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Texas Instruments CSD95485RWJT
- Part No.:
- CSD95485RWJT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerTFQFN
- Datasheet:
-
CSD95485RWJT.pdf
- Description:
- IC HALF BRIDGE DRIVER 75A 41VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:322
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Product details
Overview
CSD95485RWJT from Texas Instruments is a 41-pin VQFN-CLIP synchronous buck NexFET™ Smart Power Stage integrating high-side and low-side MOSFETs with gate driver, current sensing, and temperature monitoring. It delivers 75-A continuous output current at 12-V input/1.8-V output, supports up to 1.25-MHz switching, and targets VR12.x/VR13.x voltage regulator applications in server and graphics cards.
For engineers reviewing the CSD95485RWJT datasheet, CSD95485RWJT pinout, CSD95485RWJT application, or CSD95485RWJT equivalent, key selection criteria include its 75-A continuous current rating, tri-state PWM compatibility, diode emulation mode, integrated bootstrap switch, and thermally enhanced 5-mm × 6-mm QFN package with topside cooling.
Technical Context
The CSD95485RWJT implements a fully integrated synchronous buck power stage with monolithic driver IC and dual-cooled MOSFETs in a single clip-bonded QFN. Its internal current sense uses temperature-compensated bi-directional amplification referenced to REFIN, while TAO/FLT provides analog thermal reporting with built-in ORing for multi-phase systems.
It supports both forced continuous conduction mode (FCCM) and diode emulation via EN/FCCM pin control, and features optimized dead time to prevent shoot-through. The BOOT/BOOTR pins integrate a bootstrap diode and support ≥0.1-µF ceramic capacitors for high-frequency operation up to 1.25 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 75 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-stage high-current POL conversion without parallel stages |
| Switching Frequency | Up to 1250 kHz - allows smaller external inductors and faster transient response in space-constrained VR designs |
| Efficiency | >95% at 30 A - reduces system power loss and thermal load in dense server VRMs |
| Package | VQFN-CLIP (RWJ), 5.0 mm × 6.0 mm × 0.9 mm - ultra-low-inductance footprint with exposed thermal pad and topside cooling capability |
| PWM Input Compatibility | 3.3-V and 5-V logic levels with tri-state support - interoperable with TI's TPS53688 and other VR controllers without level-shifting |
| Current Sensing | Temperature-compensated bi-directional IOUT output referenced to REFIN - enables accurate phase-current monitoring across temperature |
| Thermal Protection | Integrated TAO/FLT pin with ORing diode - simplifies multi-phase thermal monitoring using single-wire daisy-chain |
Pinout & Package
VQFN-CLIP (RWJ) 41-pin package with 5.0-mm × 6.0-mm body, 0.9-mm height, and exposed thermal pad on underside; designed for top-side cooling and high-density PCB layout with optimized thermal vias and solder mask openings per TI SLPS721 land pattern.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 25–30) | Input power supply connection | Multiple parallel pins reduce impedance and distribute high input current from bulk capacitors |
| PGND (Pins 5, 7–9, 20–24, 40) | Power ground return path | 14 dedicated PGND pins minimize ground loop inductance and improve EMI performance |
| VSW (Pins 10–19) | Switch node (HS source / LS drain) | 10 parallel SW pins connect directly to output inductor, reducing parasitic inductance and ringing |
| PWM (Pin 34) | Tri-state gate control input | Accepts 3.3-V/5-V logic; Hi-Z state triggers automatic shutdown after holdoff time |
| EN/FCCM (Pin 35) | Enable / FCCM / diode emulation control | Configurable via DC level or tri-state window: low = disable, high = FCCM, Hi-Z = diode emulation |
| TAO/FLT (Pin 36) | Temperature amplifier / fault indicator | Analog voltage proportional to die temperature; pulled to 3.3 V during thermal shutdown or HSS/LSOC fault |
| IOUT (Pin 38) | Current sense amplifier output | Differential output referenced to REFIN; enables precise real-time phase current measurement |
| BOOT / BOOTR (Pins 33 / 32) | Bootstrap capacitor interface | Integrated bootstrap diode; requires ≥0.1-µF ceramic cap between BOOT and BOOTR for HS FET drive |
Key Features
| Feature | Design Value |
|---|---|
| 75-A continuous current capability | Enables single-chip solution for high-power CPU/GPU VRMs without paralleling multiple power stages |
| Diode emulation function | Reduces light-load power loss by disabling LS FET during discontinuous conduction mode |
| Integrated bootstrap switch | Eliminates external bootstrap diode, saving board space and improving reliability in high-reliability systems |
| Optimized dead time for shoot-through protection | Prevents simultaneous conduction of HS and LS FETs without requiring external timing adjustment |
| Thermally enhanced topside cooling | Allows direct heatsink attachment to package top, increasing thermal headroom in constrained airflow environments |
| System-optimized PCB footprint | Minimizes trace length and loop area for VIN, PGND, and VSW paths-reducing EMI and improving efficiency |
Applications
| Server VR12.x/VR13.x Core Regulation | Graphics Card GPU Voltage Regulation |
|---|---|
|
Use Scenario: High-current, fast-transient core voltage regulation for dual-socket Xeon Scalable processors. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering up to 75 A per phase in multiphase VR13.x topology. Use Value: Enables compact, high-efficiency 3+3 or 4+3 phase VRMs meeting Intel VR13.x specification with <1.2-V output and <10-ns minimum on-time. |
Use Scenario: Dynamic GPU core voltage scaling under variable compute load in PCIe-based graphics accelerators. IC Role / Device Role / Timing Role: High-frequency (≥1 MHz) power stage supporting rapid load-step response and adaptive voltage positioning (AVP). Use Value: Delivers >95% efficiency at 30 A and maintains tight output regulation during 10-A/µs transients due to low-inductance layout and integrated sensing. |
| High-Density Memory Subsystem Regulation | AI Accelerator Board POL Conversion |
|
