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Texas Instruments CSD95375Q4M
- Part No.:
- CSD95375Q4M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD95375Q4M.pdf
- Description:
- IC HALF BRIDGE DRIVER 25A 8VSON
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CSD95375Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single SON 3.5 × 4.5-mm package. It delivers 25 A continuous / 60 A peak output current, achieves 93% system efficiency at 15 A, supports up to 2 MHz switching frequency, and operates with 3.3 V or 5 V PWM inputs - optimized for high-density point-of-load converters in Ultrabook and multiphase Vcore applications.
For engineers reviewing the CSD95375Q4M datasheet, CSD95375Q4M pinout, CSD95375Q4M application, or CSD95375Q4M equivalent, key selection criteria include its ultra-low-inductance SON package, diode emulation mode with FCCM/DCM control via SKIP#, shoot-through protection, integrated bootstrap diode, and validated 10 kV/µs dV/dt capability requiring strict PCB layout discipline for input capacitor placement and VSW node routing.
Technical Context
The CSD95375Q4M implements a fully integrated gate driver with adaptive zero-crossing detection, tri-state PWM and SKIP# inputs, and an integrated boost-switch replacing the external bootstrap diode. Its driver supports ULQ (130 µA) and deep-standby (8 µA) modes, with UVLO thresholds at 4.15 V (rising) and 3.7 V (falling).
Thermal design leverages PGND as primary heat path via thermal vias; RθJC is 22.8°C/W (top), RθJB is 2.5°C/W. The device uses parametrically tuned Control FET and Sync FET silicon to minimize conduction and switching losses under real-system conditions - validated using measured power loss curves rather than isolated RDS(on) or Qgd values.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 25 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - verified under thermal constraints with 400 LFM airflow. |
| Peak Output Current | 60 A for tp ≤ 10 ms, duty cycle ≤ 1% - enables transient response headroom in CPU VRMs. |
| Switching Frequency Range | 200–2000 kHz - supports high-frequency operation to shrink magnetics while maintaining efficiency. |
| System Efficiency | 93% at 15 A, VIN = 12 V, VOUT = 1.8 V - measured on reference 6-layer PCB, includes gate drive and conduction losses. |
| Power Loss | 2.2 W at 15 A, TJ = 25°C; 2.6 W at same load, TJ = 125°C - directly usable for thermal margining without derating assumptions. |
| dV/dt Rating | >10 kV/µs - mandates minimized loop area for VIN-PGND and VSW paths to prevent false triggering or EMI. |
| Quiescent Current | 8 µA in deep-standby (SKIP# tri-stated) - enables Connected Standby compliance in Windows platforms. |
Pinout & Package
Package: SON 3.5 × 4.5 mm, 9-pin, exposed thermal pad (PGND-connected). Pin 1 is SKIP#, pin 9 is PGND; dual PGND pins (3 and 9) provide low-inductance return paths for high di/dt currents.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Tri-state digital input | Enables diode emulation (DCM) when low; forces FCCM when high; enters ULQ mode when floating - controls light-load efficiency strategy. |
| 2: VDD | Driver supply input | 4.5–5.5 V gate driver rail; powers internal logic and high-side gate drive; requires local 1 µF ceramic bypass to PGND. |
| 3 & 9: PGND | Power ground terminals | Low-inductance return paths for both high-side and low-side FET sources; must be connected to thermal pad and system GND plane. |
| 4: VSW | Switching node | Connection to output inductor; carries full AC switching waveform; layout must minimize trace length and loop area to suppress EMI. |
| 5: VIN | Input voltage supply | 16 V max input; requires six 10-µF ceramic capacitors placed adjacent to pins 5 and 3/9 to handle >10 kV/µs dV/dt transients. |
| 6: BOOT_R | Bootstrap capacitor reference | Internal connection to VSW; forms bootstrap circuit with BOOT pin; requires 0.1 µF X5R ceramic cap to BOOT. |
| 7: BOOT | Bootstrap supply node | Provides gate drive voltage for control FET; integrates bootstrap diode - eliminates external diode and reduces BOM count. |
| 8: PWM | Tri-state PWM input | Accepts 3.3 V or 5 V logic; high-Z state forces both FET gates low and reduces IDD to 130 µA; exit latency <100 ns. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Boost-Switch | Replaces discrete bootstrap diode with FET gated by DRVL - reduces forward voltage drop and improves high-side gate drive stability. |
| Shoot-Through Protection | Hardware-level dead-time control prevents simultaneous conduction of high- and low-side FETs - eliminates risk of destructive shoot-through current. |
| Ultra-Low Quiescent (ULQ) Mode | 130 µA supply current with PWM tri-stated - maintains immediate wake-up response for dynamic load steps in mobile platforms. |
| Diode Emulation with FCCM | Zero-crossing detection enables DCM at light loads (improving efficiency) and seamless transition to FCCM under heavier loads - no external control needed. |
| System-Optimized PCB Footprint | SON 3.5 × 4.5 mm outline with symmetric PGND pins and VSW/VIN placement - minimizes parasitic inductance and simplifies high-current routing. |
Applications
| Ultrabook DC/DC Converters | Multiphase Vcore Solutions |
|---|---|
Use Scenario: Point-of-load regulation for Intel Core i-series CPUs in thin-and-light notebooks requiring rapid load transient response and Connected Standby compliance. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering 1.8 V @ 25 A with diode emulation for sub-1 A idle currents and FCCM for burst-mode active loads. Use Value: 93% efficiency at 15 A reduces thermal load on compact chassis; 8 µA deep-standby current meets Windows Modern Standby requirements. |
Use Scenario: One phase of a 3+1 or 4+1 Vcore VRM supplying core voltage to high-performance server CPUs with tight voltage tolerance (±1%) and fast slew rate demands. IC Role / Device Role / Timing Role: High-current, high-frequency phase leg supporting up to 2 MHz switching to minimize output inductance and improve transient recovery time. Use Value: Validated 10 kV/µs dV/dt capability ensures stable operation in tightly coupled multiphase layouts without false triggering or gate oscillation. |
| Networking Point-of-Load | Telecom Baseband Power |
