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Texas Instruments CSD95490Q5MCT
- Part No.:
- CSD95490Q5MCT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD95490Q5MCT.pdf
- Description:
- IC HALF BRIDGE DRIVER 75A 12VSON
- Quantity:
- Payment:
- Shipping:
Inventory:960
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Product details
Overview
CSD95490Q5MCT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single VSON-CLIP (DMC) package. It delivers 75-A continuous output current at up to 1.25 MHz switching frequency, supports 3.3-V/5-V PWM inputs, and features integrated bi-directional current sensing with temperature compensation. It is designed for high-density VR12.x/VR13.x voltage regulator modules in server CPU and GPU power delivery.
For engineers reviewing the CSD95490Q5MCT datasheet, CSD95490Q5MCT pinout, CSD95490Q5MCT application, or CSD95490Q5MCT equivalent, key selection criteria include its 75-A continuous current rating, 5-mm × 6-mm thermally enhanced footprint, tri-state PWM interface, diode emulation mode, and analog temperature output for thermal monitoring in multiphase POL systems.
Technical Context
The CSD95490Q5MCT implements a high-speed synchronous buck power stage with integrated gate drivers, high-side and low-side silicon-based NexFET™ MOSFETs, and precision current-sensing circuitry. Its internal current sense uses REFEN/IOUT differential pair with LSET resistor calibration and VOS feedback path for accurate phase-current reporting.
It supports dual-mode operation via EN/FCCM pin: forced continuous conduction mode (FCCM) when high, diode emulation mode (DEM) when held in tri-state window, and shutdown when low. The TAO/FLT pin provides temperature-proportional analog voltage with integrated ORing diode for multiphase thermal monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 75 A at VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU cores. |
| Switching Frequency | Up to 1.25 MHz - allows smaller external inductors and faster transient response in compact VR designs. |
| PWM Input Compatibility | 3.3-V and 5-V logic levels - interoperable with common digital controllers without level-shifting. |
| Current Sensing Accuracy | Temperature-compensated bi-directional sensing - eliminates external current-sense amplifiers and improves load-line accuracy. |
| Package Thermal Performance | VSON-CLIP (DMC), 5 mm × 6 mm with exposed thermal pad - enables topside cooling and >95% efficiency at 30 A. |
| Fault Monitoring | Integrated thermal shutdown, LSOC, and HSS detection with TAO/FLT pin alert - simplifies system-level fault handling. |
| Bootstrap Integration | Internal bootstrap diode + BOOT/BOOT_R pins - reduces external component count and improves reliability. |
Pinout & Package
VSON-CLIP (DMC) package, 12-pin, 5.00-mm × 6.00-mm outline with exposed thermal pad; optimized for low-inductance PCB layout and top-side thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| REFIN | Reference input for current-sense amplifier | Provides stable bias point for differential current measurement; must be decoupled to PGND. |
| IOUT | Current-sense amplifier output | V(IOUT) – V(REFIN) ∝ phase current; used by controller for real-time current monitoring and protection. |
| LSET | Inductor value calibration input | Resistor-to-PGND sets gain for internal current-sense circuitry per selected inductor value. |
| VDD | Driver supply rail | 4.5–5.5 V supply for gate drivers and internal logic; separate from VIN to improve noise immunity. |
| VOS | Output voltage sense for current sensing | Connects to regulated output to enable accurate current reconstruction independent of VOUT ripple. |
| SW | Switch node | Phase node connecting HS source and LS drain; connects directly to output inductor and LC filter. |
| VIN | Main input power rail | 4.5–16 V input; requires local ceramic decoupling near pin to minimize high-frequency loop inductance. |
| BOOT / BOOT_R | Bootstrap capacitor terminals | BOOT connects to bootstrap cap anode; BOOT_R is internal return - integrated diode eliminates external diode. |
| PWM | Tri-state control input | Logic high → HS on/LS off; logic low → HS off/LS on; Hi-Z > t3HT → both FETs off (safe shutdown). |
