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Texas Instruments CSD95492QVMT
- Part No.:
- CSD95492QVMT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 18-PowerTFDFN
- Datasheet:
-
CSD95492QVMT.pdf
- Description:
- IC HALF BRIDGE DRIVER 20A 18VSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,940
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Product details
Overview
CSD95492QVMT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating high-side and low-side MOSFETs with gate driver, current sensing, and temperature monitoring. It delivers 20-A continuous output current at up to 1.25 MHz switching frequency, supports 4.5–16 V input, operates with 3.3-V/5-V PWM logic, and features diode emulation mode for light-load efficiency-used in VR12.x/VR13.x multiphase CPU/GPU power delivery.
For engineers reviewing the CSD95492QVMT datasheet, CSD95492QVMT pinout, CSD95492QVMT application, or CSD95492QVMT equivalent, key selection criteria include its 18-pin VSON-CLIP (DMH) package, integrated bootstrap switch, tri-state PWM input, temperature-compensated bi-directional current sense, and compatibility with high-frequency, high-current POL converters requiring tight thermal and layout control.
Technical Context
The CSD95492QVMT implements a fully integrated synchronous buck power stage architecture with monolithic driver-MOSFET co-packaging in a thermally enhanced VSON-CLIP package. Its internal current sensing uses LSET-resistor–based inductor calibration and REF-IN/IOUT differential amplification with VOS feedback path compensation.
It supports dual-mode operation via EN/FCCM pin: forced continuous conduction mode (FCCM) when high, and diode emulation mode (DEM) when held in tri-state window-enabling seamless transition between high-efficiency light-load and high-performance heavy-load conditions without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 20 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - defines maximum sustained load capability under typical server VRM conditions. |
| Switching Frequency Range | Up to 1250 kHz - enables compact magnetics and fast transient response in high-density POL applications. |
| Input Voltage Range | 4.5 V to 16 V - supports 5 V, 12 V, and hybrid input rails common in desktop/server VRMs and GPU power stages. |
| PWM Logic Compatibility | 3.3 V and 5 V - ensures interoperability with industry-standard PMICs and digital controllers without level-shifting. |
| Thermal Shutdown Threshold | Junction temperature >150 °C - protects against thermal runaway during overload or airflow loss in enclosed systems. |
| Current Sense Accuracy | Temperature-compensated bi-directional sensing - maintains precision across –40 °C to 125 °C ambient, critical for phase-current balancing in multiphase designs. |
| Package Type | VSON-CLIP (DMH), 4.0 mm × 5.0 mm, 18-pin - ultra-low-inductance footprint optimized for high-frequency PCB layout and thermal dissipation via exposed thermal pad. |
Pinout & Package
VSON-CLIP (DMH) package: 4.0 mm × 5.0 mm body with exposed thermal pad; 18-pin configuration optimized for minimal loop inductance and high-current routing. Pin 1 located at top-left corner (Q1 quadrant per tape orientation).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BOOT | Bootstrap capacitor connection | Provides gate drive voltage for high-side FET; requires ≥0.1 µF X5R ceramic cap to BOOT_R for reliable 100% duty-cycle support. |
| BOOT_R | Bootstrap return path | Internally connected to VSW; establishes reference for bootstrap charge pump and minimizes shoot-through risk. |
| VOS | Output voltage sense input | Feeds internal current-sense amplifier; used with REF_IN to derive phase current proportional to V(IOUT) – V(REFIN). |
| VSW | Switch node | Connection point between HS-FET source and LS-FET drain; directly interfaces with output inductor and must be routed with minimal parasitic inductance. |
| TAO/FAULT | Temperature amplifier output / fault indicator | Analog voltage proportional to die temperature; OR-wired in multiphase systems; pulled to 3.3 V during thermal shutdown or HSS/LSOC fault. |
| REFIN | Reference input for current sense amp | Sets gain and offset of current sensing; connects to system ground or precision reference depending on controller interface. |
| IOUT | Current sense amplifier output | Differential output paired with REF_IN; provides analog current signal to external controller for phase-current monitoring and protection. |
| PGND | Power ground | High-current return path for both MOSFETs; must be tied to thermal pad and kept separate from AGND to avoid noise coupling. |
