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Texas Instruments CSD95373AQ5M
- Part No.:
- CSD95373AQ5M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerLFDFN
- Datasheet:
-
CSD95373AQ5M.pdf
- Description:
- IC HALF BRIDGE DRIVER 45A 12LSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,110
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Product details
Overview
CSD95373AQ5M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 5 mm × 6 mm SON package. It delivers 45 A continuous output current, achieves 92.6% system efficiency at 25 A (VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz), and supports up to 2 MHz switching frequency - optimized for high-density VR11.x/VR12.x VCore point-of-load converters in server and desktop CPUs.
For engineers reviewing the CSD95373AQ5M datasheet, CSD95373AQ5M pinout, CSD95373AQ5M application, or CSD95373AQ5M equivalent, key selection considerations include tri-state PWM compatibility with 3.3 V/5 V controllers, integrated diode emulation mode with FCCM control, analog temperature output (TAO) for multi-phase thermal monitoring, and ultra-low power loss (2.6 W at 25 A, TJ = 25°C).
Technical Context
The CSD95373AQ5M implements a high-frequency synchronous buck power stage with integrated gate driver, HS/LS NexFET MOSFETs, and analog temperature sensing. Its driver provides >4 A peak gate drive current, programmable dead-time optimization, and built-in bootstrap switch with integrated diode.
It supports two operating modes via the FCCM pin: forced continuous conduction mode (FCCM = HIGH) and diode emulation mode (FCCM = LOW), enabling light-load efficiency improvement through zero-cross detection and third-pulse latching. The TAO pin delivers a calibrated 8 mV/°C analog voltage referenced to PGND, with OR-ing capability across multiple phases and fault flagging at thermal shutdown (150–165°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 45 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability under standard thermal conditions |
| Peak Output Current | 67 A for tp = 50 µs - supports transient load demands without device saturation or thermal runaway |
| System Efficiency | 92.6% at 25 A, VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables high-power delivery with minimal thermal dissipation |
| Power Loss | 2.6 W at 25 A, TJ = 25°C - directly reduces heatsink size and airflow requirements in dense PCB layouts |
| Switching Frequency | Up to 2000 kHz - allows smaller output inductors and capacitors, improving power density and transient response |
| Thermal Shutdown Threshold | 150–165°C with 25°C hysteresis - ensures automatic recovery after cooling without external reset logic |
| PWM Logic Compatibility | 3.3 V and 5 V tolerant with tri-state input - eliminates level-shifting circuitry when interfacing with common controllers like TPS53640 |
Pinout & Package
Package: SON (Small Outline No-lead), 5 mm × 6 mm, 13-pin layout with exposed thermal pad (PGND-connected). Optimized for low-inductance, high-current PCB routing and thermal performance on 6-layer boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 4 | NC | No-connect pins - must remain floating per datasheet; no internal connection or function |
| 3 | ENABLE | TTL-compatible enable with 100 kΩ internal pulldown - asserts active-low disable to force both MOSFET gates low and reduce quiescent current to 10 µA |
| 5 | VDD | Gate driver supply input (4.5–5.5 V) - powers internal logic and gate drivers; requires 1 µF ceramic bypass to PGND |
| 6 | VSW | Switch node - connects HS source and LS drain; carries full AC switching waveform and must be routed with minimal loop area |
| 7 | VIN | Main input voltage rail (up to 16 V) - connects to bulk input capacitors; six 10-µF ceramics recommended for optimal ripple suppression |
| 8 | BOOT_R | Bootstrap return path - internally connected to VSW; forms low-impedance return for HS gate charge pump |
| 9 | BOOT | Bootstrap capacitor terminal - requires ≥0.1 µF X7R ceramic between BOOT and BOOT_R to sustain HS FET turn-on |
| 10 | FCCM | Mode select input - LOW enables diode emulation (DCM); HIGH forces continuous conduction (CCM); internal 5 µA pullup if floating |
| 11 | TAO/FAULT | Analog temperature output with fault flag - 0.56–0.64 V at 25°C, +8 mV/°C slope; pulled to 3.3 V during thermal shutdown |
