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Texas Instruments CSD95482RWJ
- Part No.:
- CSD95482RWJ
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95482RWJ.pdf
- Description:
- IC HALF BRIDGE DRIVER 40A 41VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
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Product details
Overview
CSD95482RWJ from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single 5-mm × 6-mm VQFN-CLIP package. It delivers 40-A continuous output current, supports up to 1.25-MHz switching frequency, and features temperature-compensated bi-directional current sensing with analog temperature output (TAO). It is designed for high-density, high-efficiency VR12.x/VR13.x voltage regulator applications in server and graphics cards.
For engineers reviewing the CSD95482RWJ datasheet, CSD95482RWJ pinout, CSD95482RWJ application, or CSD95482RWJ equivalent, key selection criteria include its 40-A continuous current rating, integrated current/temperature sensing, tri-state PWM compatibility, diode emulation mode, and thermally enhanced topside-cooled QFN-CLIP package.
Technical Context
The CSD95482RWJ implements a fully integrated synchronous buck power stage with internal high-side and low-side MOSFETs driven by an embedded gate driver. Its control interface accepts 3.3-V or 5-V tri-state PWM signals and supports both Forced Continuous Conduction Mode (FCCM) and Diode Emulation Mode via the EN/FCCM pin.
It integrates precision current sensing using VOS and REFIN/IOUT differential pair with inductor value calibration via LSET resistor, plus analog temperature reporting via TAO/FLT pin with built-in ORing diode for multiphase thermal monitoring. The BOOT/BOOTR pins integrate a bootstrap switch and support external 0.1-µF ceramic capacitor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 40 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU core rails |
| Switching Frequency | Up to 1.25 MHz - allows compact magnetics and fast transient response in space-constrained POL designs |
| System Efficiency | >93.5% at 20 A - reduces thermal load and improves power density in multi-phase VR modules |
| Current Sensing Accuracy | Temperature-compensated bi-directional sensing - eliminates external sense resistors and improves phase-current balance in multiphase systems |
| Thermal Reporting | Analog TAO output with integrated ORing diode - enables single-wire thermal monitoring across all phases without external diodes |
| Package Type | VQFN-CLIP (RWJ), 41-pin, 5.0 mm × 6.0 mm - provides ultra-low inductance, topside cooling, and optimized PCB footprint for high-frequency layout |
| PWM Interface | Tri-state compatible with 3.3-V/5-V logic - simplifies controller interoperability and supports seamless transition between FCCM and diode emulation modes |
Pinout & Package
VQFN-CLIP (RWJ) package: 41-pin, 5.0 mm × 6.0 mm body with exposed thermal pad; thermally enhanced topside cooling architecture; RoHS-compliant lead-free terminal plating; MSL Level-2-260°C-1 year.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (25–30) | Input power supply connection | High-current input node requiring local bulk capacitance; multiple parallel pins reduce impedance and AC loss |
| PGND (5, 7–9, 20–24, 40) | Power ground return path | Dedicated low-inductance ground planes essential for EMI control and accurate current sensing reference |
| VSW (10–19) | Switch node | Phase node connecting HS source and LS drain; directly interfaces with output inductor; critical for minimizing ringing and shoot-through risk |
| BOOT / BOOTR (33 / 32) | Bootstrap gate drive circuit | Integrated bootstrap diode; BOOT–BOOTR requires ≥0.1-µF X5R ceramic capacitor for reliable HS FET turn-on |
| PWM (34) | Tri-state control input | Drives internal gate driver; Hi-Z state triggers automatic shutdown after hold-off time - enables seamless light-load efficiency optimization |
| EN/FCCM (35) | Mode selection & enable | Configures operation mode: logic high = FCCM, tri-state = diode emulation, logic low = disable - no external logic needed |
| TAO/FLT (36) | Temperature amplifier output / fault indicator | Analog voltage proportional to die temperature; integrated ORing diode enables daisy-chained multiphase thermal monitoring |
| IOUT / REFIN (38 / 39) | Differential current sense output | V(IOUT) – V(REFIN) ∝ phase current; enables closed-loop current sharing and overcurrent protection without shunt resistor |
| LSET (37) | Inductor calibration input | Resistor-to-PGND sets inductance value for internal current sensing gain - ensures accuracy across different POL inductor selections |
Key Features
| Feature | Design Value |
|---|---|
| Integrated driver + dual MOSFETs | Eliminates discrete gate driver layout complexity and timing mismatch; reduces BOM count and board area |
| Diode emulation function | Enables discontinuous conduction mode (DCM) for improved light-load efficiency without external control logic |
| Ultra-low inductance package | Minimizes switching loop parasitics to suppress voltage overshoot and EMI - critical for >1-MHz operation |
| System-optimized PCB footprint | Designed for minimal trace length between VIN, PGND, and VSW - simplifies layout and improves thermal performance |
| Thermally enhanced topside cooling | Allows direct heatsink attachment to exposed top copper - increases power handling beyond bottom-side-only QFN limits |
Applications
| Server VR12.x/VR13.x Core Rails | Graphics Card GPU Voltage Regulation |
|---|---|
Use Scenario: High-current, fast-transient core power delivery for dual-socket x86 servers compliant with Intel VR12.5/VR13 specifications. IC Role / Device Role / Timing Role: Synchronous buck power stage providing regulated 0.8–1.8 V output with dynamic voltage/frequency scaling (DVFS) support. Use Value: 40-A continuous rating and 93.5%+ efficiency at 20 A reduce system-level thermal design margin and enable higher compute density per U. | Use Scenario: Multi-phase POL regulation for discrete GPUs requiring tight voltage tolerance (<±10 mV) and sub-100-ns load-step response. IC Role / Device Role / Timing Role: Single-phase smart power stage in interleaved multiphase VR; synchronized via PWM and TAO-OR'd thermal feedback. Use Value: Integrated bi-directional current sensing and analog temperature output eliminate external components while enabling precise per-phase current balancing and thermal derating. |