| LSET | Inductor value calibration | Resistor-to-PGND sets internal gain for inductor DCR-based current sensing; enables accurate current reporting without sense resistors. |
| VDD | Driver supply | 4.5–5.5 V supply for gate drivers and internal logic; decoupling required near pin to sustain high-frequency switching stability. |
| EN/FCCM | Enable / Forced CCM control | Tri-state pin: high = FCCM, floating/low = disable, tri-state hold = diode emulation - eliminates need for external mode-select logic. |
| PWM | Tri-state PWM input | Directly drives gate logic: low = HS off / LS on, high = HS on / LS off, Hi-Z = both off after t3HT timeout - simplifies controller interface. |
| VIN | Main input supply | 4.5–16 V input rail; four parallel pins reduce IR drop and improve current sharing into internal FETs and driver. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Switch | Eliminates external bootstrap diode, reduces BOM count, and improves reliability in high-reliability server power stages. |
| Optimized Dead Time Control | Prevents shoot-through by dynamically adjusting HS/LS overlap timing - critical for maintaining >94% efficiency at 12 A. |
| System-Optimized PCB Footprint | Minimizes high-di/dt loop area between VIN, VSW, and PGND - directly reduces EMI and improves stability in dense VRM layouts. |
| Analog Temperature Output (TAO) | Enables real-time thermal monitoring and multiphase temperature balancing without ADC or digital bus overhead. |
| Diode Emulation Function | Automatically disables LS-FET during light load to prevent reverse current, improving efficiency below 2 A without controller firmware changes. |
Applications
| Server VR13.x Voltage Regulator Module | GPU Core Power Delivery |
|---|---|
|
Use Scenario: High-current, multi-phase buck converter supplying 0.8–1.2 V to modern x86 CPUs with dynamic load steps up to 200 A/µs. IC Role / Device Role / Timing Role: Smart power stage providing switching, current sensing, and thermal feedback per phase in a 4–6 phase VRM. Use Value: Enables precise phase-current balancing and fast transient response while maintaining >94% efficiency at 12 A per phase and supporting VR13.x compliance. |
Use Scenario: Compact, high-efficiency power stage on graphics card PCB delivering up to 20 A per phase to GPU cores under burst workloads. IC Role / Device Role / Timing Role: Synchronous buck power stage with integrated current and temperature telemetry for closed-loop phase management. Use Value: Reduces board area by 30% vs discrete solutions and supports 1.25 MHz operation for smaller inductors and faster load-step recovery. |
| Memory Subsystem VR | AI Accelerator Board POL Converter |
|
Use Scenario: Point-of-load regulator powering DDR5 memory modules requiring tight voltage regulation (±10 mV) and low noise. IC Role / Device Role / Timing Role: Single-phase buck stage with analog current sense and TAO feedback for memory subsystem thermal-aware power control. Use Value: Delivers stable 1.1 V output with <1% load regulation error and enables predictive thermal throttling before memory junction exceeds 95 °C. |
Use Scenario: High-density power stage on AI training accelerator card delivering 1.0 V @ 18 A to ASIC fabric with strict thermal limits. IC Role / Device Role / Timing Role: Integrated power stage with tri-state PWM and diode emulation for adaptive efficiency across variable compute loads. Use Value: Achieves >93% efficiency at 10 A and >88% at 2 A, extending runtime during inference phases while maintaining safe die temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490Q5M | 20-A rating, same VSON-CLIP package, but lacks TAO/FAULT pin and diode emulation function; lower integration of sensing features. | Targeted at cost-sensitive single-phase VRMs where thermal telemetry and light-load optimization are not required. | Select CSD95490Q5M only if full multiphase coordination, analog temperature reporting, or automatic diode emulation are unnecessary. |
| CSD95497QVM | Same pinout and package, rated for 35-A continuous current, higher RDS(on) trade-off, and extended thermal performance up to 135 °C TJ. | Used in high-power GPU or AI ASIC applications demanding >25 A per phase with robust thermal headroom. | Choose CSD95497QVM when peak current exceeds 20 A or ambient temperature exceeds 85 °C with limited airflow. |
Compared with CSD95492QVMT, CSD95490Q5M omits critical telemetry and efficiency features needed for advanced VRMs, while CSD95497QVM trades package compatibility for higher current capacity-making CSD95492QVMT the optimal balance of integration, thermal intelligence, and 20-A capability in space-constrained designs.
