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Texas Instruments CSD95492QVM
- Part No.:
- CSD95492QVM
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 18-PowerTFDFN
- Datasheet:
-
CSD95492QVM.pdf
- Description:
- IC HALF BRIDGE DRIVER 20A 18VSON
- Quantity:
- Payment:
- Shipping:
Inventory:5,675
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Product details
Overview
CSD95492QVM from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single VSON-CLIP (DMH) package. It delivers 20-A continuous output current at 12 A with >94% system efficiency, supports up to 1.25 MHz switching frequency, and features diode emulation, bi-directional current sensing, and analog temperature output - optimized for high-density VR12.x/VR13.x voltage regulator modules in server and graphics applications.
For engineers reviewing the CSD95492QVM datasheet, CSD95492QVM pinout, CSD95492QVM application, or CSD95492QVM equivalent, key selection criteria include its 18-pin VSON-CLIP thermal performance, tri-state PWM compatibility, integrated bootstrap switch, fault monitoring capability, and 4 mm × 5 mm footprint suitability for multiphase POL converters.
Technical Context
The CSD95492QVM implements a fully integrated synchronous buck power stage with an internal gate driver controlling high-side and low-side NexFET™ MOSFETs. Its current sensing architecture uses external REFIN and internal LSET resistor programming to calibrate inductor-based phase current measurement, while VOS provides output voltage feedback for sensing accuracy.
Thermal management is enabled via TAO/FAULT pin delivering temperature-proportional voltage with integrated ORing diode for multiphase thermal reporting, and EN/FCCM supports dual-mode operation: forced continuous conduction (high), diode emulation (tri-state holdoff), or disable (low). The BOOT–BOOTR path integrates a bootstrap diode and supports ≥0.1 µF ceramic capacitor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 20 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VRMs. |
| Peak Output Current | 30 A for tp = 50 µs - sustains transient load steps without saturation or thermal shutdown. |
| Switching Frequency | Up to 1250 kHz - allows smaller magnetics and faster transient response in space-constrained designs. |
| Efficiency | >94% at 12 A, VIN = 12 V, VOUT = 1.2 V - reduces power loss and thermal load in multi-phase systems. |
| Package | VSON-CLIP (DMH), 4.0 mm × 5.0 mm, 18-pin - ultra-low-inductance layout with exposed thermal pad for PCB heat sinking. |
| PWM Compatibility | 3.3 V and 5 V logic levels with tri-state input - interoperable with TI's TPS53679 and other VR controller families. |
| Current Sensing | Temperature-compensated bi-directional analog IOUT/REFIN interface - eliminates need for external sense resistors and improves accuracy across temperature. |
Pinout & Package
VSON-CLIP (DMH) package with 4.0 mm × 5.0 mm footprint, 18-pin layout, and exposed thermal pad soldered to PCB for optimal thermal performance. Pin 1 located at top-left corner with index area marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BOOT | Bootstrap capacitor connection | Provides charge for high-side FET gate drive; requires ≥0.1 µF X5R ceramic cap to BOOTR. |
| BOOT_R | Bootstrap return path | Internally connected to VSW; completes bootstrap loop with minimal parasitic inductance. |
| VOS | Output voltage sense input | Feeds internal current sensing amplifier; enables accurate VOUT-referenced current measurement. |
| VSW | Phase node | Connects HS source and LS drain; directly interfaces with output inductor and LC filter. |
| TAO/FAULT | Temperature amplifier output / fault indicator | Outputs voltage proportional to die temperature; pulled to 3.3 V during thermal shutdown or fault events. |
| REFIN | Reference voltage input | Sets current sense gain baseline; used with IOUT to generate differential signal proportional to phase current. |
| IOUT | Current sense amplifier output | V(IOUT) – V(REFIN) ∝ phase current; supports closed-loop current mode control and telemetry. |
| LSET | Inductor value programming | Resistor to PGND sets inductance coefficient for internal current sensing calibration. |
| VDD | Driver supply | 4.5–5.5 V supply for gate drivers and internal circuitry; decoupling required near pin. |
| EN/FCCM | Enable / Forced CCM control | Tri-state pin: low = disable, high = FCCM, tri-state holdoff = diode emulation mode. |
| PWM | Tri-state PWM input | Directly controls HS/LS FET states; Hi-Z triggers automatic shutdown after t3HT timeout. |
| VIN | Main input supply | 4.5–16 V input rail; multiple pins (10–13) reduce IR drop and improve high-current delivery. |
| PGND | Power ground | High-current return path for MOSFETs and driver; separate from AGND to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated driver + dual NexFET™ MOSFETs | Eliminates discrete gate driver layout complexity and reduces component count in VRM power stages. |
| Diode emulation function | Enables discontinuous conduction mode (DCM) operation to improve light-load efficiency without external control. |
| Analog temperature output (TAO) | Enables real-time thermal monitoring and multiphase thermal balancing via wired-OR connection. |
| Optimized dead time control | Prevents shoot-through by dynamically adjusting HS/LS overlap timing, improving reliability at high fSW. |
| System-optimized PCB footprint | Minimizes loop inductance and thermal resistance through symmetric VIN/PGND pin placement and exposed thermal pad. |
Applications
| Server VR12.x/VR13.x Voltage Regulators | GPU Power Delivery Modules |
|---|---|
|
Use Scenario: High-current, fast-transient CPU core voltage regulation in dual-socket servers. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in multiphase VRM, delivering up to 20 A per phase with sub-100 ns response. Use Value: Enables compliance with Intel VR12.5/VR13.0 specifications including precise current reporting and thermal telemetry via TAO and IOUT. |
Use Scenario: Compact, high-efficiency power conversion for PCIe-based graphics cards with dynamic GPU load profiles. IC Role / Device Role / Timing Role: Single-phase or paralleled power stage supporting 1.2 V @ 30 A peak for GDDR6 memory and GPU cores. Use Value: Delivers >94% efficiency at 12 A and supports 1.25 MHz switching to shrink output filter size by ~40% vs. 500 kHz designs. |
| Memory Module VRMs | High-Density POL Converters |
|
