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Texas Instruments CSD95480RWJ
- Part No.:
- CSD95480RWJ
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95480RWJ.pdf
- Description:
- IC HALF BRIDGE DRIVER 70A 41VQFN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CSD95480RWJ from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single 5-mm × 6-mm VQFN-CLIP package. It delivers 70-A continuous output current, supports up to 1.25-MHz switching frequency, and features integrated bi-directional current sensing with temperature compensation. It is designed for high-density, high-efficiency VR12.x/VR13.x voltage regulator applications in server and graphics cards.
For engineers reviewing the CSD95480RWJ datasheet, CSD95480RWJ pinout, CSD95480RWJ application, or CSD95480RWJ equivalent, key selection criteria include its 70-A continuous current rating, 95%+ system efficiency at 30 A, tri-state PWM compatibility, diode emulation mode, and thermally enhanced topside-cooled QFN-CLIP package with 41-pin layout.
Technical Context
The CSD95480RWJ implements a fully integrated synchronous buck power stage with internal high-side and low-side NexFET™ MOSFETs driven by an optimized gate driver. Its control interface accepts 3.3-V or 5-V tri-state PWM signals and supports both forced continuous conduction mode (FCCM) and diode emulation via the EN/FCCM pin.
It integrates analog functions including temperature-compensated bi-directional current sensing (via IOUT/REFIN), analog temperature output (TAO/FLT), inductor value calibration (LSET), and output voltage sensing (VOS). The VSW node connects directly to the external output inductor, while BOOT/BOOT_R enables self-powered high-side drive with integrated bootstrap diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 70 A at VIN = 12 V, VDD = 5 V, PVDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU rails |
| Switching Frequency | Up to 1250 kHz - allows compact magnetics and fast transient response in POL converters |
| System Efficiency | Over 95% at 30 A - reduces thermal load and improves power density in multi-phase VR designs |
| Package | VQFN-CLIP (RWJ), 5.0 mm × 6.0 mm, 41-pin - ultra-low-inductance, thermally enhanced footprint with exposed metal pad for topside cooling |
| PWM Compatibility | 3.3-V and 5-V logic-level tri-state input - eliminates level-shifting requirements in controller interfacing |
| Current Sensing | Temperature-compensated bi-directional analog output (IOUT–REFIN ∝ phase current) - enables accurate DCR-less current monitoring without external gain stages |
| Thermal Resistance | θJB = 2.2 °C/W - enables high-power operation with minimal PCB copper area due to efficient board conduction |
Pinout & Package
VQFN-CLIP (RWJ) package: 5.0 mm × 6.0 mm body, 41-pin layout with exposed thermal pad on underside and integrated topside cooling structure. Pin 1 index located at top-left corner; pin numbering follows standard QFN counter-clockwise sequence starting from top-left.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 25–30) | Input power supply connection | High-current input path requiring multiple parallel pins and local bulk capacitance placement |
| VSW (Pins 10–19) | Phase node (HS source / LS drain) | Direct connection point to output inductor; low-inductance routing critical for EMI and efficiency |
| PGND (Pins 5, 7–9, 20–24, 40) | Power ground return | Multiple dedicated low-impedance paths for HS/LS FET sources and driver return currents |
| BOOT / BOOT_R (Pins 33 / 32) | Bootstrap capacitor interface | Integrated bootstrap diode enables self-powered HS gate drive; requires ≥0.1-µF X5R ceramic capacitor |
| PWM (Pin 34) | Tri-state gate control input | Logic-high/high-Z/low states control HS/LS FET pairing and enable diode emulation or FCCM modes |
| EN/FCCM (Pin 35) | Mode selection and enable | Tri-state window entry enables diode emulation; high = FCCM; low = shutdown - no external pull-up needed |
| TAO/FLT (Pin 36) | Temperature amplifier output / fault indicator | Analog voltage proportional to die temperature; OR-wireable across phases; pulled to 3.3 V during thermal shutdown |
| IOUT / REFIN (Pins 38 / 39) | Current sense amplifier output / reference | Differential output (IOUT–REFIN) scales linearly with phase current; REFIN sets zero-current offset |
| LSET (Pin 37) | Inductor value calibration | Resistor-to-PGND sets inductance value used internally for current-sense gain compensation |
| VOS (Pin 1) | Output voltage sensing | Connects to feedback node for internal current-sense offset correction and loop stability optimization |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete driver layout complexity and gate-loop parasitics, enabling >1-MHz operation with stable shoot-through protection |
| Diode emulation function | Improves light-load efficiency in CCM/DCM boundary applications by turning off LS FET during reverse current, reducing conduction loss |
| Analog temperature output (TAO) | Enables real-time thermal monitoring and multiphase thermal balancing without external sensors or ADC resources |
| Bi-directional current sense with temp compensation | Supports accurate DCR-less current reporting across full operating temperature range (–40°C to 125°C junction) |
| Optimized PCB footprint | Reduces design iteration time via pre-characterized land pattern, stencil openings, and thermal pad solder guidelines per SLUA271 |
Applications
| Server VR12.x/VR13.x Core Regulation | GPU Memory Voltage Regulation |
|---|---|
Use Scenario: High-current, fast-transient core voltage regulation for Intel/AMD CPUs in dual-socket servers. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering up to 70 A per phase with <20 ns minimum on-time support. Use Value: Enables 6+ phase VR designs with tight voltage tolerance (±3 mV) and sub-10 µs load-step response using integrated current/temperature sensing. |
Use Scenario: Compact, high-efficiency power delivery to GDDR6 memory subsystems on AI accelerator cards. IC Role / Device Role / Timing Role: Single-phase POL converter operating at 1.25 MHz to minimize inductor size while maintaining >93% efficiency at 45 A. Use Value: Reduces board area by 35% vs. discrete solutions and simplifies thermal management via topside-cooled CLIP package. |
| High-Density Telecom POL Modules | Desktop VRM for High-End Gaming Platforms |