| EN/FCCM | Enable / mode-select pin | High → FCCM; tri-state hold → DEM; low → disable - dual function reduces controller pin count. |
| TAO/FLT | Temperature amplifier output / fault indicator | Analog voltage ∝ die temperature; pulled to 3.3 V during thermal shutdown, LSOC, or HSS fault. |
| PGND | Power ground reference | Low-impedance return path for high di/dt currents; must be connected to thermal pad and solid ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| 75-A continuous current capability | Enables single-phase implementation in high-end VR12.x/VR13.x CPU/GPU regulators, reducing phase count and BOM cost. |
| Over 95% system efficiency at 30 A | Minimizes power loss and thermal stress in dense server and AI accelerator power stages. |
| Diode emulation function | Improves light-load efficiency in DCM operation without requiring external control logic or additional ICs. |
| Thermally enhanced topside cooling | Exposes die surface through top metal pad - compatible with cold plate or heatsink attachment for >125°C junction operation. |
| System-optimized PCB footprint | Reduces layout complexity and parasitic inductance; supports standard QFN assembly processes and automated optical inspection. |
| RoHS-compliant, halogen-free construction | Meets industrial and datacenter environmental compliance requirements without performance trade-offs. |
Applications
| Server CPU Voltage Regulator | GPU Power Delivery Module |
|---|---|
|
Use Scenario: High-current, fast-transient power delivery for Intel/AMD server processors operating under dynamic workloads. IC Role / Device Role / Timing Role: Synchronous buck power stage providing regulated Vcore with precise current telemetry and thermal feedback. Use Value: Enables VR13.x compliance with <1% load-line accuracy and <500 ns transient response using integrated current sensing and TAO monitoring. |
Use Scenario: Compact, multi-phase POL for NVIDIA/AMD datacenter GPUs with strict thermal and space constraints. IC Role / Device Role / Timing Role: High-frequency (1.25 MHz) power stage supporting small inductors and minimizing board area per phase. Use Value: Delivers 75-A continuous current per phase while maintaining >95% efficiency at 30 A, reducing total system power loss and cooling requirements. |
| AI Accelerator Board VR | High-Density Memory Subsystem |
|
Use Scenario: Powering ASIC-based AI training accelerators requiring tight voltage regulation and real-time current monitoring. IC Role / Device Role / Timing Role: Smart power stage with bi-directional current sense and analog temperature output for closed-loop thermal management. Use Value: Eliminates need for external current-sense resistors and discrete temperature sensors, improving signal integrity and reducing component count. |
Use Scenario: DDR5 memory channel VRMs where EMI, efficiency, and thermal density are critical in blade servers. IC Role / Device Role / Timing Role: Low-inductance, high-efficiency buck stage supporting high-frequency switching and fast load-step response. Use Value: Ultra-low-inductance VSON-CLIP package minimizes switching node ringing and EMI, meeting DDR5 power integrity specifications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95492QVM | Includes PVDD pin for separate high-side gate drive supply; higher peak current rating (80 A); same pinout but different EN/FCCM behavior. | Targeted at ultra-high-current applications requiring independent gate drive bias; not drop-in compatible due to PVDD requirement and altered fault reporting. | Select CSD95492QVM only when PVDD-controlled gate drive stability is required and board layout accommodates extra supply rail. |
| ISL99227BIRZ | 70-A continuous rating; supports 1.5-MHz max switching; includes digital PMBus interface and fault logging; different pinout and package (5×6 QFN). | Suitable for digitally managed VRMs requiring telemetry, sequencing, and fault history - adds complexity but enables advanced power management. | Choose ISL99227BIRZ when PMBus telemetry, programmable parameters, or fault logging are mandatory; not pin-compatible with CSD95490Q5MCT. |
Compared with CSD95490Q5MCT, CSD95492QVM offers higher peak current and PVDD flexibility but requires layout changes, while ISL99227BIRZ adds digital control at the cost of analog simplicity and direct replacement feasibility.
