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Texas Instruments CSD95373BQ5M
- Part No.:
- CSD95373BQ5M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerLFDFN
- Datasheet:
-
CSD95373BQ5M.pdf
- Description:
- IC HALF BRIDGE DRIVER 45A 12LSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,346
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Product details
Overview
CSD95373BQ5M from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and dual power MOSFETs in a single LSON-CLIP (DQP) package. It delivers 45-A continuous output current, achieves 92.7% system efficiency at 25 A (VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz), and supports up to 1.25 MHz switching frequency for high-density VR12.x and server core voltage regulation.
For engineers reviewing the CSD95373BQ5M datasheet, CSD95373BQ5M pinout, CSD95373BQ5M application, or CSD95373BQ5M equivalent, key selection considerations include its integrated bi-directional current sense with temperature compensation, tri-state PWM input compatibility with 3.3-V/5-V controllers, and fault monitoring including high-side short, overcurrent, and overtemperature protection.
Technical Context
The CSD95373BQ5M implements a fully integrated synchronous buck power stage architecture with monolithic gate driver, high-side and low-side silicon-based NexFET™ MOSFETs, and embedded analog sensing circuitry. It supports diode emulation mode via FCCM pin control and forced continuous conduction mode (FCCM) for light-load efficiency optimization.
Its thermal design integrates an analog temperature output (600 mV at 0°C) referenced to PGND, with internal ORing diode enabling multiphase temperature reporting on a single wire. The device uses an integrated bootstrap diode and optimized dead-time control to prevent shoot-through, with minimum PWM on-time of 40 ns and 85% maximum duty cycle at 1 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 45 A at VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VR applications |
| Peak Output Current | 67 A for tp = 50 µs - sustains transient load steps without thermal shutdown in server/desktop VR designs |
| Switching Frequency | Up to 1250 kHz - allows smaller external inductors and faster transient response in space-constrained POL converters |
| System Efficiency | 92.7% at 25 A - reduces power loss to 2.6 W under typical VR12.x operating conditions |
| Junction-to-Case Thermal Resistance | 15 °C/W - enables direct thermal coupling to heatsink or PCB copper for high-power density thermal management |
| Operating Junction Temperature | –55°C to +150°C - supports industrial and server-grade reliability across extended ambient ranges |
| PWM Input Compatibility | 3.3-V and 5-V logic levels with tri-state capability - interoperates with TI TPS536xx, ISL912x, and other VR controller families |
Pinout & Package
Package: LSON-CLIP (DQP), 12-pin, 5.0 mm × 6.0 mm exposed-pad surface-mount outline with ultra-low-inductance layout and system-optimized PCB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Voltage proportional to phase current; used with REFIN to enable accurate bi-directional current monitoring |
| REFIN | Current sense reference input | External reference for IOUT amplifier; sets gain and offset for precision current measurement |
| VDD | Gate driver supply | 4.5–5.5 V supply for internal driver and logic; powers bootstrap circuitry and sensing blocks |
| ENABLE | Global operation enable | Logic HIGH enables switching; internal 100-kΩ pulldown ensures safe default OFF state |
| PGND (pins 4 & 13) | Power ground return | Dual PGND pins minimize ground loop inductance and improve current-sense accuracy |
| VSW | Switch node | Connects HS source and LS drain; ties directly to output inductor; critical for EMI and layout integrity |
| PWM | Tri-state PWM input | Controls FET states: LOW = HS off / LS on; HIGH = HS on / LS off; Hi-Z = both off after t3HT hold-off |
| FCCM | Diode emulation mode control | LOW enables discontinuous conduction (DCM) for light-load efficiency; internal 5-µA pull-up defaults to FCCM |
| TAO/FAULT | Temperature analog output / fault indicator | 600 mV at 0°C, scales linearly; pulled to 3.3 V during thermal shutdown; supports multiphase OR-wire reporting |
| BOOT & BOOT_R | Bootstrap capacitor interface | Integrated bootstrap diode eliminates external component; requires ≥0.1-µF X7R ceramic between BOOT and BOOT_R |
| VIN | Main input voltage | 16-V max rating; connects to bulk input capacitors; high dV/dt immunity supports fast-switching transients |
Key Features
| Feature | Design Value |
|---|---|
| Integrated current and temperature sensing | Eliminates external sense resistors and thermistors, reducing BOM count and improving accuracy of phase current and die temperature reporting |
| Tri-state PWM input with configurable dead time | Supports advanced controller features like phase shedding and adaptive timing without external logic or delay circuits |
| Diode emulation mode with FCCM pin control | Enables >90% efficiency down to <5% load in VR12.x applications by eliminating reverse recovery losses in low-current DCM |
| Ultra-low-inductance LSON-CLIP package | Reduces parasitic loop inductance by >40% vs. standard QFN, lowering VSW ringing and EMI emissions in high-dI/dt operation |
| High-density 5-mm × 6-mm footprint | Enables compact 3+1 or 4+1 VR phase layouts on memory cards and thin-server motherboards without sacrificing thermal performance |
Applications
| Server VR12.x Core Regulation | GPU Memory Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient voltage regulation for Intel/AMD server CPUs requiring VR12.x compliance and dynamic phase control. IC Role / Device Role / Timing Role: Smart power stage providing complete switching, current sensing, and thermal feedback per phase in multiphase buck converter. Use Value: Delivers 45-A continuous current with 92.7% efficiency at 25 A and 1.2 V output, enabling scalable 6–12 phase VR designs with minimal board area. |
Use Scenario: Compact, high-efficiency power delivery to GDDR6/GDDR6X memory stacks on AI accelerator and graphics cards. IC Role / Device Role / Timing Role: Single-phase synchronous buck stage with integrated current sense and temperature monitoring for localized POL conversion. Use Value: Supports 1.2–1.35 V outputs at up to 45 A with <40 ns minimum on-time, meeting tight voltage tolerance and transient response requirements of modern GPU memory rails. |
| Desktop VR11.x/VR12.x V-core | Multiphase POL Converters |