Use Scenario: Distributed 12 V-to-1.8 V conversion in space-constrained 5G baseband units with strict EMI limits. IC Role / Device Role / Timing Role: High-frequency buck stage supporting spread-spectrum PWM and precise current sharing across paralleled phases. Use Value: Achieves CISPR-22 Class B compliance with minimal filtering due to ultra-low VSW ringing and integrated dead-time optimization. |
Use Scenario: Overclock-tolerant VCore regulation for enthusiast-grade motherboards with dynamic load steps exceeding 100 A/µs. IC Role / Device Role / Timing Role: Primary power stage in 8+2 phase VRMs, leveraging TAO/FLT pin for per-phase thermal derating and fault isolation. Use Value: Enables real-time adaptive phase shedding and thermal throttling without MCU intervention, improving system stability under sustained boost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95492QVM | Same 41-pin VQFN-CLIP package, but rated for 60-A continuous current and 1-MHz max switching frequency; lacks TAO/FLT pin and diode emulation support. | Better suited for cost-sensitive, lower-current VR designs where thermal telemetry and light-load efficiency are secondary. | Select CSD95492QVM when system current demand stays ≤60 A and multiphase thermal coordination is not required. |
| TPS53679 | 6-phase digital VR controller (not a power stage); requires external discrete power stages; supports PMBus, AVS, and advanced telemetry. | Targets full VR13.x-compliant systems needing programmable loop response, margining, and firmware-upgradable features. | Choose TPS53679 only when full digital control, multi-rail sequencing, and telemetry logging are mandatory - it does not replace CSD95480RWJ but complements it as a controller. |
Compared with CSD95492QVM, the CSD95480RWJ provides higher current capability (+10 A), extended frequency headroom (+250 kHz), and integrated thermal/current telemetry essential for server-class reliability; versus TPS53679, it serves a fundamentally different role - as a monolithic power stage rather than a controller - making them functionally complementary, not interchangeable.
Availability
CSD95480RWJ is available at Aetrix Electronics and suitable for server VR12.x/VR13.x core regulation, GPU memory voltage regulation, and high-density telecom POL converters requiring stable component supply and long-term lifecycle assurance.
Supply support for CSD95480RWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 50 years of leadership in power conversion innovation.
The CSD95480RWJ belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-efficiency, high-current synchronous buck conversion in datacenter, AI accelerator, and high-performance computing applications.
FAQ
What is the maximum continuous output current rating for the CSD95480RWJ?
The CSD95480RWJ is rated for 70-A continuous output current under specified conditions: VIN = 12 V, VDD = 5 V, PVDD = 5 V, VOUT = 1.2 V, and fSW = 500 kHz at TA = 25°C. Derating applies above 25°C ambient or with reduced airflow; full thermal design guidance is provided in the SLPS670 datasheet section 6.4.
Does the CSD95480RWJ support diode emulation mode, and how is it enabled?
Yes, the CSD95480RWJ supports diode emulation mode via the EN/FCCM pin. When this pin is held in the tri-state window (between 0.8 V and 2.0 V) for longer than the tri-state holdoff time (T3HT), the device enters diode emulation mode, turning off the low-side FET during reverse current to improve light-load efficiency. The CSD95480RWJ datasheet specifies exact voltage thresholds and timing in section 5.
What package type and pin count does the CSD95480RWJ use?
The CSD95480RWJ uses a VQFN-CLIP (RWJ) package measuring 5.0 mm × 6.0 mm with 41 pins and an exposed thermal pad. This thermally enhanced clip-based QFN integrates copper straps for superior heat transfer to both PCB and heatsink, and its pinout is optimized for low-inductance power routing as documented in the SLPS670 mechanical drawings.
Can the CSD95480RWJ be used with 3.3-V PWM controllers?
Yes, the CSD95480RWJ PWM input (Pin 34) is compatible with both 3.3-V and 5-V logic-level signals. Its tri-state architecture accepts high-Z, logic-high, and logic-low states to control FET pairing and mode selection without external level shifters - a key feature confirmed in the SLPS670 Recommended Operating Conditions table (section 6.3).
How does the CSD95480RWJ implement current sensing without a sense resistor?
The CSD95480RWJ uses integrated temperature-compensated bi-directional current sensing based on MOSFET RDS(on) monitoring. It outputs a differential analog signal (IOUT – REFIN) proportional to phase current, calibrated using the LSET pin resistor to account for inductor DCR and thermal drift. This eliminates external sense resistors while maintaining ±3% accuracy across –40°C to 125°C, as verified in the SLPS670 specifications.
CSD95480RWJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 70A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95480RWJ FAQ
1.How can I place an order for CSD95480RWJ through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95480RWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95480RWJ reliable?
The price and inventory of CSD95480RWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95480RWJ is usually 5 days.
3.What payment methods are accepted for CSD95480RWJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95480RWJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95480RWJ?
CSD95480RWJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95480RWJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95480RWJ?
For technical support, including CSD95480RWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95480RWJ requirements.
6.How does Aetrix verify that CSD95480RWJ is sourced from the original manufacturer or authorized distributors?
All CSD95480RWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95480RWJ meets industry standards.
7.What is the process for return or replacement of CSD95480RWJ?
All CSD95480RWJ units undergo pre-shipment inspection (PSI). If there is an issue with CSD95480RWJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95480RWJ part is unused and in its original packaging.
Return procedure for CSD95480RWJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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