Use Scenario: Intermediate bus conversion (12 V → 3.3 V or 1.2 V) for FPGA, ASIC, or packet processor rails in 1U rack-mounted switches with constrained board area. IC Role / Device Role / Timing Role: Compact, high-efficiency buck stage enabling dense PCB layouts where thermal management relies on GND-plane conduction rather than heatsinks. Use Value: SON 3.5 × 4.5 mm footprint saves >30% board space vs. discrete driver + MOSFET solutions; RθJB = 2.5°C/W enables passive cooling. |
Use Scenario: Power delivery to RF front-end baseband processors in 5G small cells requiring low-noise, high-transient-response supplies with minimal EMI impact on sensitive analog sections. IC Role / Device Role / Timing Role: Low-inductance power stage minimizing VSW node ringing and conducted emissions; integrated bootstrap diode reduces component count and layout sensitivity. Use Value: Measured power loss curves (not RDS(on)) allow accurate thermal prediction across varying load profiles - critical for field-replaceable modules with fixed airflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372Q5M | Same SON 3.5 × 4.5 mm package but rated for 35 A continuous; higher RDS(on) on Sync FET increases light-load losses. | Better suited for higher-current single-phase designs (>30 A) where thermal headroom exists; less optimal for Connected Standby due to higher quiescent current (250 µA). | Select CSD95372Q5M only when peak current exceeds 25 A and system airflow supports higher power loss. |
| MP86957 | Monolithic buck converter (integrated controller); 30 A continuous; no tri-state SKIP# or ULQ mode; requires external compensation. | Reduces BOM count but lacks diode emulation flexibility and deep-standby capability - unsuitable for Windows Connected Standby or dynamic DCM/FCCM transitions. | Choose MP86957 only for cost-sensitive, fixed-frequency applications without light-load efficiency or low-power state requirements. |
Compared with CSD95375Q4M, CSD95372Q5M offers higher current rating at the expense of light-load efficiency and standby current, while MP86957 trades integration for loss of adaptive conduction-mode control and ULQ functionality - making CSD95375Q4M uniquely suited for high-efficiency, low-quiescent, multi-mode CPU and SoC power delivery.
Availability
CSD95375Q4M is available at Aetrix Electronics and suitable for Ultrabook DC/DC converters, multiphase Vcore solutions, and networking point-of-load applications requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.
Supply support for CSD95375Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 50 years of leadership in high-reliability power conversion solutions.
The CSD95375Q4M belongs to TI's NexFET™ Power Stage product line, engineered specifically for high-frequency, high-density synchronous buck converters in computing, networking, and telecom infrastructure where thermal efficiency, layout simplicity, and system-level validation are critical.
FAQ
What is the maximum input voltage rating for the CSD95375Q4M?
The CSD95375Q4M has an absolute maximum VIN-to-PGND rating of 20 V, with recommended operating conditions specifying up to 16 V. Exceeding 16 V during normal operation risks violating thermal and reliability limits, even if within absolute maximum ratings - TI validates performance and SOA only up to 16 V under defined test conditions.
Does the CSD95375Q4M require an external bootstrap diode?
No, the CSD95375Q4M integrates a bootstrap switch that replaces the traditional external bootstrap diode. The internal FET, gated by the DRVL signal, provides lower forward voltage and improved gate drive stability - eliminating one component, reducing layout sensitivity, and improving reliability over discrete diode solutions.
How does the SKIP# pin affect light-load efficiency in the CSD95375Q4M?
When SKIP# is pulled low, the CSD95375Q4M enables zero-crossing detection and enters diode emulation mode (DCM), turning off the sync FET at inductor current zero-crossing to eliminate reverse conduction losses. This increases light-load efficiency significantly compared to forced continuous conduction mode (FCCM), which maintains switching regardless of load.
What thermal interface is required beneath the CSD95375Q4M package?
The CSD95375Q4M relies on its exposed thermal pad (connected internally to PGND) for heat dissipation. TI recommends connecting this pad to a large internal or bottom-side GND plane using ≥9 thermal vias (10-mil drill, 16-mil pad), tented on the opposite side, to achieve the specified RθJB of 2.5°C/W - no thermal interface material is required or recommended.
Can the CSD95375Q4M operate with a 3.3 V PWM signal?
Yes, the CSD95375Q4M PWM input is compatible with both 3.3 V and 5 V logic levels. Its VIH threshold is 2.65 V and VIL is 0.6 V, with hysteresis of 0.2 V - ensuring robust noise immunity and reliable operation across standard logic families without level-shifting circuitry.
CSD95375Q4M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 25A
- Current - Peak Output:
- 60A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD95375Q4M FAQ
1.How can I place an order for CSD95375Q4M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95375Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95375Q4M reliable?
The price and inventory of CSD95375Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95375Q4M is usually 5 days.
3.What payment methods are accepted for CSD95375Q4M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95375Q4M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95375Q4M?
CSD95375Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95375Q4M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95375Q4M?
For technical support, including CSD95375Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95375Q4M requirements.
6.How does Aetrix verify that CSD95375Q4M is sourced from the original manufacturer or authorized distributors?
All CSD95375Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95375Q4M meets industry standards.
7.What is the process for return or replacement of CSD95375Q4M?
All CSD95375Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95375Q4M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95375Q4M part is unused and in its original packaging.
Return procedure for CSD95375Q4M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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