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Texas Instruments CSD95481RWJT
- Part No.:
- CSD95481RWJT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95481RWJT.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 41VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:449
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Product details
Overview
CSD95481RWJT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual MOSFETs in a single VQFN-CLIP package. It delivers 60-A continuous output current at up to 1.25 MHz switching frequency, supports 3.3-V/5-V PWM logic, and features integrated bi-directional current sensing and analog temperature output for VR12.x/VR13.x voltage regulator applications in server CPU power delivery.
For engineers reviewing the CSD95481RWJT datasheet, CSD95481RWJT pinout, CSD95481RWJT application, or CSD95481RWJT equivalent, key selection criteria include its 60-A continuous current rating, 5-mm × 6-mm thermally enhanced QFN-CLIP package with topside cooling, diode emulation mode via EN/FCCM pin, and compatibility with high-frequency multiphase POL converters requiring accurate current and thermal monitoring.
Technical Context
The CSD95481RWJT implements a fully integrated synchronous buck power stage with an internal gate driver controlling high-side and low-side NexFET™ MOSFETs. Its PWM input accepts tri-state logic for seamless control, while EN/FCCM enables either forced continuous conduction mode or diode emulation based on pin voltage level and hold time.
Current sensing is achieved via a temperature-compensated bi-directional amplifier referenced to REFIN, with IOUT providing a voltage proportional to phase current. The TAO/FLT pin delivers an analog voltage linearly tracking die temperature, supporting OR-wired multiphase thermal monitoring without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU cores. |
| Switching Frequency | Up to 1250 kHz - allows compact magnetics and fast transient response in space-constrained VR designs. |
| PWM Logic Compatibility | 3.3-V and 5-V compatible - eliminates level-shifting requirements when interfacing with common PMIC controllers. |
| Thermal Resistance (Junction-to-Board) | 2.2 °C/W - ensures efficient heat transfer to PCB copper, critical for sustained 60-A operation without heatsinks. |
| Current Sensing Accuracy | Temperature-compensated bi-directional sensing - maintains precision across –40°C to 125°C junction range for accurate load-line regulation. |
| Package Type | VQFN-CLIP (RWJ), 41-pin, 5.0 mm × 6.0 mm - integrates exposed thermal pad and ultra-low-inductance layout for minimal switching loss and EMI. |
| Operating Junction Temperature | –40°C to 125°C - supports industrial and server-grade thermal environments without derating. |
Pinout & Package
VQFN-CLIP (RWJ) package: 41-pin, 5.0 mm × 6.0 mm outline with exposed thermal pad on bottom and topside cooling capability. Package optimized for low parasitic inductance and high-power density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 25–30) | Input voltage supply | High-current input node; requires local high-frequency ceramic capacitance for stable high-dI/dt operation. |
| VSW (Pins 10–19) | Phase node | Connection point between HS FET source and LS FET drain; directly interfaces with output inductor and must minimize loop area. |
| PGND (Pins 5, 7–9, 20–24, 40) | Power ground return | Dedicated low-impedance ground path for high-frequency switching currents; multiple pins reduce resistance and inductance. |
| PWM (Pin 34) | Tri-state gate control input | Directly drives internal driver; Hi-Z state triggers automatic shutdown after configurable hold-off time (T3HT). |
| EN/FCCM (Pin 35) | Mode selection & enable | Configures forced CCM (high), diode emulation (tri-state hold), or disable (low); internal pull-down ensures safe default state. |
| IOUT (Pin 38) | Current sense amplifier output | Provides voltage proportional to phase current (V(IOUT) – V(REFIN)); used for closed-loop current limiting and telemetry. |
| TAO/FLT (Pin 36) | Temperature amplifier output / fault indicator | Analog voltage proportional to die temperature; pulled to 3.3 V during thermal shutdown - supports wired-OR multiphase monitoring. |
| LSET (Pin 37) | Inductor value programming | Resistor-to-PGND sets gain for current sensing circuitry, enabling calibration for specific inductor DCR values. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete gate driver design effort and layout sensitivity while optimizing dead time to prevent shoot-through. |
| Bi-directional current sensing | Enables precise real-time current monitoring during both sourcing and sinking phases - essential for dynamic phase shedding. |
| Diode emulation function | Reduces light-load losses by turning off LS FET during discontinuous conduction mode, improving efficiency below 10% load. |
| Thermally enhanced topside cooling | Allows direct thermal interface to heatsink or cold plate - critical for maintaining <125°C junction temp under full 60-A load. |
| System-optimized PCB footprint | Minimizes high-current loop area and parasitic inductance, reducing voltage overshoot and EMI generation at 1.25 MHz. |
Applications
| Server CPU Voltage Regulator | GPU Power Delivery Module |
|---|---|
|
Use Scenario: High-current, fast-transient power delivery to modern x86 server processors operating under dynamic workloads. IC Role / Device Role / Timing Role: Synchronous buck power stage in multiphase VR13.x architecture, delivering up to 60 A per phase with sub-100 ns transient response. Use Value: Enables tight voltage regulation (±3 mV) across 0–100% load steps using integrated current and temperature feedback, reducing need for external sense resistors. |
Use Scenario: Compact, high-efficiency power conversion for AI accelerator and discrete graphics cards with strict board space constraints. IC Role / Device Role / Timing Role: Single-phase POL converter supplying core voltage to GPU ASICs, operating at 1.25 MHz to shrink filter components. Use Value: Achieves >95% efficiency at 30 A due to ultra-low RDS(on) NexFET™ devices and optimized gate drive, lowering thermal load in dense PCB stacks. |
| Memory Subsystem VR | High-Density Telecom PSU |
|
