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Texas Instruments CSD95495QVM

Part No.:
CSD95495QVM
Manufacturer:
Texas Instruments
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
18-PowerTFDFN
Datasheet:
AetrixCSD95495QVM.pdf
Description:
IC HALF BRIDGE DRIVER 50A 18VSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,398

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Product details

Overview

CSD95495QVM from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating high-side and low-side MOSFETs with gate driver, current sensing, and temperature monitoring in a single VSON-CLIP (DMH) 4 mm × 5 mm package. It delivers 50-A continuous output current at up to 1.25 MHz switching frequency, supports 3.3-V/5-V PWM inputs, and features diode emulation mode for light-load efficiency in VR12.x/VR13.x voltage regulator modules used in server and graphics card POL applications.

For engineers reviewing the CSD95495QVM datasheet, CSD95495QVM pinout, CSD95495QVM application, or CSD95495QVM equivalent, key selection criteria include its 50-A continuous current rating, integrated bi-directional current sense with temperature compensation, tri-state PWM interface, fault reporting via TAO/FAULT pin, and optimized PCB footprint for multiphase high-density DC-DC converters.

Technical Context

The CSD95495QVM implements a fully integrated synchronous buck power stage architecture with monolithically integrated dual MOSFETs and driver IC. Its internal current sensing uses REF-IN/IOUT differential pair with LSET resistor-based inductor calibration, while VOS provides output voltage feedback for sensing accuracy.

Thermal management is enabled via analog TAO output proportional to junction temperature, supporting multiphase ORing; EN/FCCM pin provides dual-mode control-tri-state activation enables diode emulation, while logic-high forces continuous conduction. The BOOT/BOOT_R pins integrate bootstrap diode and support ≥0.1 µF ceramic capacitor for high-frequency HS gate drive.

Key Specifications

Parameter Value and Actual Design Meaning
Continuous Output Current 50 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VRMs.
Switching Frequency Up to 1250 kHz - allows compact magnetics and fast transient response in space-constrained POL designs.
System Efficiency Over 93.5% at 25 A - reduces thermal load and improves power density in multi-phase server VRMs.
PWM Input Compatibility 3.3-V and 5-V logic levels with tri-state capability - simplifies interface to TI's TPS53679 and other VR controllers without level-shifting.
Current Sensing Accuracy Temperature-compensated bi-directional sensing via REF-IN/IOUT - eliminates external sense resistor and improves phase-current balance in multiphase systems.
Package Thermal Performance VSON-CLIP (DMH) with exposed thermal pad - achieves low RθJA for sustained 50-A operation without forced airflow.
Fault Monitoring Dedicated TAO/FAULT pin with integrated ORing diode - enables system-level thermal shutdown and LSOC/HSS detection reporting across multiple phases.

Pinout & Package

VSON-CLIP (DMH) 4.00-mm × 5.00-mm package with 18-pin layout and exposed thermal pad requiring solder connection to PCB ground plane for thermal and mechanical integrity.

Pin/Terminal Circuit Role Design Meaning
REFIN Reference input for current sense amplifier Accepts external reference voltage to calibrate current measurement offset and gain.
IOUT Current sense amplifier output Provides differential voltage output proportional to phase current; used with REF-IN for closed-loop sensing.
LSET Inductor value configuration Resistor-to-PGND sets inductance scaling factor for internal current sensing circuitry.
VDD Driver supply rail 4.5–5.5 V supply powering gate drivers and internal logic; decoupling required near pin.
VOS Output voltage sense input Connects to regulated output node to enable accurate current sensing with VOUT feedback.
VSW Switch node Internal connection point between HS source and LS drain; connects directly to output inductor.
VIN Main input supply 4.5–16 V input rail; multiple pins (10–13) reduce parasitic inductance for high di/dt operation.
BOOT / BOOT_R Bootstrap supply path BOOT connects to bootstrap capacitor; BOOT_R is internal return - integrated diode eliminates external component.
PWM Tri-state control input Logic high drives HS on/LS off; logic low drives HS off/LS on; Hi-Z enables automatic shoot-through protection.
EN/FCCM Enable / forced CCM mode select Tri-state hold enables diode emulation; high enables FCCM; low disables both FETs - no external pull-up needed.
TAO/FAULT Temperature amplifier / fault output Analog voltage proportional to die temperature; pulled to 3.3 V during thermal shutdown or fault events.
PGND Power ground reference Low-inductance return path for high-current switching loops; must be connected to thermal pad.

Key Features

Feature Design Value
Integrated high- and low-side MOSFETs + driver Eliminates discrete gate driver layout complexity and reduces board area by >40% vs. discrete solutions.
Diode emulation function Enables discontinuous conduction mode (DCM) operation without external circuitry, improving light-load efficiency.
Temperature-compensated bi-directional current sense Removes need for external Kelvin-sense resistors and improves current matching across multiphase rails.
Optimized dead time control Prevents shoot-through during HS/LS transitions without requiring external timing components or controller tuning.
Ultra-low-inductance VSON-CLIP package Reduces switching losses and EMI by minimizing loop inductance in high-di/dt power paths.

Applications

Server VR12.x/VR13.x Voltage Regulators GPU Power Delivery Modules

Use Scenario: High-current, fast-transient CPU core voltage regulation in dual-socket enterprise servers.

IC Role / Device Role / Timing Role: Synchronous buck power stage in 4–6 phase VRM delivering 1.0–1.8 V at up to 600 A total.

Use Value: 50-A per phase rating and 1.25 MHz operation enable compact, high-efficiency VRMs meeting Intel VR13.x specification ripple and transient requirements.

Use Scenario: Point-of-load regulation for high-performance discrete graphics cards with dynamic GPU power states.

