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Texas Instruments CSD95377Q4M
- Part No.:
- CSD95377Q4M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD95377Q4M.pdf
- Description:
- IC HALF BRIDGE DRIVER 30A 8VSON
- Quantity:
- Payment:
- Shipping:
Inventory:17,407
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Product details
Overview
CSD95377Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5 mm × 4.5 mm SON package. It delivers up to 35 A continuous output current, supports input voltages up to 16 V, operates at switching frequencies up to 2 MHz, and achieves >94% system efficiency at 15 A - designed for high-density point-of-load regulation in server and telecom power supplies.
For engineers reviewing the CSD95377Q4M datasheet, CSD95377Q4M pinout, CSD95377Q4M application, or CSD95377Q4M equivalent, key selection considerations include its tri-state PWM/SKIP# interface compatibility with 3.3-V/5-V controllers, integrated bootstrap diode, shoot-through protection, diode emulation mode for light-load efficiency, and ultra-low-inductance package enabling >10 kV/µs dV/dt capability.
Technical Context
The CSD95377Q4M implements a fully integrated gate driver with adaptive zero-crossing detection for discontinuous conduction mode (DCM), configurable via SKIP# pin logic. Its driver architecture includes integrated bootstrap FET (replacing discrete diode), UVLO with 4.15 V turn-on and 3.7 V shutdown thresholds, and tri-state input buffers on both PWM and SKIP# pins with defined voltage windows (1.3–2 V) and sub-100 ns exit latency.
It operates as a two-terminal power switch: VIN and PGND supply input power; VSW connects to output inductor; BOOT/BOOT_R form the bootstrap network; and PWM/SKIP# accept controller-level signals. The device supports forced continuous conduction mode (FCCM) and diode emulation mode, with quiescent currents of 130 µA (LQ) and 8 µA (ULQ) depending on control pin states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 35 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load-handling capability under thermal limits. |
| Switching Frequency Range | 200–2000 kHz - enables high-frequency operation for smaller magnetics and faster transient response. |
| Input Voltage Range | Up to 16 V - supports 12-V intermediate bus architectures common in server and networking systems. |
| System Efficiency | >94% at 15 A - measured at VIN = 12 V, VOUT = 1.8 V, fSW = 500 kHz - directly reduces thermal load and improves power density. |
| Package Thermal Resistance | RθJB = 2.5 °C/W - low junction-to-board resistance enables effective heat transfer to PCB copper layers. |
| dV/dt Rating | >10 kV/µs - verified switching node slew rate requiring careful layout to suppress EMI and prevent false triggering. |
| UVLO Thresholds | 4.15 V (rising), 3.7 V (falling) with 0.2 V hysteresis - ensures robust startup and fault recovery under brownout conditions. |
Pinout & Package
Package: SON (Small Outline No-lead), 3.5 mm × 4.5 mm, 9-pin, exposed thermal pad (PGND-connected). Optimized for low-inductance, high-current PCB routing with symmetric power and ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Tri-state mode control input | Low = diode emulation enabled (DCM); high = FCCM; tri-state = ultra-low-quiescent (8 µA) shutdown. |
| 2: VDD | Driver supply rail | 4.5–5.5 V gate drive and logic supply; internal UVLO monitoring ensures safe startup. |
| 3 & 9: PGND | Power ground return | Dual thermal and current-carrying ground pins tied to exposed pad - critical for low-impedance return path and thermal dissipation. |
| 4: VSW | Switching node | High-slew-rate connection to output inductor; requires minimized trace length to reduce EMI and ringing. |
| 5: VIN | Main input power | Accepts up to 16 V DC; must be decoupled with low-ESR ceramics placed adjacent to pin. |
| 6: BOOT_R | Bootstrap reference | Internally connected to VSW; forms low-impedance return for bootstrap capacitor (min 0.1 µF). |
| 7: BOOT | Bootstrap supply | Drives high-side FET gate; voltage clamped to ≤25 V relative to PGND - enables efficient high-side switching. |
| 8: PWM | Tri-state PWM input | Logic high/low controls FET pairing; tri-state (1.3–2 V) forces both gates low and enters low-power state. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap FET | Replaces external bootstrap diode, reducing conduction loss and improving reliability over temperature. |
| Diode Emulation + FCCM Selectability | SKIP# pin configures DCM for light-load efficiency or FCCM for ripple-sensitive applications like DDR memory rails. |
| Shoot-Through Protection | Hardware-level dead-time control prevents simultaneous high-side/low-side FET conduction - eliminates destructive shoot-through current. |
| 3.3-V / 5-V PWM Compatible | VIH = 2.65 V, VIL = 0.6 V with hysteresis - interoperates with legacy and modern controllers without level-shifting. |
| Ultra-Low Quiescent Current Modes | 130 µA (LQ) with PWM tri-stated; 8 µA (ULQ) with both PWM and SKIP# tri-stated - extends standby efficiency. |
Applications
| Server VR12.x Core Regulator | Telecom Baseband Power Supply |
|---|---|
Use Scenario: Regulating CPU Vcore at 0.8–1.8 V with dynamic load steps up to 35 A in multi-phase 12-V input systems. IC Role / Device Role / Timing Role: Synchronous buck power stage providing fast transient response and high efficiency across 1–2 MHz switching range. Use Value: Enables >94% efficiency at 15 A while maintaining <100 ns PWM response time and supporting VR12.x adaptive voltage positioning (AVP). |
Use Scenario: Point-of-load conversion for FPGA, DSP, and transceiver ICs in 4G/5G baseband units with strict thermal and EMI constraints. IC Role / Device Role / Timing Role: High-density power stage delivering stable 1.2 V/1.8 V/3.3 V rails with diode emulation for burst-mode sleep cycles. Use Value: Reduces board area by 40% vs discrete solutions and maintains <2.5 °C/W thermal resistance for convection-cooled enclosures. |
| Networking Switch ASIC Supply | Graphics Card Memory Rail (GDDR6) |
