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Texas Instruments CSD95377Q4MT
- Part No.:
- CSD95377Q4MT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD95377Q4MT.pdf
- Description:
- IC HALF BRIDGE DRIVER 30A 8VSON
- Quantity:
- Payment:
- Shipping:
Inventory:497
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Product details
Overview
CSD95377Q4MT from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5 mm × 4.5 mm SON package, delivering up to 35 A continuous output current at 94%+ system efficiency (15 A, VIN=12 V, VOUT=1.8 V), with 500 kHz–2 MHz switching frequency support and tri-state PWM/SKIP# control for server VR12/VR13 point-of-load regulation.
For engineers reviewing the CSD95377Q4MT datasheet, CSD95377Q4MT pinout, CSD95377Q4MT application, or CSD95377Q4MT equivalent, key selection criteria include its integrated bootstrap diode, shoot-through protection, diode emulation mode for DCM light-load efficiency, 3.3-V/5-V PWM compatibility, and thermal performance validated up to 125°C junction temperature.
Technical Context
The CSD95377Q4MT implements a high-speed gate driver with adaptive zero-crossing detection for discontinuous conduction mode (DCM) and forced continuous conduction mode (FCCM) selection via SKIP# pin logic. Its integrated bootstrap FET replaces conventional diodes to maintain BST-SW voltage near VDD, reducing high-side conduction loss.
Functional modes are determined by simultaneous UVLO status, PWM tri-state window (1.3–2 V), and SKIP# state: low enables DCM via ZX comparator; high forces FCCM; tri-state on both inputs yields ultra-low quiescent current (8 µA). The device features shoot-through protection, 40 ns minimum PWM on-time, and 2000 kHz max switching frequency with 0.29 µH recommended output inductance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 35 A at VIN=12 V, VDD=5 V, VOUT=1.8 V, fSW=500 kHz - supports high-density multiphase CPU/GPU VRMs |
| Peak Output Current | 70 A (10 ms pulse, ≤1% duty cycle) - handles transient load steps in server power delivery |
| Switching Frequency Range | 200–2000 kHz - enables compact magnetics and dynamic response tuning for VR12/VR13 compliance |
| System Efficiency | ≥94% at 15 A (VIN=12 V, VOUT=1.8 V) - reduces thermal load and improves power density in 1U systems |
| Junction Temperature Range | –40°C to +125°C - validated for sustained operation in telecom and enterprise server environments |
| Power Loss | 1.6 W at 15 A, 25°C; 1.8 W at 15 A, 125°C - measured total device loss including gate drive and conduction |
| PWM Input Compatibility | 3.3 V and 5 V logic levels with VIH=2.65 V, VIL=0.6 V - interoperable with TI UCD92xx, ISL63xx, and IR35xx controllers |
Pinout & Package
Package: SON (Small Outline No-lead), 3.5 mm × 4.5 mm, 9-pin, exposed thermal pad. Optimized for low-inductance PCB layout with symmetric PGND connections and integrated bootstrap switch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Diode emulation mode control input | Low = DCM enabled (light-load efficiency); High = FCCM forced; Tri-state = ultra-low-power shutdown (8 µA) |
| 2: VDD | Driver supply rail | 4.5–5.5 V gate drive source; powers internal logic and bootstrap circuitry; UVLO thresholds at 4.15 V (rising), 3.7 V (falling) |
| 3 & 9: PGND | Power ground return path | Dual thermal and current-carrying ground pins; must be connected to PCB ground plane and external capacitors |
| 4: VSW | Switching node | Connects directly to output inductor; carries high dv/dt; requires minimized trace length to reduce EMI and ringing |
| 5: VIN | Main input supply | 16 V max input; connects to bulk and ceramic input capacitors placed adjacent to minimize loop inductance |
| 6: BOOT_R | Bootstrap capacitor reference | Internally tied to VSW; accepts 0.1 µF ceramic cap between BOOT and BOOT_R for high-side FET gate drive |
| 7: BOOT | Bootstrap supply node | Drives high-side FET gate; integrated bootstrap FET eliminates external diode and reduces voltage drop |
| 8: PWM | Tri-state PWM command input | Logic high = HS on / LS off; Logic low = HS off / LS on; Tri-state (1.3–2 V) = zero-latency shutdown (130 µA standby) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap FET | Replaces discrete bootstrap diode, reducing forward voltage drop and improving high-side gate drive stability at high frequencies |
| Adaptive Zero-Crossing Detection | Enables precise DCM entry/exit without external sensing; maintains efficiency down to <1 A load in server idle states |
| Shoot-Through Protection | Hardware-level dead-time enforcement prevents simultaneous HS/LS FET conduction, eliminating catastrophic failure risk |
| System-Optimized PCB Footprint | Asymmetric pin layout minimizes high-current loop area; dual PGND pins and thermal pad support >200 W/in² power density |
| Tri-State PWM & SKIP# Inputs | Zero-latency entry/exit from low-power states; tTSKF <1 ns, t3RD(PWM) = 100 ns - enables rapid dynamic voltage scaling (DVS) |
Applications
| Server Point-of-Load Regulation | Graphics Card VRM |
|---|---|
Use Scenario: Primary 1.8 V core supply for dual-socket Xeon Scalable processors in 2U rack servers. IC Role / Device Role / Timing Role: Synchronous buck power stage in 4-phase interleaved VRM; receives PWM commands from TI UCD9248 controller. Use Value: Delivers 35 A per phase with <1.8 W loss at 125°C, enabling 94% system efficiency and eliminating need for active cooling on VRM PCB. |
Use Scenario: GPU core voltage regulation in NVIDIA A100 PCIe accelerator cards with dynamic load ranging 0–600 A. IC Role / Device Role / Timing Role: High-frequency (1.2 MHz) power stage in 12-phase VRM; leverages diode emulation mode during GPU frame buffer idle periods. Use Value: Reduces light-load power loss by 42% vs fixed-frequency CCM, extending card thermal headroom during compute-light workloads. |
| Networking ASIC Supply | DDR Memory VDDQ Regulation |
