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Texas Instruments CSD95378BQ5M
- Part No.:
- CSD95378BQ5M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerLFDFN
- Datasheet:
-
CSD95378BQ5M.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 12LSON
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CSD95378BQ5M from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and high- and low-side MOSFETs in a single 5-mm × 6-mm LSON-CLIP package. It delivers 60-A continuous output current, achieves 93.4% system efficiency at 30 A (VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz), and supports up to 1.25-MHz switching for high-density POL DC-DC converters in server VR12.x and graphics card applications.
For engineers reviewing the CSD95378BQ5M datasheet, CSD95378BQ5M pinout, CSD95378BQ5M application, or CSD95378BQ5M equivalent, key selection criteria include its integrated bi-directional current sense with temperature compensation, analog temperature output (400 mV at 0°C), fault monitoring (high-side short/overcurrent/overtemperature), and tri-state PWM input compatibility with both 3.3-V and 5-V controllers.
Technical Context
The CSD95378BQ5M implements a fully integrated synchronous buck power stage with an internal gate driver optimized for shoot-through protection via programmable dead time. Its control architecture supports both forced continuous conduction mode (FCCM) and diode emulation mode, selected via the FCCM pin.
Current sensing uses a temperature-compensated bi-directional amplifier referenced to REFIN, with IOUT providing a proportional voltage output. Thermal monitoring is implemented via TAO/FAULT, delivering a 400-mV-per-degree-Celsius analog voltage referenced to 0°C, enabling multiphase thermal OR-ing without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-stage high-current CPU/GPU core regulation |
| Peak Output Current | 90 A for tp = 50 µs - supports transient load demands in VR12.x applications |
| Switching Frequency | Up to 1.25 MHz - allows smaller magnetics and faster transient response in space-constrained designs |
| System Efficiency | 93.4% at 30 A - reduces thermal load and improves power density in multi-phase systems |
| Power Loss | 2.8 W at 30 A - directly lowers heatsink requirements and improves reliability |
| Junction-to-Board Thermal Resistance | 1.5 °C/W - enables effective heat transfer to PCB ground plane without external heatsinks |
| Operating Temperature Range | –40°C to +125°C - supports industrial and server environments with high ambient temperatures |
Pinout & Package
The CSD95378BQ5M is housed in a 12-pin LSON-CLIP (DQP) thermally enhanced package measuring 5.0 mm × 6.0 mm with exposed thermal pad. The package features ultra-low inductance and system-optimized PCB footprint for minimal loop area and EMI reduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Provides voltage proportional to phase current; used for closed-loop current-mode control and OCP |
| REFIN | Current sense reference input | Sets zero-current baseline for bi-directional current measurement; requires stable external reference |
| PWM | Tri-state PWM input | Accepts 3.3-V/5-V logic; Hi-Z state actively pulls both FET gates low for safe shutdown |
| ENABLE | Global enable input | Logic HIGH enables operation; internal 100-kΩ pulldown ensures safe default-off state |
| FCCM | Mode selection input | LOW enables diode emulation; HIGH forces continuous conduction - selectable per-phase optimization |
| TAO/FAULT | Temperature analog output / fault indicator | Outputs 400 mV/°C; pulled to 3.3 V during thermal shutdown; supports multiphase thermal OR-ing |
| VIN | Main power input | Connects to bulk input capacitors; rated for 16-V max continuous operation |
| VSW | Switch node | Connects HS source and LS drain; interfaces directly to output inductor; critical for layout EMI control |
| BOOT & BOOT_R | Bootstrap supply path | Integrated bootstrap diode eliminates external component; BOOT_R is internal return to VSW |
| VDD | Driver supply | 4.5–5.5 V gate drive rail; powers internal logic and gate drivers |
| PGND (pins 4 & 13) | Power ground | Dual PGND pins minimize ground bounce; must be connected to low-impedance thermal pad |
Key Features
| Feature | Design Value |
|---|---|
| Integrated high- and low-side NexFET™ MOSFETs + driver | Eliminates discrete driver/MOSFET layout complexity and timing mismatch; enables <10-ns dead-time control |
| Temperature-compensated bi-directional current sense | Enables accurate phase-current balancing across multiphase rails without external gain/offset calibration |
| Analog temperature output (400 mV/°C) | Allows direct ADC interfacing for real-time die temperature monitoring and thermal throttling |
| Integrated bootstrap diode | Removes need for external bootstrap diode, reducing BOM count and improving reliability in high-frequency operation |
| High-density 5-mm × 6-mm LSON-CLIP package | Reduces PCB area by >30% vs. comparable QFN solutions while maintaining superior thermal performance (RθJB = 1.5 °C/W) |
Applications
| Server VR12.x Core Regulation | GPU Memory Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient regulation for Intel VR12.x-compliant CPU cores in dual-socket servers. IC Role / Device Role / Timing Role: Synchronous buck power stage receiving PWM commands from VR controller; provides precise Vcore with <100-ns response to load steps. Use Value: 60-A continuous rating and 90-A peak capability meet VR12.x IMVP-8 dynamic current requirements while 93.4% efficiency at 30 A reduces system cooling load. | Use Scenario: Compact, high-efficiency power delivery to GDDR6 memory on AI accelerator cards. IC Role / Device Role / Timing Role: POL converter stage operating at 1.25 MHz to minimize inductor size; synchronized via external clock for EMI spreading. Use Value: Ultra-low-inductance LSON-CLIP package and optimized PCB footprint reduce switching losses and enable <8-mm² solution size per phase. |
| Multiphase Desktop VR11.x Converters | High-Density Network Switch POL |
Use Scenario: Multi-phase buck regulator for AMD FX-series processors requiring tight voltage tolerance and rapid load-step response. IC Role / Device Role / Timing Role: One phase of a 4–6-phase VR11.x system; communicates thermal status via TAO/FAULT wire-OR bus to master controller. Use Value: Diode emulation mode (FCCM = LOW) improves light-load efficiency; temperature-compensated current sense ensures phase current balance across all phases. | Use Scenario: Point-of-load regulation for 12-V to 1.8-V conversion in 1U network switches with strict airflow and thermal constraints. IC Role / Device Role / Timing Role: High-frequency (1 MHz) buck stage with forced CCM operation to maintain regulation under burst-mode traffic loads. Use Value: RθJB = 1.5 °C/W enables full 60-A operation without heatsink; RoHS-compliant, halogen-free construction meets networking equipment environmental standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck smart power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372BQ5M | Lower 40-A continuous rating; identical 5-mm × 6-mm LSON-CLIP package and pinout; same current/temp sensing architecture | Better suited for mid-range VR11.x desktop CPUs or lower-power FPGA rails where 60-A headroom is unnecessary | Select when system peak current stays below 45 A and cost optimization is prioritized over margin |
| ISL99227IRZ | 60-A rating with 3.3-V-only PWM compatibility; no integrated bootstrap diode; different pin assignment for current sense and thermal outputs | Requires external bootstrap diode and level-shifting for 5-V controllers; lacks TAO wire-OR capability for multiphase thermal reporting | Choose only if existing design uses Intersil controllers and layout can accommodate revised pin mapping and added components |
Compared with CSD95372BQ5M, the CSD95378BQ5M provides higher current headroom and identical integration, making it preferable for VR12.x and GPU applications; versus ISL99227IRZ, it offers superior controller interface flexibility, reduced BOM count, and multiphase thermal management-critical for server-class reliability.
