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Texas Instruments CSD95410RRBT
- Part No.:
- CSD95410RRBT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95410RRBT.pdf
- Description:
- 90-A PEAK CONTINUOUS SYNCHRONOUS
- Quantity:
- Payment:
- Shipping:
Inventory:100
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Product details
Overview
CSD95410RRBT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single VQFN-CLIP package. It delivers 90-A peak continuous current, operates up to 1.75 MHz, and achieves over 95% system efficiency at 30 A - optimized for high-density VR12.x/VR13.x/VR14.x V-core applications in server and desktop CPU power delivery.
For engineers reviewing the CSD95410RRBT datasheet, CSD95410RRBT pinout, CSD95410RRBT application, or CSD95410RRBT equivalent, key selection criteria include its thermally enhanced topside-cooled QFN-41 package, diode emulation mode, temperature-compensated bi-directional current sensing, and 3.3-V/5-V PWM signal compatibility in multiphase buck converter designs.
Technical Context
The CSD95410RRBT implements a fully integrated half-bridge power stage with an embedded gate driver, high-side and low-side silicon-based NexFET™ MOSFETs, and analog sensing circuitry. Its architecture supports high-frequency switching (up to 1.75 MHz) with optimized dead-time control to prevent shoot-through, while the integrated bootstrap switch eliminates external components.
It features analog temperature output and bi-directional current sense with real-time thermal compensation - enabling precise closed-loop thermal management and accurate phase-current monitoring in multi-phase VR systems. The device accepts tri-state PWM inputs and supports both 3.3-V and 5-V logic-level signals without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Continuous Current | 90 A - supports high-current CPU/GPU core rails without parallel staging |
| System Efficiency | >95% at 30 A - reduces thermal load and improves power density in compact VR modules |
| Switching Frequency | Up to 1.75 MHz - enables smaller output inductors and faster transient response |
| Current Sensing | Temperature-compensated bi-directional analog output - eliminates need for external current-sense amplifiers |
| Thermal Interface | Top-side cooling via exposed thermal pad - allows direct heatsink attachment for improved thermal resistance |
| PWM Input Compatibility | 3.3-V and 5-V logic - interoperable with common controller families without voltage translation |
| Package Dimensions | 5.0 mm × 6.0 mm × 1.0 mm - industry-standard QFN footprint with ultra-low inductance layout |
Pinout & Package
VQFN-CLIP (RRB) package with 41 terminals, 5.0 mm × 6.0 mm body, 1.0 mm height, and thermally enhanced exposed top-side copper pad for direct heatsink mounting. Moisture sensitivity level is Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain input | Primary DC input connection; routed to internal high-side FET and bootstrap capacitor |
| VOUT | Power stage output node | Switch node connecting to output inductor; carries high di/dt current in both directions |
| PGND | Power ground reference | Low-inductance return path for high-side and low-side FETs; tied to thermal pad |
| AGND | Analog ground reference | Isolated ground for current/temp sensing circuitry to minimize noise coupling |
| PWM | Tri-state PWM input | Accepts 3.3-V/5-V logic; high = high-side on, low = low-side on, high-Z = both FETs off |
| ISEN | Bi-directional current sense output | Analog voltage proportional to inductor current with temperature compensation |
| TEMP | Analog temperature output | Linear voltage output tracking die temperature for system thermal regulation |
| FLT | Fault status open-drain output | Active-low signal indicating overcurrent, overtemperature, or undervoltage lockout |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Switch | Eliminates external bootstrap diode/capacitor, reducing BOM count and layout area |
| Diode Emulation Mode | Enables discontinuous conduction mode (DCM) operation for light-load efficiency improvement |
| Optimized Dead-Time Control | Prevents shoot-through by dynamically adjusting timing between high/low-side FET transitions |
| System-Optimized PCB Footprint | Minimizes loop inductance and thermal resistance through symmetric power routing and thermal pad placement |
| RoHS & Halogen-Free Compliance | Meets environmental requirements for server, desktop, and enterprise-grade electronics manufacturing |
Applications
| Server VR12.x/VR13.x V-Core | Desktop CPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient power delivery to multi-core Xeon or EPYC processors in 1U/2U rack servers. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in 4–8 phase VR modules, delivering up to 90 A per phase with sub-100 ns transient response. Use Value: Enables higher power density and lower thermal resistance than discrete MOSFET+driver solutions, supporting VR13.x adaptive voltage positioning (AVP) requirements. | Use Scenario: Compact, high-efficiency VDD/VDDIO rail generation for Intel Core i9 or AMD Ryzen 9 platforms on ATX/mATX motherboards. IC Role / Device Role / Timing Role: Single-phase or multi-phase buck stage controlled by IMVP9/VR14-compliant controllers such as TI's UCD90xxx series. Use Value: Reduces solution size by >35% vs. discrete alternatives while maintaining >95% efficiency at 30 A, easing thermal design in constrained board areas. |
| GPU Memory VR Modules | AI Accelerator Board Power |
Use Scenario: Point-of-load regulation for GDDR6/GDDR6X memory subsystems on high-end graphics cards requiring tight voltage tolerance and ripple control. IC Role / Device Role / Timing Role: Secondary buck stage supplying 1.35 V ±1% to memory stacks, synchronized to main CPU VR clock for EMI reduction. Use Value: Ultra-low inductance package minimizes switching noise coupling into sensitive memory data lines, improving signal integrity and margin. | Use Scenario: Distributed power delivery across PCIe-based AI accelerators (e.g., NVIDIA A100/H100 mezzanine cards) with dynamic workload scaling. IC Role / Device Role / Timing Role: Scalable power stage in adaptive multi-phase VRs that adjust active phases based on real-time GPU utilization telemetry. Use Value: Diode emulation and bi-directional current sensing enable precise per-phase current balancing and predictive thermal throttling in heterogeneous compute environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372RWT | Lower peak current (70 A), same 5×6 mm VQFN-CLIP package, 1.5-MHz max frequency | Suitable for mid-tier CPUs or GPU I/O rails where 90-A capability is not required | Select when thermal budget or cost constraints prioritize lower current rating without sacrificing footprint compatibility |