Use Scenario: Point-of-load regulation for DDR5 memory modules requiring precise 1.1 V ±3% with rapid load-step response. IC Role / Device Role / Timing Role: Buck power stage in dual-phase memory VR, leveraging TAO/FLT pin for thermal balancing across phases. Use Value: Integrated analog temperature output enables per-phase thermal management without additional sensors, simplifying BOM and layout. |
Use Scenario: Intermediate bus conversion in 48 V telecom systems powering baseband processing units with high reliability demands. IC Role / Device Role / Timing Role: High-frequency buck stage converting 48 V to 12 V intermediate bus, operating at 1 MHz with forced CCM for predictable ripple. Use Value: VQFN-CLIP package's 2.2 °C/W θJB enables natural convection cooling at 60 A, eliminating fans in NEBS-compliant enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95492QVM | Same 41-pin VQFN-CLIP package, but rated for 70-A continuous current and higher 16-V VIN max; includes enhanced thermal monitoring resolution. | Better suited for next-gen server CPUs requiring >60-A per phase and tighter thermal binning. | Select CSD95492QVM when scaling beyond 60-A or needing extended input voltage margin above 16 V. |
| MP87651GQH | 60-A rated QFN-40 package (5 mm × 6 mm), but lacks integrated bi-directional current sensing and analog temperature output; requires external sense resistor. | Applicable where cost sensitivity outweighs telemetry needs, and system-level current monitoring is handled externally. | Choose MP87651GQH only if current/temperature telemetry is omitted from system architecture and layout simplicity is prioritized over accuracy. |
Compared with CSD95481RWJT, CSD95492QVM offers higher current headroom and input voltage tolerance for future-proofing, while MP87651GQH reduces component count at the expense of integrated sensing - making CSD95481RWJT the optimal balance of performance, integration, and thermal intelligence for VR12.x/VR13.x deployments.
Availability
CSD95481RWJT is available at Aetrix Electronics and suitable for server CPU voltage regulators, GPU power modules, DDR5 memory VRs, and telecom intermediate bus converters requiring stable component supply and long-term lifecycle support.
Supply support for CSD95481RWJT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with decades of leadership in high-efficiency power conversion solutions.
The CSD95481RWJT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck applications in datacenter and AI hardware where thermal density, current accuracy, and layout efficiency are critical.
FAQ
What is the maximum continuous output current rating for the CSD95481RWJT?
The CSD95481RWJT is rated for 60-A continuous output current under specified conditions: VIN = 12 V, VOUT = 1.2 V, PVDD = 5 V, VDD = 5 V, and switching frequency = 500 kHz. This rating assumes proper PCB thermal design with adequate copper area and airflow. Peak current capability reaches 90 A for short durations (tp = 50 µs), supporting demanding transient loads in CPU VR applications.
Does the CSD95481RWJT support diode emulation mode, and how is it enabled?
Yes, the CSD95481RWJT supports diode emulation mode to improve light-load efficiency. It is enabled by driving the EN/FCCM pin into the tri-state window (between 0.8 V and 2.0 V) and holding it there for longer than the internal tri-state hold-off time (T3HT). When active, the low-side FET turns off during discontinuous conduction, mimicking diode behavior and reducing reverse recovery losses - a key feature for VR12.x/VR13.x compliance.
How does the CSD95481RWJT provide current sensing without an external shunt resistor?
The CSD95481RWJT uses integrated temperature-compensated bi-directional current sensing that measures voltage drop across the MOSFETs' RDS(on) rather than requiring an external shunt. The IOUT pin outputs a voltage proportional to phase current relative to REFIN, while LSET pin allows gain calibration via an external resistor to match the selected inductor's DCR. This eliminates power loss and board space associated with traditional sense resistors.
What thermal metrics define the CSD95481RWJT's cooling performance?
The CSD95481RWJT specifies θJB = 2.2 °C/W (junction-to-board) and θJC(top) = 7.4 °C/W, reflecting its thermally enhanced VQFN-CLIP construction. The exposed top metal surface enables direct heatsink attachment, while the bottom thermal pad must be soldered to a large PCB copper plane. These metrics ensure reliable 60-A operation at ≤125°C junction temperature with appropriate board-level thermal design - no additional thermal interface material is required for topside cooling.
Is the CSD95481RWJT pin-compatible with other devices in the same family, such as CSD95492QVM?
Yes, the CSD95481RWJT and CSD95492QVM share identical 41-pin VQFN-CLIP (RWJ) packaging, mechanical footprint, and pinout - including VIN, VSW, PGND, PWM, EN/FCCM, IOUT, TAO/FLT, and LSET assignments. This allows direct replacement in existing layouts when upgrading to higher current capability or extended input voltage range, provided system-level validation confirms thermal and electrical margins.
CSD95481RWJT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95481RWJT FAQ
1.How can I place an order for CSD95481RWJT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95481RWJT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95481RWJT reliable?
The price and inventory of CSD95481RWJT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95481RWJT is usually 5 days.
3.What payment methods are accepted for CSD95481RWJT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95481RWJT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95481RWJT?
CSD95481RWJT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95481RWJT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95481RWJT?
For technical support, including CSD95481RWJT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95481RWJT requirements.
6.How does Aetrix verify that CSD95481RWJT is sourced from the original manufacturer or authorized distributors?
All CSD95481RWJT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95481RWJT meets industry standards.
7.What is the process for return or replacement of CSD95481RWJT?
All CSD95481RWJT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95481RWJT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95481RWJT part is unused and in its original packaging.
Return procedure for CSD95481RWJT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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