Availability
CSD95492QVMT is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery, DDR5 memory regulators, and AI accelerator POL converters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95492QVMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management ICs, with leadership in high-efficiency power conversion and automotive-grade reliability.
The CSD95492QVMT belongs to TI's NexFET™ Smart Power Stage product line, designed specifically for high-frequency, high-current synchronous buck applications in datacenter, graphics, and AI hardware where integration, thermal intelligence, and layout simplicity are critical.
FAQ
What is the maximum recommended switching frequency for CSD95492QVMT?
The CSD95492QVMT supports switching frequencies up to 1250 kHz under recommended operating conditions (CBST ≥ 0.1 µF, VOUT ≤ 2.5 V). At 1.25 MHz, design must ensure adequate gate drive strength, minimized PCB loop inductance, and proper bootstrap capacitor sizing to maintain HS-FET turn-on margin. The CSD95492QVMT datasheet confirms this limit in Section 6.3.
Does CSD95492QVMT require an external bootstrap diode?
No, the CSD95492QVMT integrates a bootstrap switch, eliminating the need for an external bootstrap diode. A minimum 0.1-µF, 16-V X5R ceramic capacitor must be placed between BOOT and BOOT_R pins to sustain high-side FET gate drive. This integration reduces component count and improves reliability in high-density VRM designs using the CSD95492QVMT.
How does the EN/FCCM pin configure diode emulation mode on CSD95492QVMT?
When the EN/FCCM pin is held in the tri-state voltage window (between 0.8 V and 2.0 V) for longer than the t3HT holdoff time (~10 µs), the CSD95492QVMT automatically enters diode emulation mode-disabling the low-side FET during light load to prevent reverse current and improve efficiency. This behavior is confirmed in the CSD95492QVMT datasheet Pin Functions table and requires no external logic.
What is the purpose of the LSET pin on CSD95492QVMT?
The LSET pin on CSD95492QVMT connects to a resistor tied to PGND to calibrate the internal current-sensing circuit for the specific output inductor's DCR value. This enables accurate, temperature-compensated phase-current measurement without external sense resistors-reducing power loss and board area in systems using the CSD95492QVMT for multiphase current balancing.
Can CSD95492QVMT be used in a single-phase buck converter without a multiphase controller?
Yes, the CSD95492QVMT functions as a standalone synchronous buck power stage driven by any compatible PWM controller (e.g., TPS53679, ISL9123). Its tri-state PWM input, integrated current/temperature sensing, and diode emulation mode make it suitable for single-phase POL applications such as GPU core rails or FPGA I/O supplies-no multiphase coordination logic is required to operate the CSD95492QVMT.
CSD95492QVMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 18-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 20A
- Current - Peak Output:
- 30A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-VSON (5x4)
CSD95492QVMT FAQ
1.How can I place an order for CSD95492QVMT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95492QVMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95492QVMT reliable?
The price and inventory of CSD95492QVMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95492QVMT is usually 5 days.
3.What payment methods are accepted for CSD95492QVMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95492QVMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95492QVMT?
CSD95492QVMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95492QVMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95492QVMT?
For technical support, including CSD95492QVMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95492QVMT requirements.
6.How does Aetrix verify that CSD95492QVMT is sourced from the original manufacturer or authorized distributors?
All CSD95492QVMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95492QVMT meets industry standards.
7.What is the process for return or replacement of CSD95492QVMT?
All CSD95492QVMT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95492QVMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95492QVMT part is unused and in its original packaging.
Return procedure for CSD95492QVMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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