My Inquiry
My Account
Texas Instruments CSD95472Q5MC
- Part No.:
- CSD95472Q5MC
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD95472Q5MC.pdf
- Description:
- IC SYNC BUCK 60A 12VSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,251
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CSD95472Q5MC from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and dual Power MOSFETs in a single 5 mm × 6 mm DualCool™ VSON-CLIP package. It delivers 60-A continuous output current at 1.2 V, achieves 94.4% system efficiency and 2.3 W power loss at 30 A, and supports up to 1.25 MHz switching frequency for high-density POL DC-DC converters in CPU/GPU VRMs.
For engineers reviewing the CSD95472Q5MC datasheet, CSD95472Q5MC pinout, CSD95472Q5MC application, or CSD95472Q5MC equivalent, key selection criteria include its bidirectional current sense accuracy, analog temperature output (600 mV at 0°C), tri-state PWM compatibility with 3.3-V/5-V controllers, integrated bootstrap diode, and fault monitoring for overcurrent, high-side short, and overtemperature conditions.
Technical Context
The CSD95472Q5MC implements a fully integrated synchronous buck power stage with internal gate driver, high-side and low-side silicon-based MOSFETs, and precision sensing circuitry. Its architecture supports diode emulation mode via FCCM pin control and forced continuous conduction mode (FCCM), enabling optimized light-load efficiency and stable transient response in multiphase VRMs.
It features temperature-compensated bidirectional current sensing referenced to REFIN, analog die temperature reporting on TAO/FAULT pin (600 mV at 0°C, 10 mV/°C slope), and robust protection including active shoot-through prevention via optimized deadtime, thermal shutdown, and fault latching. The device operates with VIN up to 16 V, VDD from 4.5 V to 5.5 V, and junction temperature range of –40°C to 125°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU core rails |
| System Efficiency | 94.4% at 1.2 V / 30 A - reduces thermal load and improves power density in space-constrained VRMs |
| Power Loss | 2.3 W at 30 A - directly lowers heatsink requirements and improves system-level thermal margin |
| Switching Frequency | Up to 1.25 MHz - allows smaller output inductors and faster transient response in high-frequency POL designs |
| Current Sense Accuracy | Temperature-compensated bidirectional sensing - enables precise phase current balancing in multiphase systems |
| Thermal Protection | Overtemperature shutdown with TAO/FAULT analog output - provides real-time die temperature feedback and fault signaling without external sensors |
| PWM Compatibility | Tri-state 3.3-V/5-V logic compatible - eliminates level-shifting needs when interfacing with TI's TPS53661 and similar multiphase controllers |
Pinout & Package
Package: VSON-CLIP (DMC) 12-pin, 5 mm × 6 mm outline with exposed thermal pad and DualCool™ top-side cooling structure. Pin 13 is PGND (shared with pin 4); total 12 functional terminals in compact footprint optimized for low-inductance PCB layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IOUT | Current sense amplifier output | Voltage proportional to phase current (IOUT–REFIN ∝ IPHASE) - used for closed-loop current monitoring and phase balancing |
| REFIN | Current sense reference input | External reference point for bidirectional current sensing - enables accurate zero-current detection and polarity resolution |
| ENABLE | Global enable control | Active-high logic input with internal 100 kΩ pulldown - allows synchronized startup/shutdown across multiple power stages |
| PGND | Power ground return | Primary low-impedance return path for high-current switching loops - pins 4 and 13 are internally connected |
| VDD | Gate driver supply | 4.5–5.5 V supply for internal driver and logic - decoupling required per TI layout guidelines to suppress noise coupling |
| VSW | Switch node | Connection between HS source and LS drain - critical high-di/dt node requiring minimized loop area and tight capacitor placement |
| VIN | Main input supply | 12 V or 16 V input rail connection - must be decoupled with six 10 µF X7R ceramics per datasheet recommendation |
| BOOT_R | Bootstrap return | Internal connection to VSW - completes bootstrap charge path for high-side FET drive without external routing |
| BOOT | Bootstrap capacitor terminal | Accepts ≥0.1 µF 16 V X7R ceramic - integrated bootstrap diode eliminates external component and improves reliability |
| FCCM | Mode select | Logic-controlled diode emulation (LOW) or forced CCM (HIGH) - enables adaptive light-load efficiency optimization |