Use Scenario: Point-of-load regulation for DDR4/DDR5 memory subsystems requiring tight voltage tolerance and low noise. IC Role / Device Role / Timing Role: Low-duty-cycle buck stage operating at high VIN-to-VOUT ratios (e.g., 12 V → 1.1 V) with diode emulation for idle efficiency. Use Value: Bi-directional current sensing ensures accurate memory channel current balancing and fault detection during write/read bursts. |
Use Scenario: Space-constrained embedded systems needing high-power density DC-DC conversion on mainboard or module. IC Role / Device Role / Timing Role: Standalone smart power stage interfaced with external PWM controller for flexible output voltage and sequencing. Use Value: 4 mm × 5 mm VSON-CLIP package achieves 20-A capability in <20 mm² board area, reducing total solution size by 35% vs. discrete solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490Q5M | Same VSON-CLIP package, 18-pin, but rated for 15-A continuous current and lower 1-MHz max fSW; lacks analog temperature output (TAO). | Targeted at mid-range VRMs where thermal telemetry and 20-A headroom are not required. | Select CSD95490Q5M when cost sensitivity outweighs need for full 20-A rating and multiphase thermal reporting. |
| TPS53679 + CSD95492QVM | TPS53679 is a 6-phase VR controller; not a direct replacement but a complementary controller designed to drive CSD95492QVM in multi-phase configurations. | Used together in full VRM solutions rather than as standalone alternatives; requires full controller + power stage co-design. | Choose TPS53679 only when implementing scalable 2–6 phase VRMs with digital telemetry, not as a drop-in substitute for CSD95492QVM. |
Compared with CSD95490Q5M, the CSD95492QVM offers higher current capability, extended frequency range, and integrated thermal telemetry - critical for server-grade VRMs. Unlike TPS53679, it is a power stage only and requires external PWM control, making it unsuitable as a controller replacement but ideal as a high-performance building block.
Availability
CSD95492QVM is available at Aetrix Electronics and suitable for server VRMs, GPU power modules, DDR5 memory regulators, and high-density POL converters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95492QVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processing, and power management ICs for industrial, automotive, and computing markets.
The CSD95492QVM belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-efficiency, high-current, high-frequency synchronous buck conversion in next-generation data center and graphics power delivery systems.
FAQ
What is the maximum continuous output current rating for the CSD95492QVM?
The CSD95492QVM is rated for 20-A continuous output current under specified conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and TA = 25°C. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a sufficient copper area. Peak current capability reaches 30 A for short-duration transients (tp = 50 µs), supporting demanding CPU/GPU load steps without derating.
Does the CSD95492QVM support diode emulation mode, and how is it enabled?
Yes, the CSD95492QVM supports diode emulation mode to improve light-load efficiency. It is enabled by driving the EN/FCCM pin into the tri-state window (between 0.8 V and 2.0 V) and holding it there for longer than the tri-state holdoff time (t3HT). When activated, the low-side FET operates as a synchronous rectifier during off-time, mimicking freewheeling diode behavior without requiring external control signals.
What package type and thermal characteristics does the CSD95492QVM use?
The CSD95492QVM uses a VSON-CLIP (DMH) package measuring 4.0 mm × 5.0 mm with 18 pins and an exposed thermal pad. The pad must be soldered to the PCB for effective heat dissipation. Thermal resistance (θJA) is optimized for high-power density layouts, and the integrated TAO pin provides real-time die temperature feedback - enabling thermal-aware system-level power management in multiphase VRMs.
Can the CSD95492QVM be used with 3.3-V PWM controllers?
Yes, the CSD95492QVM is explicitly designed for compatibility with both 3.3-V and 5-V PWM logic levels. Its PWM input accepts standard TTL/CMOS thresholds and supports tri-state operation - allowing seamless integration with TI's TPS53679, ISL912x, and other modern VR controllers. No level-shifting circuitry is required, simplifying system design and reducing BOM cost.
How does the CSD95492QVM implement current sensing without external shunt resistors?
The CSD95492QVM uses an integrated, temperature-compensated bi-directional current sensing architecture. It measures phase current via the voltage difference between IOUT and REFIN pins, calibrated using an external resistor on the LSET pin to match the output inductor value. This eliminates the need for lossy, space-consuming external shunts while maintaining ±3% accuracy across temperature and load - critical for precise current sharing in multiphase VRMs.
CSD95492QVM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 18-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 20A
- Current - Peak Output:
- 30A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-VSON (5x4)
CSD95492QVM FAQ
1.How can I place an order for CSD95492QVM through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95492QVM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95492QVM reliable?
The price and inventory of CSD95492QVM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95492QVM is usually 5 days.
3.What payment methods are accepted for CSD95492QVM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95492QVM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95492QVM?
CSD95492QVM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95492QVM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95492QVM?
For technical support, including CSD95492QVM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95492QVM requirements.
6.How does Aetrix verify that CSD95492QVM is sourced from the original manufacturer or authorized distributors?
All CSD95492QVM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95492QVM meets industry standards.
7.What is the process for return or replacement of CSD95492QVM?
All CSD95492QVM units undergo pre-shipment inspection (PSI). If there is an issue with CSD95492QVM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95492QVM part is unused and in its original packaging.
Return procedure for CSD95492QVM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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