| 12 | PWM | Tri-state PWM input - interprets logic HIGH/LOW for normal operation; enters safe tri-state (both gates low) if floating >30 ns |
| 13 | PGND | Power ground - primary return path for high-current switching loops; must be connected to large copper plane for thermal and EMI control |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Switch | Eliminates external bootstrap diode; reduces BOM count and improves reliability in high-frequency operation |
| Diode Emulation Mode with FCCM Control | Enables discontinuous conduction at light loads via zero-cross detection, improving efficiency without requiring controller firmware changes |
| Analog Temperature Output (TAO) | Provides calibrated die temperature measurement (±2°C accuracy) and multi-phase OR-ing - simplifies thermal management in VRMs |
| Optimized Dead Time for Shoot-Through Protection | Dynamically adjusts dead time based on inductor current polarity - prevents cross-conduction while minimizing conduction loss |
| Tri-State PWM Input | Automatically disables both FETs when PWM signal is open or high-Z, preventing unintended switching during controller reset or fault |
| RoHS & Halogen-Free Compliance | Meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and lead-free reflow requirements for industrial and computing applications |
Applications
| Server CPU Voltage Regulator | Desktop Graphics Card VRM |
|---|---|
Use Scenario: High-current, fast-transient VCore regulation for dual-socket Xeon or EPYC processors with VR12.x compliance. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in multiphase VRM; receives PWM commands from TI TPS53640 controller and reports thermal status via TAO bus. Use Value: Delivers 45 A continuous current per phase with 92.6% efficiency at 25 A, reducing board-level heat generation and enabling compact 4-phase designs. |
Use Scenario: Point-of-load conversion for GPU core voltage (VDDC) in PCIe-based graphics cards requiring <1.2 V output at >50 A total. IC Role / Device Role / Timing Role: High-density power stage in 3-phase or 4-phase GPU VRM; operates at 1 MHz+ switching with diode emulation enabled for idle power savings. Use Value: Ultra-low 5×6 mm footprint and integrated TAO allow precise per-phase thermal monitoring without additional sensors or routing complexity. |
| Memory Module DDR5 PDN | AI Accelerator Board Power |
Use Scenario: Distributed power delivery for DDR5 memory modules with tight voltage tolerance (±3%) and dynamic current steps up to 30 A. IC Role / Device Role / Timing Role: Secondary buck stage supplying VPP or VDDQ rails; synchronized via shared PWM clock and monitored via daisy-chained TAO lines. Use Value: Tri-state PWM input ensures safe disable during memory initialization sequences, preventing uncontrolled inrush into decoupling capacitors. |
Use Scenario: High-efficiency power stage for FPGA or ASIC core voltage in edge AI inference accelerators with strict thermal envelope limits. IC Role / Device Role / Timing Role: Single-phase or interleaved phase in scalable power architecture; leverages analog TAO for real-time junction temperature feedback to thermal management firmware. Use Value: 2.6 W power loss at 25 A and 15 °C/W junction-to-case thermal resistance enable passive cooling in fanless edge deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372AQ5M | Same 5×6 mm SON package and pinout, but rated for 40 A continuous current and lower 2.3 W power loss at 25 A; lacks integrated TAO output | Preferred where thermal monitoring is handled externally or not required; suitable for cost-sensitive, single-phase designs with lower current demand | Select CSD95372AQ5M only if TAO functionality is unnecessary and peak current remains ≤40 A; verify controller compatibility with missing TAO/FAULT reporting |
| ISL99227BIRZ | 40 A rated, 5×6 mm QFN package, supports 3.3 V PWM only (not 5 V), includes digital PMBus telemetry but no analog TAO | Better suited for digitally managed systems requiring telemetry and margining; incompatible with analog thermal bus architectures | Choose ISL99227BIRZ when PMBus communication and remote telemetry are required; avoid if legacy analog TAO bus or 5 V PWM interface is mandatory |
Compared with CSD95373AQ5M, CSD95372AQ5M trades thermal visibility for lower loss and cost, while ISL99227BIRZ replaces analog temperature reporting with digital telemetry - making CSD95373AQ5M uniquely suited for analog-sensed, high-current, mixed-voltage PWM systems.