| TAO/FAULT | Temp analog output/fault indicator | Analog voltage (600 mV @ 0°C, 10 mV/°C) with OR-wire capability in multiphase - reports highest die temp and pulls to 3.3 V during thermal shutdown |
| PWM | Tri-state gate control | Three-state input (LOW/HIGH/Hi-Z) - Hi-Z forces both FETs OFF after t3HT timeout, supporting controller fault recovery |
Key Features
| Feature | Design Value |
|---|---|
| Integrated driver + dual MOSFETs | Eliminates discrete gate driver layout complexity and reduces BOM count while maintaining <10 ns propagation delay matching |
| DualCool™ packaging | Top-side thermal pad enables direct heatsink attachment - reduces θJA by up to 25% vs standard VSON in 4-layer board configurations |
| Ultralow-inductance layout | Optimized internal power loop minimizes parasitic inductance (<0.3 nH) - suppresses VSW ringing and EMI generation at >1 MHz operation |
| System-optimized PCB footprint | Pre-characterized land pattern and stencil opening - accelerates design validation and ensures manufacturability without iterative prototyping |
| Fault monitoring suite | Detects high-side short, overcurrent, and overtemperature events with latched FAULT signal - enables safe system-level fault containment and logging |
Applications
| CPU Voltage Regulator Modules (VRMs) | GPU Core Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient power delivery to modern x86 and ARM processors requiring dynamic voltage scaling and sub-100 ns load-step response. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in multiphase VRM, driven by TPS53661 or similar controller; handles full phase current with integrated current/temp sensing. Use Value: Enables 60-A continuous per phase with 94.4% efficiency at 30 A, reducing thermal stress and allowing tighter phase interleaving for smoother ripple current. | Use Scenario: Compact, high-efficiency core rail for discrete and integrated GPUs where board space and thermal envelope are constrained. IC Role / Device Role / Timing Role: Single-phase or parallel-configured power stage delivering 1.0–1.2 V at up to 60 A; leverages FCCM mode for improved light-load efficiency during idle states. Use Value: DualCool™ top-side cooling and ultralow-inductance package allow GPU modules to meet 125°C junction limit without additional airflow or oversized heatsinks. |
| Memory Subsystem VRMs (DDR5, HBM) | AI Accelerator Board Power Stages |
Use Scenario: Precision-regulated 1.1 V or 1.25 V supply for DDR5 memory channels or high-bandwidth memory stacks requiring tight voltage tolerance and low noise. IC Role / Device Role / Timing Role: Low-noise, high-accuracy power stage with bidirectional current sense for real-time channel current balancing and telemetry. Use Value: Temperature-compensated current sensing and analog TAO output provide accurate per-phase telemetry for closed-loop memory rail health monitoring. | Use Scenario: Distributed high-current power delivery across multiple AI inference/training ASICs on dense accelerator cards operating at 0.7–0.85 V. IC Role / Device Role / Timing Role: Scalable power stage used in 2–6 phase configurations; TAO/FAULT wire-OR capability simplifies thermal monitoring across all phases. Use Value: 1.25 MHz max switching frequency enables use of 0.22 µH inductors, reducing solution size by >30% vs 500 kHz alternatives while maintaining <±1% regulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck smart power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95372Q5MC | Lower 40-A continuous rating; identical pinout, package, and feature set except reduced current capability and slightly lower efficiency (93.8% @ 30 A) | Better suited for mid-tier CPUs or lower-power GPU cores where thermal headroom is less constrained | Select when 40-A rating suffices and cost sensitivity outweighs need for maximum current density |
| ISL99390IRZ | 60-A rated but uses different pinout (13-pin QFN), lacks analog TAO output, and requires external bootstrap diode; higher RDS(on) for LS FET | Compatible with Renesas ISL68xx controllers but not drop-in with TI TPS536xx due to pin mismatch and missing FCCM control | Choose only when redesigning around Renesas ecosystem or when external bootstrap integration is acceptable |
Compared with CSD95472Q5MC, CSD95372Q5MC offers identical integration and layout compatibility at reduced current capacity, while ISL99390IRZ provides comparable current rating but demands PCB redesign, lacks analog temperature reporting, and requires additional components - making CSD95472Q5MC optimal for TI-based high-density VRMs requiring telemetry and thermal intelligence.