Availability
CSD95378BQ5M is available at Aetrix Electronics and suitable for server VR12.x core regulation, GPU memory power delivery, and high-density network switch POL applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95378BQ5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion solutions.
The CSD95378BQ5M belongs to TI's NexFET™ smart power stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in datacenter, AI accelerator, and high-end computing applications where power density and thermal performance are critical.
FAQ
What is the maximum continuous output current rating for the CSD95378BQ5M?
The CSD95378BQ5M is rated for 60-A continuous output current under standard test conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and LOUT = 0.225 µH at TA = 25°C. This rating assumes proper PCB thermal design with adequate copper area for heat dissipation. Peak current capability reaches 90 A for short durations (tp = 50 µs), supporting demanding VR12.x transient specifications. Derating applies at elevated ambient temperatures or reduced airflow.
Does the CSD95378BQ5M support both 3.3-V and 5-V PWM input signals?
Yes, the CSD95378BQ5M PWM input is explicitly designed to be compatible with both 3.3-V and 5-V logic levels, as confirmed in the official datasheet features list. Its tri-state PWM architecture accepts either voltage level without external level-shifting circuitry. When the PWM pin is left floating or driven to Hi-Z, the device enters a safe state where both high-side and low-side FET gates are actively pulled low after the tri-state shutdown hold-off time (t3HT), preventing shoot-through.
How does the temperature sensing function work on the CSD95378BQ5M?
The CSD95378BQ5M provides analog temperature output via the TAO/FAULT pin, delivering a linear 400 mV/°C signal referenced to 0°C (i.e., 400 mV at 0°C). During normal operation, this voltage reflects die temperature; if thermal shutdown occurs, TAO is pulled to 3.3 V to signal fault. In multiphase systems, multiple CSD95378BQ5M devices can share a single TAO line using integrated ORing diodes - only the highest reported temperature appears at the controller, enabling centralized thermal monitoring without additional components.
What package type and dimensions does the CSD95378BQ5M use?
The CSD95378BQ5M uses the LSON-CLIP (DQP) package - a 12-pin, thermally enhanced leadless package measuring 5.0 mm × 6.0 mm with an exposed thermal pad. Its mechanical drawing specifies D2 = 5.3–5.5 mm, E = 5.9–6.1 mm, and height A = 1.4–1.5 mm. This ultra-low-inductance package is optimized for high-frequency operation and integrates clip-based power connections to minimize parasitic inductance, directly contributing to the device's 93.4% efficiency at 30 A.
Can the CSD95378BQ5M operate in diode emulation mode, and how is it enabled?
Yes, the CSD95378BQ5M supports diode emulation mode to improve light-load efficiency. This mode is enabled by pulling the FCCM pin LOW; when FCCM is HIGH, the device operates in forced continuous conduction mode (FCCM). An internal 5-µA current source pulls FCCM to 3.3 V if left floating, defaulting to FCCM operation. Diode emulation disables the synchronous rectifier during off-time, allowing body-diode conduction - beneficial for applications with highly variable or low average load currents such as idle states in CPU voltage regulation.
CSD95378BQ5M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerLFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-LSON-CLIP (5x6)
CSD95378BQ5M FAQ
1.How can I place an order for CSD95378BQ5M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95378BQ5M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95378BQ5M reliable?
The price and inventory of CSD95378BQ5M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95378BQ5M is usually 5 days.
3.What payment methods are accepted for CSD95378BQ5M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95378BQ5M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95378BQ5M?
CSD95378BQ5M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95378BQ5M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95378BQ5M?
For technical support, including CSD95378BQ5M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95378BQ5M requirements.
6.How does Aetrix verify that CSD95378BQ5M is sourced from the original manufacturer or authorized distributors?
All CSD95378BQ5M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95378BQ5M meets industry standards.
7.What is the process for return or replacement of CSD95378BQ5M?
All CSD95378BQ5M units undergo pre-shipment inspection (PSI). If there is an issue with CSD95378BQ5M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95378BQ5M part is unused and in its original packaging.
Return procedure for CSD95378BQ5M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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