Use Scenario: Point-of-load regulation for DDR5 memory modules requiring stable 1.1-V supply with low noise and ripple. IC Role / Device Role / Timing Role: Single-phase or interleaved power stage operating at 600–1000 kHz to minimize inductor size and board area. Use Value: Ultra-low-inductance package and integrated current/temperature sensing simplify feedback design and improve transient accuracy. |
Use Scenario: Compact, high-reliability power delivery for edge AI inference accelerators with thermal constraints. IC Role / Device Role / Timing Role: Thermally robust power stage with topside cooling, supporting 75-A continuous current in confined chassis space. Use Value: Exposed thermal pad and TAO/FLT pin enable direct thermal monitoring and active thermal throttling coordination with host SoC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95484RWX | Same RWJ package, but rated for 60-A continuous current and lower peak efficiency (94.5% at 30 A); lacks LSET pin for inductor calibration. | Targeted at mid-range VRMs where 60-A capacity suffices; not suitable for 75-A VR13.x core rails. | Select CSD95484RWX only when thermal budget and peak current requirements are relaxed and cost optimization is prioritized. |
| ISL99227BIRZ | 40-pin 5×6-mm QFN, 70-A continuous rating, supports 1.5-MHz switching, includes PMBus interface; no analog TAO output. | Designed for digital control ecosystems (e.g., with ISL68xx controllers); requires PMBus communication instead of analog sensing. | Choose ISL99227BIRZ when digital telemetry, fault logging, and dynamic configuration via PMBus are required over analog simplicity. |
Compared with CSD95485RWJT, CSD95484RWX offers lower current and sensing flexibility at reduced cost, while ISL99227BIRZ trades analog thermal/current outputs for digital configurability and marginally higher frequency-making CSD95485RWJT optimal for analog-controlled, thermally demanding VR13.x implementations.
Availability
CSD95485RWJT is available at Aetrix Electronics and suitable for server VRMs, GPU voltage regulation, AI accelerator boards, and high-density memory subsystems requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.
Supply support for CSD95485RWJT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-performance power delivery solutions.
The CSD95485RWJT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-current, high-frequency synchronous buck converters in datacenter and computing applications where density, efficiency, and thermal performance are critical.
FAQ
What is the maximum continuous output current rating for the CSD95485RWJT?
The CSD95485RWJT is rated for 75-A continuous output current under specified conditions: VIN = 12 V, VDD = 5 V, PVDD = 5 V, VOUT = 1.2 V, and fSW = 500 kHz. This rating assumes proper PCB thermal design with adequate copper area and vias under the exposed thermal pad. Peak current capability reaches 105 A for short durations.
Does the CSD95485RWJT support diode emulation mode, and how is it enabled?
Yes, the CSD95485RWJT supports diode emulation mode to improve light-load efficiency. It is enabled by driving the EN/FCCM pin into the tri-state window (between 0.8 V and 2.0 V) for longer than the internal tri-state holdoff time (T3HT). In this mode, the low-side FET is turned off during discontinuous conduction, mimicking diode behavior without external components.
What is the purpose of the LSET pin on the CSD95485RWJT?
The LSET pin on the CSD95485RWJT connects to PGND through an external resistor to calibrate the internal current-sense gain for the specific output inductor value. This resistor sets the full-scale current threshold used by the bi-directional current-sense amplifier, ensuring accurate IOUT output across varying inductor DCR and temperature conditions.
Can the CSD95485RWJT be used with 3.3-V PWM controllers like the TPS53688?
Yes, the CSD95485RWJT is explicitly designed for 3.3-V and 5-V PWM signal compatibility. Its PWM input (Pin 34) accepts logic-high thresholds down to 2.0 V and supports tri-state operation-making it fully interoperable with TI's TPS53688 and other modern VR controllers without level-shifting circuitry.
How does the TAO/FLT pin function in multi-phase CSD95485RWJT configurations?
In multi-phase systems, the TAO/FLT pins of multiple CSD95485RWJT devices are connected in a single-wire daisy chain. Each device integrates an ORing diode, so only the highest reported temperature (i.e., the hottest phase) appears at the controller end. If thermal shutdown or HSS/LSOC fault occurs, TAO/FLT is pulled to 3.3 V, signaling immediate system-level thermal protection.
CSD95485RWJT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 41-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- DC-DC Converters, Synchronous Buck Converter
- Interface:
- Logic, PWM
- Load Type:
- Inductive, Capacitive, Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 75A
- Current - Peak Output:
- 105A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 5.5V (Max)
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-VQFN-CLIP (5x6)
CSD95485RWJT FAQ
1.How can I place an order for CSD95485RWJT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95485RWJT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95485RWJT reliable?
The price and inventory of CSD95485RWJT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95485RWJT is usually 5 days.
3.What payment methods are accepted for CSD95485RWJT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95485RWJT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95485RWJT?
CSD95485RWJT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95485RWJT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95485RWJT?
For technical support, including CSD95485RWJT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95485RWJT requirements.
6.How does Aetrix verify that CSD95485RWJT is sourced from the original manufacturer or authorized distributors?
All CSD95485RWJT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95485RWJT meets industry standards.
7.What is the process for return or replacement of CSD95485RWJT?
All CSD95485RWJT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95485RWJT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95485RWJT part is unused and in its original packaging.
Return procedure for CSD95485RWJT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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