Use Scenario: Multi-phase 1.0 V supply for high-throughput switch ASICs requiring tight voltage tolerance (<±1%) and rapid load step response. IC Role / Device Role / Timing Role: Low-inductance power stage synchronized to external controller with tri-state PWM for phase shedding. Use Value: Achieves <1.6 W power loss at 15 A (VIN=12 V), minimizing local heating near sensitive SerDes lanes. |
Use Scenario: High-current 1.35 V GDDR6 memory rail operating at 1.5–2 MHz in space-constrained GPU modules. IC Role / Device Role / Timing Role: Fast-switching power stage supporting aggressive dv/dt (>10 kV/µs) while maintaining shoot-through immunity. Use Value: Enables 35 A per phase in 3.5 mm × 4.5 mm footprint - critical for achieving >1000 A total memory current in compact form factors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372Q5M | Same 3.5 mm × 4.5 mm SON package but rated for 40 A continuous; higher RDS(ON) on sync FET increases light-load loss. | Better suited for peak-current-dominated applications (e.g., GPU boost phases); less optimal for constant 35 A loads due to higher conduction loss. | Select when peak current exceeds 35 A and thermal margin allows higher junction temperature. |
| ISL99227B | 40-V max VIN, 40-A rating, integrated current sense; larger 5 mm × 6 mm package; no integrated bootstrap FET. | Targeted at industrial/high-VIN applications; requires external bootstrap diode and adds layout complexity. | Choose for systems needing >16 V input or precise current monitoring - not a drop-in replacement for CSD95377Q4M. |
Compared with CSD95377Q4M, CSD95372Q5M offers higher peak current headroom at the cost of light-load efficiency, while ISL99227B extends input voltage range and adds sensing at the expense of footprint size and component count - making CSD95377Q4M optimal for space-constrained 12-V server and telecom POL designs.
Availability
CSD95377Q4M is available at Aetrix Electronics and suitable for server VR12.x core regulators, telecom baseband power supplies, and networking switch ASIC supplies requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.
Supply support for CSD95377Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion ICs and power stages.
The CSD95377Q4M belongs to TI's NexFET™ power stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in datacenter and communications infrastructure where power density, efficiency, and reliability are critical.
FAQ
What is the maximum continuous output current rating for the CSD95377Q4M?
The CSD95377Q4M is rated for 35 A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz, LOUT = 0.29 µH, and TA = 25°C. This rating assumes proper PCB thermal design with ≥2.5 °C/W junction-to-board resistance and adequate airflow or copper area for heat dissipation. Peak current capability reaches 70 A for short durations (≤10 ms).
Does the CSD95377Q4M require an external bootstrap diode?
No, the CSD95377Q4M integrates a bootstrap FET that replaces the traditional external bootstrap diode. This design reduces conduction loss, improves reliability over temperature, and simplifies layout. A minimum 0.1-µF, 16-V ceramic capacitor must still be placed between BOOT and BOOT_R pins to complete the bootstrap circuit for high-side gate drive.
How does the SKIP# pin affect the CSD95377Q4M's operating mode?
The SKIP# pin selects between diode emulation mode (DCM) and forced continuous conduction mode (FCCM): pulled low → DCM enabled for improved light-load efficiency; pulled high → FCCM active for low-output-ripple operation; tri-stated → ultra-low-quiescent (8 µA) shutdown. The CSD95377Q4M's adaptive zero-crossing comparator activates only when SKIP# is low.
What is the significance of the >10 kV/µs dV/dt rating for the CSD95377Q4M?
The >10 kV/µs dV/dt rating reflects the CSD95377Q4M's ability to sustain extremely fast switching node transitions without false triggering or latch-up. This demands strict PCB layout discipline: minimized VIN–PGND loop area, tight coupling between BOOT/BOOT_R and VSW traces, and placement of input capacitors directly adjacent to the device. Failure to meet these requirements risks EMI emission and erratic operation.
Is the CSD95377Q4M compatible with both 3.3-V and 5-V PWM controllers?
Yes, the CSD95377Q4M PWM input is explicitly designed for 3.3-V and 5-V logic compatibility. Its VIH threshold is 2.65 V and VIL is 0.6 V, with 0.2 V hysteresis - ensuring reliable recognition of logic high/low states across both voltage domains. No external level-shifting circuitry is required when interfacing with standard PMBus or proprietary controllers.
CSD95377Q4M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 30A
- Current - Peak Output:
- 70A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 16V (Max)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD95377Q4M FAQ
1.How can I place an order for CSD95377Q4M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95377Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95377Q4M reliable?
The price and inventory of CSD95377Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95377Q4M is usually 5 days.
3.What payment methods are accepted for CSD95377Q4M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95377Q4M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95377Q4M?
CSD95377Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95377Q4M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95377Q4M?
For technical support, including CSD95377Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95377Q4M requirements.
6.How does Aetrix verify that CSD95377Q4M is sourced from the original manufacturer or authorized distributors?
All CSD95377Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95377Q4M meets industry standards.
7.What is the process for return or replacement of CSD95377Q4M?
All CSD95377Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95377Q4M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95377Q4M part is unused and in its original packaging.
Return procedure for CSD95377Q4M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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