Availability
CSD95472Q5MC is available at Aetrix Electronics and suitable for CPU VRMs, GPU power delivery, DDR5 memory regulators, and AI accelerator board designs requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and enterprise deployments.
Supply support for CSD95472Q5MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies with over 90 years of innovation in high-reliability power solutions.
The CSD95472Q5MC belongs to TI's NexFET™ smart power stage product line, engineered specifically for high-frequency, high-current point-of-load DC-DC conversion in server, workstation, and AI infrastructure applications where power density, thermal performance, and system-level telemetry are critical.
FAQ
What is the maximum continuous output current rating for the CSD95472Q5MC?
The CSD95472Q5MC is rated for 60-A continuous output current under specified conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and LOUT = 0.225 µH at TA = 25°C. This rating assumes proper PCB thermal design per TI's recommended land pattern and adequate airflow or heatsinking. Peak current capability reaches 90 A for short durations (tp = 50 µs).
Does the CSD95472Q5MC support diode emulation mode, and how is it enabled?
Yes, the CSD95472Q5MC supports diode emulation mode via the FCCM pin. When FCCM is held LOW, the device enters diode emulation mode for the synchronous FET, improving light-load efficiency. When FCCM is HIGH, it operates in forced continuous conduction mode (FCCM). An internal 5 µA current source pulls FCCM to 3.3 V if left floating, defaulting to FCCM mode. This functionality is confirmed in the SLPS599 datasheet Section 5 and Figure 10.
What is the purpose of the TAO/FAULT pin on the CSD95472Q5MC?
The TAO/FAULT pin on the CSD95472Q5MC serves dual functions: it outputs an analog voltage proportional to die temperature (600 mV at 0°C, 10 mV/°C slope), and asserts a logic HIGH (3.3 V) during thermal shutdown. In multiphase systems, multiple TAO/FAULT pins can be wire-OR'd together so only the highest temperature is reported - enabling centralized thermal monitoring without additional circuitry. A 1 nF ceramic capacitor to PGND is required for stability.
Is the CSD95472Q5MC pin-compatible with other devices in the CSD9547x family?
Yes, the CSD95472Q5MC shares identical pinout, package (VSON-CLIP, 12-pin), and footprint with other members of the CSD9547x family, including CSD95472Q5MCT and CSD95372Q5MC. This allows direct substitution within the same family for current-rating adjustments or reel-size preferences without PCB changes - provided thermal and electrical margins remain within spec for the selected variant.
What is the recommended bootstrap capacitor value for the CSD95472Q5MC?
The recommended bootstrap capacitor for the CSD95472Q5MC is a minimum of 0.1 µF, 16 V X7R ceramic capacitor connected between BOOT and BOOT_R pins. TI specifies this value in Section 5 (Pin Functions) of the SLPS599 datasheet to ensure reliable high-side FET turn-on across temperature and load conditions. The device integrates the bootstrap diode, eliminating the need for an external component.
CSD95472Q5MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON (5x6)
CSD95472Q5MC FAQ
1.How can I place an order for CSD95472Q5MC through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95472Q5MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95472Q5MC reliable?
The price and inventory of CSD95472Q5MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95472Q5MC is usually 5 days.
3.What payment methods are accepted for CSD95472Q5MC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95472Q5MC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95472Q5MC?
CSD95472Q5MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95472Q5MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95472Q5MC?
For technical support, including CSD95472Q5MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95472Q5MC requirements.
6.How does Aetrix verify that CSD95472Q5MC is sourced from the original manufacturer or authorized distributors?
All CSD95472Q5MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95472Q5MC meets industry standards.
7.What is the process for return or replacement of CSD95472Q5MC?
All CSD95472Q5MC units undergo pre-shipment inspection (PSI). If there is an issue with CSD95472Q5MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95472Q5MC part is unused and in its original packaging.
Return procedure for CSD95472Q5MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSD95472Q5MC Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