IC Role / Device Role / Timing Role: Phase-leg power stage in 3–5 phase GPU VRM supporting rapid load steps from idle to 400 W+.

Use Value: Diode emulation and bi-directional current sense ensure stable regulation during aggressive GPU DVFS transitions without audible coil whine.

Memory Subsystem VRMs (DDR4/DDR5) High-Density Industrial POL Converters

Use Scenario: Dedicated 1.2-V or 1.1-V supply for DDR4/DDR5 memory channels with tight voltage tolerance.

IC Role / Device Role / Timing Role: Single-phase or interleaved power stage providing low-noise, low-ripple output for memory I/O and core rails.

Use Value: VOS-referenced current sensing and analog temperature output enable precise load-line control and thermal derating per JEDEC specifications.

Use Scenario: Compact, high-reliability 12-V-to-3.3-V/5-V conversion in industrial programmable logic controllers and edge AI accelerators.

IC Role / Device Role / Timing Role: Primary buck stage operating at 1 MHz in thermally constrained enclosures with no airflow.

Use Value: Exposed thermal pad and -40°C to +125°C operating range ensure stable 50-A delivery under extended industrial temperature cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
CSD95492QVM Same VSON-CLIP package and pinout; lower 40-A continuous rating and reduced 1-MHz max switching frequency. Suitable for cost-sensitive mid-tier server or storage VRMs where peak current < 40 A and fSW ≤ 1 MHz. Select CSD95492QVM when full 50-A/1.25-MHz capability is not required - offers identical layout compatibility with lower BOM cost.
TPS53679 Multi-phase VR controller (not power stage); integrates PMBus, AVS, and digital telemetry - requires external power stages like CSD95495QVM. Used as master controller in VR13.x systems; cannot replace CSD95495QVM but pairs with it in complete VRM designs. Choose TPS53679 only as companion controller - it does not substitute for CSD95495QVM's power-switching function or current-sensing integration.

Compared with CSD95495QVM, CSD95492QVM offers pin-compatible down-binning for lower-current applications, while TPS53679 serves as a complementary digital controller rather than a functional alternative - neither is a drop-in replacement, but both enable scalable VRM architecture design.

Availability

CSD95495QVM is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery modules, and high-density industrial POL converters requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for CSD95495QVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and precision analog signal chains.

The CSD95495QVM belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in datacenter, graphics, and industrial POL applications where power density and thermal performance are critical.

FAQ

What is the maximum continuous output current rating for the CSD95495QVM?

The CSD95495QVM is rated for 50-A continuous output current under standard test conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and TA = 25°C. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a solid ground plane. Peak current capability reaches 75 A for short durations (tp = 50 µs).

Does the CSD95495QVM require an external bootstrap diode?

No, the CSD95495QVM integrates a bootstrap diode internally. The BOOT and BOOT_R pins form a dedicated bootstrap supply path, and only an external 0.1-µF (minimum), 16-V X5R ceramic capacitor is required between them. This eliminates one discrete component and reduces layout sensitivity in high-frequency designs.

How does the EN/FCCM pin function on the CSD95495QVM?

The EN/FCCM pin on the CSD95495QVM provides dual functionality: holding it in the tri-state window (>1.25 V and <1.75 V) for longer than the holdoff time enables diode emulation mode; driving it high enables forced continuous conduction mode (FCCM); pulling it low disables both MOSFETs. An internal pull-down resistor ensures safe default-off behavior if left floating.

Can the CSD95495QVM be used in multiphase VRM configurations?

Yes, the CSD95495QVM is explicitly designed for multiphase synchronous buck converters. Its TAO/FAULT pin includes an integrated ORing diode, allowing direct wire-OR connection of multiple CSD95495QVM devices to report the highest die temperature across all phases - a key feature for coordinated thermal management in VR12.x/VR13.x systems.

What package type and thermal requirements apply to the CSD95495QVM?

The CSD95495QVM uses the VSON-CLIP (DMH) 4 mm × 5 mm package with 18 terminals and an exposed thermal pad. TI mandates soldering this pad to a PCB thermal plane for reliable operation at rated current. The recommended land pattern and stencil opening are documented in SLPS671A, and thermal performance depends critically on copper area and via count beneath the pad.

CSD95495QVM Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
NexFET™
Package/Case:
18-PowerTFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge (3)
Applications:
Synchronous Buck Converters
Interface:
PWM
Load Type:
Inductive, Capacitive
Technology:
Power MOSFET
Rds On (Typ):
-
Current - Output / Channel:
50A
Current - Peak Output:
75A
Voltage - Supply:
4.5V ~ 5.5V
Voltage - Load:
4.5V ~ 16V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit
Fault Protection:
Shoot-Through
Mounting Type:
Surface Mount
Supplier Device Package:
18-VSON (5x4)

CSD95495QVM FAQ

1.How can I place an order for CSD95495QVM through Aetrix?

Please submit a Request for Quotation (RFQ) for CSD95495QVM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CSD95495QVM reliable?

The price and inventory of CSD95495QVM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95495QVM is usually 5 days.

3.What payment methods are accepted for CSD95495QVM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95495QVM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CSD95495QVM?

CSD95495QVM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CSD95495QVM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CSD95495QVM?

For technical support, including CSD95495QVM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95495QVM requirements.

6.How does Aetrix verify that CSD95495QVM is sourced from the original manufacturer or authorized distributors?

All CSD95495QVM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95495QVM meets industry standards.

7.What is the process for return or replacement of CSD95495QVM?

All CSD95495QVM units undergo pre-shipment inspection (PSI). If there is an issue with CSD95495QVM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CSD95495QVM part is unused and in its original packaging.

Return procedure for CSD95495QVM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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