Use Scenario: 1.0 V supply for 100G Ethernet switch ASICs requiring fast transient response and low noise. IC Role / Device Role / Timing Role: Single-phase buck stage operating at 1.5 MHz; uses 0.22 µH inductor and tight-layout design to meet CISPR-22 Class B EMI limits. Use Value: Achieves <20 mVpp output ripple and <500 ns load-step recovery time, meeting IEEE 802.3bj jitter specifications for SerDes lanes. |
Use Scenario: 1.35 V VDDQ supply for DDR4 LRDIMMs in high-memory-density storage servers. IC Role / Device Role / Timing Role: Multiphase power stage synchronized to memory controller clock; employs FCCM mode during burst writes to suppress sub-harmonic oscillation. Use Value: Maintains ±15 mV output regulation across –40°C to +85°C ambient, ensuring JEDEC-compliant DDR4 timing margins under all thermal conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IR35203 | 6×6 mm QFN, 40 A continuous rating, integrated current sense; lacks diode emulation mode and tri-state shutdown | Requires external current-sense resistor and separate enable logic; higher board area but supports PMBus telemetry | Choose for telemetry-enabled VRMs where digital monitoring outweighs light-load efficiency gains |
| ON Semiconductor NCP3232 | 5×6 mm TDFN, 30 A continuous, 500 kHz max fSW; includes integrated bootstrap diode but no adaptive ZX detection | Fixed-frequency operation only; lower peak current capability limits use in high-transient GPU applications | Choose for cost-sensitive networking PoL where 30 A suffices and DCM optimization is not required |
Compared with IR35203 and NCP3232, the CSD95377Q4MT delivers superior light-load efficiency via adaptive DCM, smaller footprint (3.5×4.5 mm), and faster transient response due to 2 MHz capability-making it optimal for space-constrained, thermally aggressive server and AI accelerator designs.
Availability
CSD95377Q4MT is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery, networking ASIC supplies, and DDR memory regulation requiring stable component supply across multi-year production cycles.
Supply support for CSD95377Q4MT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management ICs and high-performance analog solutions.
The CSD95377Q4MT belongs to TI's NexFET™ power stage product line, engineered specifically for high-efficiency, high-density synchronous buck converters in datacenter and telecommunications infrastructure.
FAQ
What is the maximum continuous output current rating for CSD95377Q4MT?
The CSD95377Q4MT is rated for 35 A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz, LOUT = 0.29 µH, and TA = 25°C. This rating is validated up to 125°C junction temperature with appropriate PCB thermal design per TI's layout guidelines.
Does CSD95377Q4MT support both 3.3-V and 5-V PWM input signals?
Yes, the CSD95377Q4MT supports both 3.3-V and 5-V PWM logic levels. Its input thresholds are VIH = 2.65 V (minimum high) and VIL = 0.6 V (maximum low), with a tri-state window of 1.3–2.0 V. This ensures reliable interface with TI UCD92xx, Intersil ISL63xx, and Renesas RAA22912x controllers without level-shifting.
How does the SKIP# pin affect CSD95377Q4MT operation?
The SKIP# pin controls conduction mode: pulled low enables diode emulation and discontinuous conduction mode (DCM) for improved light-load efficiency; pulled high forces forced continuous conduction mode (FCCM); left floating or tri-stated places the driver in ultra-low-quiescent-current mode (8 µA). The CSD95377Q4MT's adaptive zero-crossing comparator ensures precise DCM entry/exit without external components.
What package type and dimensions does CSD95377Q4MT use?
The CSD95377Q4MT uses a SON (Small Outline No-lead) package measuring 3.5 mm × 4.5 mm with 9 terminals and an exposed thermal pad. It is supplied in a 7-inch reel with 250 units per reel (orderable part CSD95377Q4MT), distinct from the 13-inch reel variant CSD95377Q4M (2500 units).
Is an external bootstrap diode required when using CSD95377Q4MT?
No, the CSD95377Q4MT integrates a bootstrap FET that replaces the traditional external bootstrap diode. A 0.1 µF ceramic capacitor is still required between BOOT and BOOT_R pins, but no external diode is needed-reducing component count, improving reliability, and lowering forward voltage drop during high-side gate charging.
CSD95377Q4MT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 30A
- Current - Peak Output:
- 70A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 16V (Max)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD95377Q4MT FAQ
1.How can I place an order for CSD95377Q4MT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95377Q4MT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95377Q4MT reliable?
The price and inventory of CSD95377Q4MT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95377Q4MT is usually 5 days.
3.What payment methods are accepted for CSD95377Q4MT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95377Q4MT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95377Q4MT?
CSD95377Q4MT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95377Q4MT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95377Q4MT?
For technical support, including CSD95377Q4MT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95377Q4MT requirements.
6.How does Aetrix verify that CSD95377Q4MT is sourced from the original manufacturer or authorized distributors?
All CSD95377Q4MT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95377Q4MT meets industry standards.
7.What is the process for return or replacement of CSD95377Q4MT?
All CSD95377Q4MT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95377Q4MT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95377Q4MT part is unused and in its original packaging.
Return procedure for CSD95377Q4MT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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