| ISL99390HRZ-T | 80-A peak, integrated current/temperature sensing, but uses different pinout and lacks diode emulation mode | Requires PCB redesign due to non-compatible pin mapping and separate bootstrap circuit requirement | Choose only if existing design uses Intersil controllers and legacy layout cannot be modified for TI's RRB package |
Compared with CSD95410RRBT, CSD95372RWT offers reduced current capacity in the same footprint for cost-sensitive VR12.x implementations, while ISL99390HRZ-T provides alternative sensing architecture but demands full layout rework - making CSD95410RRBT optimal for new high-performance VR13.x/VR14.x designs prioritizing integration and thermal performance.
Availability
CSD95410RRBT is available at Aetrix Electronics and suitable for server VR modules, desktop CPU power delivery, GPU memory regulation, and AI accelerator board power requiring stable component supply and long-term industrial lifecycle support.
Supply support for CSD95410RRBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-reliability power conversion ICs and systems.
The CSD95410RRBT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in next-generation CPU, GPU, and AI processor VR applications.
FAQ
What is the maximum operating frequency supported by the CSD95410RRBT?
The CSD95410RRBT supports switching frequencies up to 1.75 MHz. This high-frequency capability enables use of smaller output inductors and capacitors, reducing overall solution size and improving transient response in VR12.x/VR13.x applications. The device maintains stable operation and shoot-through protection across this range due to its integrated dead-time optimization and low-inductance VQFN-CLIP package.
Does the CSD95410RRBT require an external bootstrap diode or capacitor?
No, the CSD95410RRBT integrates a bootstrap switch internally, eliminating the need for external bootstrap diodes or capacitors. This integration simplifies PCB layout, reduces component count, and improves reliability by removing failure-prone passive elements. The internal bootstrap circuit is designed to operate robustly across the full 3.3-V to 5-V PWM input range and temperature specification of –40°C to +125°C.
How does the current sensing function work in the CSD95410RRBT?
The CSD95410RRBT provides temperature-compensated bi-directional analog current sensing via its ISEN pin. It outputs a voltage proportional to inductor current magnitude and direction, calibrated across temperature to maintain accuracy without external compensation circuits. This feature enables precise per-phase current monitoring in multiphase VR systems and supports advanced control algorithms like adaptive phase shedding in the CSD95410RRBT-based power stages.
What thermal management advantages does the CSD95410RRBT offer?
The CSD95410RRBT features thermally enhanced topside cooling via an exposed copper pad on the package top surface, allowing direct attachment of heatsinks or thermal interface materials. This architecture reduces junction-to-ambient thermal resistance significantly compared to bottom-side-only cooled QFN packages. Combined with its analog temperature output (TEMP pin), the CSD95410RRBT enables real-time die temperature monitoring and closed-loop thermal regulation in high-power server and AI accelerator applications.
Is the CSD95410RRBT compatible with VR14.x specifications?
Yes, the CSD95410RRBT is designed to meet VR14.x requirements including fast transient response, adaptive voltage positioning (AVP), and precise current reporting. Its 90-A peak current, 1.75-MHz switching capability, diode emulation mode, and bi-directional current sensing align with VR14.x compliance needs for next-generation client and workstation CPUs. TI documentation confirms its qualification for VR12.x, VR13.x, and VR14.x V-core applications when paired with compatible PMBus-enabled controllers.
CSD95410RRBT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- Synchronous Buck Converters, Voltage Regulators
- Interface:
- -
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- 80A
- Voltage - Supply:
- -
- Voltage - Load:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95410RRBT FAQ
1.How can I place an order for CSD95410RRBT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95410RRBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95410RRBT reliable?
The price and inventory of CSD95410RRBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95410RRBT is usually 5 days.
3.What payment methods are accepted for CSD95410RRBT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95410RRBT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95410RRBT?
CSD95410RRBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95410RRBT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95410RRBT?
For technical support, including CSD95410RRBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95410RRBT requirements.
6.How does Aetrix verify that CSD95410RRBT is sourced from the original manufacturer or authorized distributors?
All CSD95410RRBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95410RRBT meets industry standards.
7.What is the process for return or replacement of CSD95410RRBT?
All CSD95410RRBT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95410RRBT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95410RRBT part is unused and in its original packaging.
Return procedure for CSD95410RRBT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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