Use Scenario: Main processor core voltage regulation in high-end desktop platforms with aggressive power delivery demands and thermal constraints. IC Role / Device Role / Timing Role: Integrated power stage replacing discrete driver + MOSFET solutions in 4+1 or 6+2 VR configurations. Use Value: Reduces solution size by 30% vs. discrete alternatives while maintaining 1.25 MHz operation and full fault coverage (HS short, OCP, OTP). |
Use Scenario: Distributed point-of-load regulation in telecom baseband units, network switches, and FPGA carrier boards requiring multiple independent 12 V → 1.2 V rails. IC Role / Device Role / Timing Role: Modular, plug-and-play power stage supporting parallel phase interleaving and digital controller synchronization. Use Value: Enables rapid prototyping of scalable multiphase systems using standardized 5×6 mm footprints and unified analog sensing interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck smart power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372AQ5M | Lower 35-A continuous current rating; identical pinout, package, and feature set except reduced RDS(on) and thermal margin | Suitable for mid-tier desktop VR or lower-power server DIMMs where 45-A headroom is unnecessary | Select when thermal budget or cost sensitivity outweighs need for 45-A peak capability; shares same PCB layout and controller interface |
| MP86957GQZ | Monolithic 50-A buck converter (integrated inductor not present); different pinout, no analog current sense output, uses digital PMBus telemetry | Better suited for space-constrained single-rail applications where digital control and telemetry are prioritized over analog sensing fidelity | Choose when PMBus communication, programmable loop compensation, or inductor-integrated modules are required - not a drop-in replacement |
Compared with CSD95373BQ5M, CSD95372AQ5M offers identical integration and layout compatibility at reduced current capacity, while MP86957GQZ trades analog sensing and pin compatibility for digital configurability and higher peak current - making CSD95373BQ5M optimal for analog-controlled, high-fidelity multiphase VR designs.
Availability
CSD95373BQ5M is available at Aetrix Electronics and suitable for server VR12.x core regulation, GPU memory power delivery, and multiphase POL converters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for volume production.
Supply support for CSD95373BQ5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-performance power delivery solutions for computing and industrial markets.
The CSD95373BQ5M belongs to TI's NexFET™ smart power stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in server, desktop, and graphics applications demanding integrated sensing and robust fault protection.
FAQ
What is the maximum switching frequency supported by the CSD95373BQ5M?
The CSD95373BQ5M supports up to 1250 kHz switching frequency under recommended operating conditions with CBST ≥ 0.1 µF. This high-frequency capability enables use of smaller external inductors and faster transient response in VR12.x and POL applications, while maintaining stable operation and thermal integrity within its 15 °C/W junction-to-case thermal resistance limit.
Does the CSD95373BQ5M require an external bootstrap diode?
No, the CSD95373BQ5M integrates a bootstrap diode internally. Users must connect a minimum 0.1-µF, 16-V, X7R ceramic capacitor between BOOT and BOOT_R pins to ensure reliable high-side FET gate drive. This integration simplifies layout, reduces component count, and improves reliability compared to discrete driver solutions requiring external bootstrap components.
How does the CSD95373BQ5M implement current sensing?
The CSD95373BQ5M provides temperature-compensated bi-directional current sensing via differential inputs REFIN and output IOUT. The voltage difference V(IOUT) – V(REFIN) is proportional to phase current magnitude and direction. This analog sensing eliminates external shunt resistors and supports precise current monitoring for phase balancing and overcurrent protection in multiphase systems.
What fault protection features are built into the CSD95373BQ5M?
The CSD95373BQ5M includes high-side short-circuit detection, overcurrent protection (OCP), and overtemperature protection (OTP). Fault status is reported through the TAO/FAULT pin, which pulls to 3.3 V during thermal shutdown and supports wired-OR reporting across multiple phases. These protections operate independently of the controller, enhancing system safety and reliability.
Is the CSD95373BQ5M compatible with 3.3-V PWM controllers?
Yes, the CSD95373BQ5M is explicitly designed for 3.3-V and 5-V PWM signal compatibility. Its tri-state PWM input accepts logic-level signals across both voltage domains and includes internal hysteresis and timing controls to ensure robust operation with TI TPS536xx, Renesas ISL912x, and other industry-standard VR controllers without level-shifting circuitry.
CSD95373BQ5M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerLFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 45A
- Current - Peak Output:
- 67A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-LSON-CLIP (5x6)
CSD95373BQ5M FAQ
1.How can I place an order for CSD95373BQ5M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95373BQ5M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95373BQ5M reliable?
The price and inventory of CSD95373BQ5M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95373BQ5M is usually 5 days.
3.What payment methods are accepted for CSD95373BQ5M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95373BQ5M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95373BQ5M?
CSD95373BQ5M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95373BQ5M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95373BQ5M?
For technical support, including CSD95373BQ5M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95373BQ5M requirements.
6.How does Aetrix verify that CSD95373BQ5M is sourced from the original manufacturer or authorized distributors?
All CSD95373BQ5M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95373BQ5M meets industry standards.
7.What is the process for return or replacement of CSD95373BQ5M?
All CSD95373BQ5M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95373BQ5M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95373BQ5M part is unused and in its original packaging.
Return procedure for CSD95373BQ5M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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