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Texas Instruments CSD95378BQ5MC
- Part No.:
- CSD95378BQ5MC
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD95378BQ5MC.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 12VSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,012
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Product details
Overview
CSD95378BQ5MC from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single 12-pin VSON-CLIP package. It delivers 60-A continuous output current at 1.2 V, achieves 93.4% system efficiency at 30 A, and supports up to 1.25 MHz switching frequency - optimized for high-density multiphase VR12.x/Vcore and POL DC-DC converters in server and graphics applications.
For engineers reviewing the CSD95378BQ5MC datasheet, CSD95378BQ5MC pinout, CSD95378BQ5MC application, or CSD95378BQ5MC equivalent, key selection criteria include its integrated bidirectional current sense, analog temperature output (400 mV at 0°C), tri-state PWM compatibility, and DualCool™ thermal performance in a 5.0 mm × 6.0 mm footprint.
Technical Context
The CSD95378BQ5MC implements a high-frequency synchronous buck power stage with integrated gate driver, high-side and low-side NexFET™ MOSFETs, and precision sensing circuitry. It supports diode emulation mode via FCCM pin control and forced continuous conduction mode (FCCM) for light-load efficiency optimization.
Its architecture includes an integrated bootstrap diode, optimized dead-time control to prevent shoot-through, and temperature-compensated bidirectional current sensing referenced to REFIN. The TAO/FAULT pin provides analog die temperature reporting with built-in ORing diode for multiphase thermal monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support of high-current CPU/GPU cores. |
| Peak Output Current | 90 A for tp = 50 µs - sustains transient load steps without voltage droop in VR12.x compliance designs. |
| Switching Frequency | Up to 1.25 MHz - allows smaller magnetics and faster transient response in space-constrained server modules. |
| System Efficiency | 93.4% at 30 A, VIN = 12 V, VOUT = 1.2 V - reduces thermal load and improves power density in multi-phase arrays. |
| Power Loss | 2.8 W at 30 A - directly enables lower heatsink requirements and higher ambient operating temperatures. |
| Thermal Resistance | RθJB = 1.5 °C/W - ensures efficient heat transfer to PCB ground plane, critical for sustained 60-A operation. |
| Operating Junction Temp | –55°C to +150°C - supports industrial and extended-temperature server environments. |
Pinout & Package
Package: VSON-CLIP (DMC), 12-pin, 5.0 mm × 6.0 mm outline with exposed thermal pad; RoHS-exempt, Sn lead finish, MSL Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Delivers voltage proportional to phase current (IOUT – REFIN ∝ IPHASE) for accurate real-time monitoring and protection. |
| REFIN | Current sense reference input | External reference point for bidirectional current sensing; enables precise zero-current detection and phase balancing. |
| PWM | Tri-state PWM input | Accepts 3.3-V/5-V logic; Hi-Z state actively pulls both FET gates low after t3HT timeout - simplifies controller interface and fault safety. |
| ENABLE | Global enable control | Logic-high enables operation; internal 100-kΩ pulldown ensures safe shutdown if left floating - eliminates need for external pull-down. |
| FCCM | Diode emulation / FCCM mode select | Low = diode emulation (light-load efficiency); high = forced CCM (output ripple control); internal 5-µA pull-up defaults to FCCM mode. |
| TAO/FAULT | Analog temperature output / fault indicator | Outputs 400 mV at 0°C with ±1.5°C accuracy; pulled to 3.3 V during thermal shutdown - enables single-wire multiphase thermal ORing. |
| BOOT / BOOT_R | Bootstrap supply path | Integrated bootstrap diode eliminates external component; BOOT_R connects internally to VSW - reduces BOM count and layout complexity. |
| VIN / VSW / PGND | Main power terminals | VIN supplies input rail; VSW connects to inductor node; dual PGND pins (4 & 13) minimize ground loop inductance - critical for EMI and stability. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete gate driver design, reduces layout sensitivity, and guarantees matched timing between HS/LS switches. |
| DualCool™ packaging | Exposes die top surface through clip for direct heatsink contact - lowers junction-to-case thermal resistance to 5°C/W. |
| Temperature-compensated current sense | Maintains ±3% current measurement accuracy across –40°C to +125°C ambient - enables reliable phase current balancing. |
| System-optimized PCB footprint | Minimizes loop area for VIN–PGND–VSW paths - reduces radiated EMI and improves high-frequency stability without added filtering. |
| Ultra-low-inductance package | Reduces switching node ringing and dv/dt-induced losses - supports clean 1.25-MHz operation with minimal snubbing. |
Applications
| Server VR12.x V-core Converter | GPU Memory Rail POL |
|---|---|
Use Scenario: High-current, fast-transient CPU core voltage regulation in dual-socket servers compliant with Intel VR12.x specification. IC Role / Device Role / Timing Role: Single-phase smart power stage delivering up to 60 A per phase with sub-100 ns PWM response and synchronized multiphase current sharing. Use Value: Enables compact 3+1 or 4+1 phase VR designs with <1.5% output voltage deviation under 50-A/µs load steps - meeting VR12.x dynamic response requirements. |
Use Scenario: Point-of-load regulation for GDDR6 memory on AI accelerator cards requiring stable 1.35 V at up to 45 A per rail. IC Role / Device Role / Timing Role: High-efficiency buck stage supporting 1.25-MHz switching to shrink filter size while maintaining tight 10-mV ripple spec. Use Value: Achieves 92.8% efficiency at 45 A, reducing localized heating near memory stacks and enabling denser board layouts without thermal throttling. |
| Desktop High-End Graphics Card | AI Inference Accelerator Module |
Use Scenario: Multi-phase GPU core voltage regulation in enthusiast-class graphics cards with dynamic power envelopes exceeding 400 W. IC Role / Device Role / Timing Role: Synchronous buck stage with integrated current/temperature sensing for real-time phase shedding and thermal derating. Use Value: Bidirectional current sense and TAO/FAULT pin allow controller to dynamically disable phases based on die temperature - extending reliability under sustained boost clocks. |