Availability
CSD95490Q5MCT is available at Aetrix Electronics and suitable for server CPU VRMs, GPU power modules, AI accelerator boards, and high-density memory subsystems requiring stable component supply and long-term industrial lifecycle support.
Supply support for CSD95490Q5MCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in high-reliability power solutions.
The CSD95490Q5MCT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-efficiency, high-current, high-frequency DC-DC conversion in datacenter and AI infrastructure applications.
FAQ
What is the maximum continuous output current rating for the CSD95490Q5MCT?
The CSD95490Q5MCT is rated for 75-A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, and fSW = 500 kHz. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a solid ground plane and adequate airflow or heatsinking. Peak current capability reaches 105 A for short durations (tp = 50 µs), as specified in the datasheet's Recommended Operating Conditions table.
Does the CSD95490Q5MCT support both forced continuous conduction mode (FCCM) and diode emulation mode (DEM)?
Yes, the CSD95490Q5MCT supports both modes via the EN/FCCM pin. When driven high, it operates in FCCM; when held in the tri-state window for longer than the hold-off time (t3HT), it enters DEM for improved light-load efficiency. When pulled low, both MOSFETs are disabled. This dual functionality is implemented entirely within the CSD95490Q5MCT and requires no external components or controller firmware changes beyond standard PWM timing.
How does the current sensing architecture of the CSD95490Q5MCT differ from traditional shunt-based solutions?
The CSD95490Q5MCT uses an integrated, temperature-compensated bi-directional current-sense amplifier that measures voltage across internal MOSFET RDS(on) rather than an external shunt resistor. It employs REFEN and IOUT pins for differential output, with LSET resistor calibration and VOS feedback to maintain accuracy across temperature and load. This eliminates power loss, board space, and noise susceptibility associated with discrete shunts - a core design advantage confirmed in the device's Features and Pin Functions sections.
What package type and thermal characteristics define the CSD95490Q5MCT?
The CSD95490Q5MCT uses a VSON-CLIP (DMC) package: 12-pin, 5.00-mm × 6.00-mm body with an exposed thermal pad on the bottom and integrated topside metal for thermal conduction. Its ultra-low-inductance layout and thermally enhanced structure support >95% efficiency at 30 A and junction temperatures up to 125°C. The mechanical drawing and land pattern in the datasheet mandate soldering the thermal pad to a large copper area with thermal vias for optimal performance.
Can the CSD95490Q5MCT be used in multiphase VR designs, and how is thermal monitoring handled across phases?
Yes, the CSD95490Q5MCT is explicitly designed for multiphase synchronous buck converters. Its TAO/FLT pin includes an integrated ORing diode, enabling direct wire-OR connection of all TAO outputs in a multiphase setup. Only the highest die temperature among active phases is reported on the shared line - a feature documented in the Pin Functions table and Application Diagram section. This simplifies system-level thermal management without requiring external diodes or ADC channels per phase.
CSD95490Q5MCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 75A
- Current - Peak Output:
- 105A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON-CLIP (5x6)
CSD95490Q5MCT FAQ
1.How can I place an order for CSD95490Q5MCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95490Q5MCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95490Q5MCT reliable?
The price and inventory of CSD95490Q5MCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95490Q5MCT is usually 5 days.
3.What payment methods are accepted for CSD95490Q5MCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95490Q5MCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95490Q5MCT?
CSD95490Q5MCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95490Q5MCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95490Q5MCT?
For technical support, including CSD95490Q5MCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95490Q5MCT requirements.
6.How does Aetrix verify that CSD95490Q5MCT is sourced from the original manufacturer or authorized distributors?
All CSD95490Q5MCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95490Q5MCT meets industry standards.
7.What is the process for return or replacement of CSD95490Q5MCT?
All CSD95490Q5MCT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95490Q5MCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95490Q5MCT part is unused and in its original packaging.
Return procedure for CSD95490Q5MCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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