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Texas Instruments CSD95485RWJ
- Part No.:
- CSD95485RWJ
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95485RWJ.pdf
- Description:
- IC HALF BRIDGE DRIVER 75A 41VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,081
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Product details
Overview
CSD95485RWJ from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating high-side and low-side MOSFETs with an integrated gate driver, current sensing, and temperature monitoring. It delivers 75-A continuous output current at up to 1.25 MHz switching frequency, supports 4.5–16-V input and 5.5-V max output, and operates with 3.3-V/5-V PWM logic. It is used in high-density VR12.x/VR13.x voltage regulator modules for server CPUs and GPUs.
For engineers reviewing the CSD95485RWJ datasheet, CSD95485RWJ pinout, CSD95485RWJ application, or CSD95485RWJ equivalent, key selection criteria include its 41-pin VQFN-CLIP (5 mm × 6 mm) package, bi-directional current sense accuracy, diode emulation mode, thermally enhanced topside cooling, and compatibility with PMBus-enabled controllers like TPS53688 in multiphase POL systems.
Technical Context
The CSD95485RWJ implements a fully integrated synchronous buck power stage with embedded driver IC, dual MOSFETs, and analog sensing circuitry. Its architecture includes integrated bootstrap switch, optimized dead-time control for shoot-through prevention, and tri-state PWM input with configurable FCCM/diode emulation via EN/FCCM pin.
It features temperature-compensated bi-directional current sensing using IOUT/REFIN differential output and analog temperature reporting via TAO/FLT pin. The LSET pin allows external inductor value calibration, and VOS enables precise output voltage sensing for current reconstruction - all supporting closed-loop control without external op-amps or ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 75 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU core rails. |
| Switching Frequency | Up to 1250 kHz - allows smaller magnetics and faster transient response in space-constrained VRMs. |
| Input Voltage Range | 4.5 V to 16 V - compatible with 5 V, 12 V, and hybrid input bus architectures in servers and AI accelerators. |
| Thermal Resistance θJB | 2.2 °C/W - enables high-power operation with minimal board-level thermal impedance via exposed thermal pad soldering. |
| PWM Logic Compatibility | 3.3 V and 5 V - interoperable with TI's TPS53688 and other industry-standard VR controllers without level-shifting. |
| Current Sense Accuracy | Temperature-compensated bi-directional sensing - supports accurate phase current balancing and lossless DCR sensing in multiphase designs. |
| Package Dimensions | 5.0 mm × 6.0 mm QFN-CLIP (RWJ) - ultra-low-inductance layout with 41 pins including 10 SW pins and 12 PGND pins for optimal power delivery integrity. |
Pinout & Package
The CSD95485RWJ uses a 41-pin VQFN-CLIP (RWJ) package with 5.0 mm × 6.0 mm footprint, thermally enhanced topside cooling, and an exposed thermal pad requiring PCB soldering for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (pins 25–30) | High-side MOSFET drain supply | Accepts 4.5–16 V input; multiple parallel pins reduce IR drop and improve current sharing into internal FETs. |
| SW (pins 10–19) | Phase node connection | Connects HS source and LS drain to output inductor; 10 parallel pins minimize switching node inductance and EMI. |
| PGND (pins 5, 7–9, 20–24, 40) | Power ground return | 12 dedicated PGND pins provide low-impedance return path for high di/dt currents and stabilize gate drive loops. |
| PWM (pin 34) | Tri-state gate control input | Directly drives internal driver; Hi-Z > T3HT enables shutdown, logic high/low controls HS/LS FET states. |
| EN/FCCM (pin 35) | Diode emulation / forced CCM enable | Configurable mode selection: tri-state enables diode emulation; high = FCCM; low = disable - no external logic required. |
| IOUT / REFIN (pins 38–39) | Differential current sense output | V(IOUT) – V(REFIN) ∝ phase current; supports lossless DCR sensing and real-time current monitoring without shunt resistor. |
| TAO/FLT (pin 36) | Temperature amplifier / fault indicator | Analog voltage proportional to die temperature; integrated ORing diode enables multi-phase thermal wire-ORing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated driver + dual MOSFETs | Eliminates discrete gate driver design, reduces BOM count, and ensures matched timing between HS/LS switches. |
| Bi-directional current sensing | Enables accurate inductor current reconstruction during both on- and off-times for precise current-mode control. |
| Diode emulation function | Improves light-load efficiency by disabling LS FET during discontinuous conduction mode without external circuitry. |
| Thermally enhanced topside cooling | Allows heat extraction from top surface via heatsink or thermal interface material - critical for high-power density VRMs. |
| System-optimized PCB footprint | Minimizes loop area for VIN–SW–PGND paths and integrates bootstrap capacitor routing - reduces EMI and layout iteration. |
Applications
| Server CPU VR12.x/VR13.x | GPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient core voltage regulation for dual-socket Xeon or EPYC processors in rack-scale servers. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in multiphase VRM delivering up to 75 A per phase with sub-100 ns response to load steps. Use Value: Enables 95%+ system efficiency at 30 A while maintaining tight ±3 mV output regulation under dynamic loads up to 100 A/µs. |
Use Scenario: Compact, high-efficiency power stage for PCIe-based AI accelerators and data-center GPUs requiring >60 A per rail. IC Role / Device Role / Timing Role: Single-phase building block in 4–6 phase VRMs, operating at 1 MHz to shrink inductor size and improve transient headroom. Use Value: Reduces total solution size by 35% vs. discrete solutions while maintaining <1.5°C junction rise at full load due to θJB = 2.2 °C/W. |
| Memory Module VR | High-Frequency POL Converter |