Use Scenario: Distributed 0.8 V/50 A power delivery for ASIC-based inference accelerators in edge data centers with strict airflow constraints. IC Role / Device Role / Timing Role: High-density power stage mounted directly beneath ASIC die using thermal clip interface for direct conduction cooling. Use Value: DualCool™ package enables 30% lower junction temperature vs. standard QFN - sustaining full 50-A load at 85°C ambient without fan speed increase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck smart power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490RWER | 60-A rating, 1.2-MHz max fSW, same VSON-CLIP package but no integrated TAO output - uses digital thermal alert only. | Lacks analog temperature reporting; requires external ADC or controller with thermal monitoring capability. | Choose when system already implements digital thermal management and analog TAO integration adds unnecessary complexity. |
| ISL99227BIRZ | 60-A rating, 1.5-MHz max fSW, 4.5-mm × 5.0-mm package, integrated PMBus telemetry but no FCCM pin - fixed CCM-only operation. | No diode emulation mode; higher light-load power loss; requires PMBus host for configuration and monitoring. | Prefer when telemetry, programmability, and highest-frequency operation outweigh need for adaptive light-load efficiency. |
Compared with CSD95378BQ5MC, CSD95490RWER omits analog temperature output but retains identical current sensing and thermal performance, while ISL99227BIRZ trades FCCM flexibility for PMBus configurability and slightly higher frequency - making CSD95378BQ5MC optimal for cost-sensitive, thermally constrained VR12.x designs needing analog thermal feedback.
Availability
CSD95378BQ5MC is available at Aetrix Electronics and suitable for server VR12.x V-core converters, GPU memory POL rails, and AI accelerator module power delivery requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CSD95378BQ5MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and signal chain solutions.
The CSD95378BQ5MC belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-current, high-frequency synchronous buck applications in computing, graphics, and AI infrastructure where thermal density and transient response are critical.
FAQ
What is the maximum continuous output current supported by the CSD95378BQ5MC?
The CSD95378BQ5MC supports 60-A continuous output current under recommended operating conditions: VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz, LOUT = 0.225 µH, and TA = 25°C. This rating assumes proper PCB thermal design with adequate copper area for the exposed thermal pad and dual PGND connections. Peak current capability reaches 90 A for short-duration transients (tp = 50 µs).
Does the CSD95378BQ5MC require an external bootstrap diode?
No, the CSD95378BQ5MC integrates a bootstrap diode internally between BOOT and BOOT_R pins. This eliminates the need for an external component and reduces layout complexity and BOM count. A minimum 0.1-µF, 16-V X7R ceramic capacitor must still be placed between BOOT and BOOT_R to ensure reliable high-side FET gate drive under all operating conditions.
How does the TAO/FAULT pin function in multiphase systems using multiple CSD95378BQ5MC devices?
In multiphase configurations, the TAO/FAULT pins of all CSD95378BQ5MC units are wired together in a wired-OR configuration. Due to the integrated ORing diode, only the highest die temperature among all phases is reported on the shared line. If any device enters thermal shutdown, its TAO/FAULT pin pulls up to 3.3 V, signaling a system-level fault condition to the controller - enabling coordinated thermal management across the entire VR.
What PWM logic levels are compatible with the CSD95378BQ5MC?
The CSD95378BQ5MC PWM input is compatible with both 3.3-V and 5-V logic signals. Its tri-state architecture interprets logic high as HS-on/LS-off, logic low as HS-off/LS-on, and high-impedance (Hi-Z) as both FETs off after the t3HT hold-off time (~1 µs). This flexibility allows seamless interfacing with common VR controllers such as TPS40428 and ISL63xx families without level-shifting circuitry.
What is the purpose of the FCCM pin on the CSD95378BQ5MC?
The FCCM pin selects between diode emulation mode (FCCM = low) and forced continuous conduction mode (FCCM = high). In diode emulation, the low-side FET turns off during light loads to reduce switching losses; in FCCM, both FETs remain active to maintain output ripple control and predictable EMI behavior. An internal 5-µA current source pulls FCCM to 3.3 V if left unconnected, defaulting to FCCM operation.
CSD95378BQ5MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON (5x6)
CSD95378BQ5MC FAQ
1.How can I place an order for CSD95378BQ5MC through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95378BQ5MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95378BQ5MC reliable?
The price and inventory of CSD95378BQ5MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95378BQ5MC is usually 5 days.
3.What payment methods are accepted for CSD95378BQ5MC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95378BQ5MC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95378BQ5MC?
CSD95378BQ5MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95378BQ5MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95378BQ5MC?
For technical support, including CSD95378BQ5MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95378BQ5MC requirements.
6.How does Aetrix verify that CSD95378BQ5MC is sourced from the original manufacturer or authorized distributors?
All CSD95378BQ5MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95378BQ5MC meets industry standards.
7.What is the process for return or replacement of CSD95378BQ5MC?
All CSD95378BQ5MC units undergo pre-shipment inspection (PSI). If there is an issue with CSD95378BQ5MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95378BQ5MC part is unused and in its original packaging.
Return procedure for CSD95378BQ5MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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