 and 13) to minimize power ground loop inductance and improve current return path integrity. Pin 4 serves the driver and logic ground, while pin 13 handles high-current power ground return from the MOSFETs. Separating these paths reduces noise coupling into sensitive analog circuits (e.g., current sense amplifier) and enhances stability-details confirmed in the Pin Functions table and layout recommendations in Section 9.2 of the CSD95372BQ5MT datasheet.
Can the CSD95372BQ5MT operate with a 3.3 V PWM input signal, and what is the tri-state behavior?
Yes, the CSD95372BQ5MT accepts 3.3 V or 5 V logic-level PWM inputs. Its tri-state PWM input (pin 12) interprets logic HIGH as control-FET ON/sync-FET OFF, logic LOW as control-FET OFF/sync-FET ON, and High-Z (open) as both FETs OFF after the 3-state shutdown hold-off time (t3HT). This enables seamless integration with controllers offering high-impedance disable states without external pull resistors. The specification is verified in Section 5 Pin Functions and Section 6.3 Recommended Operating Conditions of the CSD95372BQ5MT datasheet.
CSD95372BQ5MT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerLFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-LSON-CLIP (5x6)
CSD95372BQ5MT FAQ
1.How can I place an order for CSD95372BQ5MT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95372BQ5MT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95372BQ5MT reliable?
The price and inventory of CSD95372BQ5MT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95372BQ5MT is usually 5 days.
3.What payment methods are accepted for CSD95372BQ5MT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95372BQ5MT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95372BQ5MT?
CSD95372BQ5MT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95372BQ5MT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95372BQ5MT?
For technical support, including CSD95372BQ5MT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95372BQ5MT requirements.
6.How does Aetrix verify that CSD95372BQ5MT is sourced from the original manufacturer or authorized distributors?
All CSD95372BQ5MT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95372BQ5MT meets industry standards.
7.What is the process for return or replacement of CSD95372BQ5MT?
All CSD95372BQ5MT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95372BQ5MT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95372BQ5MT part is unused and in its original packaging.
Return procedure for CSD95372BQ5MT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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