| Memory Module DDR5 VDDQ Regulation | AI Accelerator Board Core Supply |
Use Scenario: Point-of-load regulation for DDR5 memory VDDQ rail (1.25 V ±3%) in high-bandwidth memory subsystems. IC Role / Device Role / Timing Role: High-frequency (≥1 MHz) buck stage delivering up to 35 A per phase with fast transient recovery for burst-mode memory access. Use Value: Tri-state PWM compatibility and diode emulation mode maintain efficiency during low-duty-cycle memory refresh cycles without controller firmware changes. | Use Scenario: Core voltage supply for 7 nm/5 nm AI inference accelerators with aggressive DVFS profiles and thermal throttling requirements. IC Role / Device Role / Timing Role: Smart power stage providing real-time current and temperature telemetry to host PMIC or BMC via IOUT/TAO analog outputs. Use Value: Analog TAO output with integrated ORing diode enables centralized thermal monitoring across 8+ phases using one ADC channel - reducing system cost and complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95492QVM | Same pinout, 60-A peak current rating, identical feature set including TAO, IOUT, and EN/FCCM functionality | Targeted for higher-current VR designs (e.g., next-gen server CPUs); shares same layout and thermal management strategy | Select when peak current demand exceeds 40 A but board space and control interface must remain unchanged |
| TPS53679 | Multi-phase controller (not power stage); drives external DrMOS or discrete FETs; includes SMBus/PMBus interface and digital telemetry | Used in fully digital VR solutions requiring programmable loop compensation, fault logging, and remote configuration | Choose when system-level digital control, phase shedding, or telemetry integration outweighs the simplicity of integrated power stage architecture |
Compared with CSD95482RWJ, CSD95492QVM offers higher peak current headroom in identical form factor, while TPS53679 shifts intelligence to the controller layer - making CSD95482RWJ optimal for analog-controlled, high-density, cost-sensitive POL where integration and thermal performance are prioritized over digital configurability.
Availability
CSD95482RWJ is available at Aetrix Electronics and suitable for server VR12.x/VR13.x core rails, graphics card GPU voltage regulation, and AI accelerator board core supplies requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.
Supply support for CSD95482RWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and signal chain solutions.
The CSD95482RWJ belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current point-of-load applications in datacenter, graphics, and AI hardware where thermal density, efficiency, and integration are critical design constraints.
FAQ
What is the maximum continuous output current rating for the CSD95482RWJ?
The CSD95482RWJ is rated for 40-A continuous output current under standard test conditions: VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz, and TA = 25°C. This rating assumes proper PCB layout with adequate copper area for thermal dissipation and recommended input/output capacitance. Derating applies at higher ambient temperatures or elevated switching frequencies.
Does the CSD95482RWJ require an external bootstrap diode?
No, the CSD95482RWJ integrates a bootstrap diode internally. The BOOT pin connects to an external 0.1-µF (minimum), 16-V X5R ceramic capacitor referenced to BOOTR, eliminating the need for discrete bootstrap diodes and simplifying layout. This integration reduces component count and improves reliability in high-frequency synchronous buck designs.
How does the CSD95482RWJ implement current sensing without a shunt resistor?
The CSD95482RWJ uses integrated MOSFET RDS(on)-based current sensing with temperature compensation. It measures voltage drop across the low-side FET using VOS and REFIN inputs, then outputs a proportional analog current signal on IOUT. The LSET pin allows calibration for specific inductor values, enabling accurate phase-current measurement without external sense resistors or associated power loss.
Can the CSD95482RWJ be used in multiphase configurations?
Yes, the CSD95482RWJ is explicitly designed for multiphase synchronous buck converters. Its TAO/FLT pin includes an integrated ORing diode, allowing multiple CSD95482RWJ devices to share a single analog temperature monitoring line. Combined with matched propagation delay and current-sense accuracy, this enables precise per-phase current balancing and coordinated thermal management across 2–8 phases.
What is the purpose of the EN/FCCM pin on the CSD95482RWJ?
The EN/FCCM pin on the CSD95482RWJ serves dual functions: applying a logic high enables Forced Continuous Conduction Mode (FCCM), holding it low disables both FETs, and driving it into the tri-state window for longer than the hold-off time activates Diode Emulation Mode. This eliminates the need for external mode-select logic and allows dynamic efficiency optimization based on load conditions - all within the CSD95482RWJ itself.
CSD95482RWJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 40A
- Current - Peak Output:
- 60A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95482RWJ FAQ
1.How can I place an order for CSD95482RWJ through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95482RWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95482RWJ reliable?
The price and inventory of CSD95482RWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95482RWJ is usually 5 days.
3.What payment methods are accepted for CSD95482RWJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95482RWJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95482RWJ?
CSD95482RWJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95482RWJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95482RWJ?
For technical support, including CSD95482RWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95482RWJ requirements.
6.How does Aetrix verify that CSD95482RWJ is sourced from the original manufacturer or authorized distributors?
All CSD95482RWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95482RWJ meets industry standards.
7.What is the process for return or replacement of CSD95482RWJ?
All CSD95482RWJ units undergo pre-shipment inspection (PSI). If there is an issue with CSD95482RWJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95482RWJ part is unused and in its original packaging.
Return procedure for CSD95482RWJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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