Availability
CSD95373AQ5M is available at Aetrix Electronics and suitable for server CPU voltage regulation, GPU VRMs, DDR5 memory power delivery, and AI accelerator board power requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95373AQ5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in high-reliability power solutions.
The CSD95373AQ5M belongs to TI's NexFET™ power stage product line, engineered specifically for high-efficiency, high-density synchronous buck converters in computing and datacenter applications - emphasizing thermal intelligence, integration, and system-level performance predictability.
FAQ
What is the maximum input voltage rating for CSD95373AQ5M?
The absolute maximum VIN to PGND rating for CSD95373AQ5M is 25 V, but the recommended operating condition is up to 16 V. Exceeding 16 V may cause excessive AC voltage overshoot on the VSW node during switching transients, risking reliability. The datasheet specifies that VSW-to-PGND must remain within –0.3 V to 20 V under normal operation to avoid damage. Always verify switch-node ringing with appropriate probing techniques.
Does CSD95373AQ5M require an external bootstrap diode?
No, CSD95373AQ5M integrates the bootstrap diode internally. The BOOT pin connects to a 0.1 µF X7R ceramic capacitor referenced to BOOT_R (pin 8), which is internally tied to VSW. This eliminates the need for an external discrete diode, reducing component count, PCB area, and potential failure points - a key differentiator versus discrete driver + MOSFET solutions.
How does the TAO pin function during thermal shutdown in CSD95373AQ5M?
During thermal shutdown, the CSD95373AQ5M pulls the TAO pin to a fixed 3.3 V level to flag fault condition. Once junction temperature falls below the hysteresis threshold (typically ~140°C), the TAO voltage returns to its analog temperature-proportional output (0.56–0.64 V at 25°C, +8 mV/°C). In multi-phase systems, TAO pins can be wire-OR'd, so only the highest temperature device dominates the bus voltage - enabling single-wire thermal monitoring across all phases.
Can CSD95373AQ5M operate with a 3.3 V PWM controller?
Yes, CSD95373AQ5M supports both 3.3 V and 5 V PWM logic levels. Its PWM input thresholds are VPWML = 0.7–0.9 V (logic low) and VPWMH = 2.3–2.7 V (logic high), ensuring reliable recognition of standard 3.3 V CMOS outputs. The tri-state window (1.5 V) further guarantees safe disable behavior when the controller is in reset or high-impedance state - confirmed in TI's SLPS458A datasheet Section 6.5.
What happens to the MOSFET gates when the ENABLE pin is left floating on CSD95373AQ5M?
When ENABLE is left floating, an internal 100 kΩ pulldown resistor pulls it below 0.8 V, placing CSD95373AQ5M in disabled state. Both high-side and low-side MOSFET gates are actively driven low, halting switching and reducing VDD supply current to 10 µA. This fail-safe behavior prevents unintended operation during power-up sequencing or controller faults - a critical safety feature explicitly documented in Section 5 (Pin Configuration) of the datasheet.
CSD95373AQ5M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerLFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 45A
- Current - Peak Output:
- 67A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Over Temperature, Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-LSON-CLIP (5x6)
CSD95373AQ5M FAQ
1.How can I place an order for CSD95373AQ5M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95373AQ5M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95373AQ5M reliable?
The price and inventory of CSD95373AQ5M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95373AQ5M is usually 5 days.
3.What payment methods are accepted for CSD95373AQ5M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95373AQ5M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95373AQ5M?
CSD95373AQ5M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95373AQ5M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95373AQ5M?
For technical support, including CSD95373AQ5M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95373AQ5M requirements.
6.How does Aetrix verify that CSD95373AQ5M is sourced from the original manufacturer or authorized distributors?
All CSD95373AQ5M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95373AQ5M meets industry standards.
7.What is the process for return or replacement of CSD95373AQ5M?
All CSD95373AQ5M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95373AQ5M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95373AQ5M part is unused and in its original packaging.
Return procedure for CSD95373AQ5M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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