Use Scenario: Point-of-load regulation for DDR5 memory subsystems requiring stable 1.1 V at up to 40 A with ultra-low noise. IC Role / Device Role / Timing Role: Low-duty-cycle power stage supporting high VIN-to-VOUT ratios (12 V → 1.1 V) with precise current sensing for memory margining. Use Value: Delivers <15 mV peak-to-peak output ripple at 1.25 MHz switching, meeting JEDEC DDR5 VDDQ noise requirements without additional filtering. |
Use Scenario: Fast-response POL for FPGA I/O banks or ASIC auxiliary rails where layout space is constrained and thermal management is challenging. IC Role / Device Role / Timing Role: Self-contained power stage with integrated sensing and thermal feedback - eliminates need for external current sense amplifiers or thermal sensors. Use Value: Simplifies design cycle by 2–3 weeks through removal of 7–9 passive components and enables direct thermal derating via TAO/FLT analog output. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95484RWX | Same RWJ package and pinout; lower 60-A continuous rating and reduced thermal performance (θJB = 2.5 °C/W). | Suitable for mid-tier VRMs where peak current ≤60 A and thermal margin is less constrained. | Select CSD95484RWX only when full 75-A capability and lowest possible thermal resistance are not required. |
| ISL99390HRZ-T | 40-pin 5×6 mm QFN; 70-A rating; lacks integrated LSET calibration and analog temperature output (uses digital SMBus thermal readback). | Better suited for SMBus/PMBus-centric systems requiring digital telemetry over analog outputs. | Choose ISL99390HRZ-T when digital thermal/current reporting and PMBus compliance outweigh need for analog TAO/FLT and LSET flexibility. |
Compared with CSD95485RWJ, CSD95484RWX offers identical layout compatibility but trades 15-A current headroom and 0.3 °C/W higher board thermal resistance, while ISL99390HRZ-T provides digital telemetry at the cost of analog sensing fidelity and requires SMBus infrastructure - making CSD95485RWJ optimal for analog-control, high-current, thermally demanding VRMs.
Availability
CSD95485RWJ is available at Aetrix Electronics and suitable for server CPU VRMs, GPU power delivery, DDR5 memory regulation, and high-frequency POL converters requiring stable component supply across long-lifecycle industrial and datacenter programs.
Supply support for CSD95485RWJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies for industrial, automotive, and computing markets.
The CSD95485RWJ belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-efficiency, high-density, multiphase synchronous buck converters in next-generation server and AI hardware.
FAQ
What is the maximum continuous output current supported by the CSD95485RWJ?
The CSD95485RWJ supports 75-A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, PVDD = 5 V, VOUT = 1.2 V, and fSW = 500 kHz. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a ≥1-in² copper area. Peak current capability reaches 105 A for short durations (tp = 50 µs).
Does the CSD95485RWJ require an external bootstrap diode?
No, the CSD95485RWJ integrates a bootstrap diode internally. A minimum 0.1-µF, 16-V X5R ceramic capacitor must be connected between BOOT (pin 33) and BOOTR (pin 32), but no external diode is needed. This integration simplifies layout, improves reliability, and eliminates one potential failure point in high-reliability server power supplies.
How does the CSD95485RWJ implement current sensing without a shunt resistor?
The CSD95485RWJ uses integrated temperature-compensated MOSFET RDS(on)-based current sensing. It measures voltage across internal FETs and reconstructs phase current via the differential IOUT/REFIN output. The LSET pin allows calibration to the actual inductor DCR value, enabling accurate lossless current sensing without adding resistive losses or board area for a shunt.
Can the CSD95485RWJ operate in diode emulation mode, and how is it enabled?
Yes, the CSD95485RWJ supports diode emulation mode to improve light-load efficiency. It is enabled by driving the EN/FCCM pin (pin 35) into the tri-state window (between 0.8 V and 2.0 V) for longer than the internal tri-state holdoff time (T3HT). In this mode, the low-side FET is disabled during discontinuous conduction, mimicking ideal diode behavior without external control logic.
What thermal metrics define the CSD95485RWJ's cooling performance?
The CSD95485RWJ specifies θJB = 2.2 °C/W (junction-to-board) and θJC = 7.4 °C/W (junction-to-case top). Its thermally enhanced topside cooling design allows heat extraction from the package top surface, and the exposed thermal pad must be soldered to a large PCB copper area for optimal performance. These metrics enable operation up to 125°C junction temperature with appropriate board-level thermal design.
CSD95485RWJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- DC-DC Converters, Synchronous Buck Converter
- Interface:
- Logic, PWM
- Load Type:
- Inductive, Capacitive, Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 75A
- Current - Peak Output:
- 105A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 5.5V (Max)
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95485RWJ FAQ
1.How can I place an order for CSD95485RWJ through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95485RWJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95485RWJ reliable?
The price and inventory of CSD95485RWJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95485RWJ is usually 5 days.
3.What payment methods are accepted for CSD95485RWJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95485RWJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95485RWJ?
CSD95485RWJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95485RWJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95485RWJ?
For technical support, including CSD95485RWJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95485RWJ requirements.
6.How does Aetrix verify that CSD95485RWJ is sourced from the original manufacturer or authorized distributors?
All CSD95485RWJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95485RWJ meets industry standards.
7.What is the process for return or replacement of CSD95485RWJ?
All CSD95485RWJ units undergo pre-shipment inspection (PSI). If there is an issue with CSD95485RWJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95485RWJ part is unused and in its original packaging.
Return procedure for CSD95485RWJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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