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Texas Instruments CSD95496QVM
- Part No.:
- CSD95496QVM
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 18-PowerTFDFN
- Datasheet:
-
CSD95496QVM.pdf
- Description:
- IC HALF BRIDGE DRIVER 40A 18VSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,490
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Product details
Overview
CSD95496QVM from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and dual MOSFETs in a single VSON-CLIP (DMH) package. It delivers 40-A continuous output current at up to 1.25 MHz switching frequency, supports 3.3-V/5-V PWM inputs, and features integrated bi-directional current sensing with temperature compensation. It is designed for high-density, high-efficiency VRM applications in server and graphics power delivery.
For engineers reviewing the CSD95496QVM datasheet, CSD95496QVM pinout, CSD95496QVM application, or CSD95496QVM equivalent, key selection criteria include its 40-A continuous current rating, 93%+ system efficiency at 20 A, tri-state PWM compatibility, diode emulation mode, and VSON-CLIP 4 mm × 5 mm footprint with exposed thermal pad.
Technical Context
The CSD95496QVM implements a fully integrated synchronous buck power stage with internal high-side and low-side NexFET™ MOSFETs driven by an optimized gate driver. Its current sensing architecture uses external REFIN and internal LSET resistor programming to calibrate inductor-based phase current measurement, while VOS provides output voltage feedback for sensing accuracy.
Thermal management is enabled via analog TAO output proportional to junction temperature and fault reporting through OR-wired multiphase TAO bus capability. The EN/FCCM pin supports dual-mode operation-diode emulation for light-load efficiency or forced continuous conduction mode-and integrates shoot-through protection with optimized dead time control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 40 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VRMs |
| Switching Frequency | Up to 1.25 MHz - allows smaller magnetics and faster transient response in POL converters |
| Efficiency | Over 93% at 20 A - reduces thermal load and improves system-level power density |
| PWM Input Compatibility | 3.3-V and 5-V logic levels - interoperable with TI's TPS536xx and other industry-standard VR controllers |
| Package | VSON-CLIP (DMH), 4.0 mm × 5.0 mm, 18-pin - ultra-low-inductance layout with exposed thermal pad for PCB heat spreading |
| Operating Junction Temp | –40°C to +125°C - qualified for enterprise server and graphics card thermal environments |
| Current Sense Accuracy | Temperature-compensated bi-directional sensing - enables precise phase current balancing in multiphase systems |
Pinout & Package
VSON-CLIP (DMH) package: 4.0 mm × 5.0 mm body, 18-pin layout with exposed thermal pad on underside; requires soldered thermal pad connection to PCB ground plane for thermal and mechanical integrity per TI SLUA271 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BOOT | Bootstrap capacitor connection | Supplies charge to high-side FET gate; requires ≥0.1 µF X5R ceramic cap to BOOT_R |
| BOOT_R | Bootstrap return path | Internally connected to VSW; completes bootstrap loop for HS gate drive |
| VOS | Output voltage sense input | Feeds internal current sensing amplifier; enables accurate VOUT-referenced current measurement |
| VSW | Switch node | Connects HS source and LS drain; ties directly to output inductor; critical for EMI and layout optimization |
| TAO/FAULT | Temperature amplifier output / fault indicator | Analog voltage ∝ die temperature; OR-wireable across phases; pulled to 3.3 V during thermal shutdown or fault |
| REFIN | Reference voltage input | Sets current sense gain baseline; connects to external precision reference or controller VREF |
| IOUT | Current sense amplifier output | V(IOUT) – V(REFIN) ∝ phase current; used for controller current-loop feedback |
| PGND | Power ground | High-current return path for LS FET and internal circuitry; must be low-inductance connection to thermal pad |
| LSET | Inductor value programming | Resistor to PGND sets inductance coefficient for internal current sensing calibration |
| VDD | Driver supply | 4.5–5.5 V supply for gate drivers and internal logic; decoupling required near pin |
| EN/FCCM | Enable / Forced CCM control | Tri-state input: Hi-Z enables diode emulation; high = FCCM; low = disable |
| PWM | Tri-state PWM input | Drives HS/LS gates directly; Hi-Z disables both FETs after holdoff timeout |
| VIN | Input voltage supply | 4.5–16 V input rail; multiple pins (10–13) reduce IR drop and improve high-current routing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Switch | Eliminates external bootstrap diode; reduces BOM count and layout area while improving reliability |
| Diode Emulation Function | Enables discontinuous conduction mode (DCM) operation for improved light-load efficiency without external control |
| Temperature-Compensated Bi-Directional Current Sense | Delivers accurate phase current measurement across –40°C to +125°C, enabling stable current sharing in multiphase VRMs |
| Analog Temperature Output (TAO) | Provides real-time die temperature monitoring with OR-wire capability-simplifies thermal management in multi-phase systems |
| System-Optimized PCB Footprint | Minimizes loop inductance and thermal resistance via symmetric VIN/VSW/PGND pin placement and exposed thermal pad design |
Applications
| Server VR12.x / VR13.x VRM | Graphics Card POL Converter |
|---|---|
Use Scenario: High-current, fast-transient voltage regulation for dual-socket Xeon or EPYC processors in 1U/2U rack servers. IC Role / Device Role / Timing Role: Single-phase synchronous buck power stage delivering up to 40 A per phase with diode emulation for dynamic load efficiency. Use Value: Enables compact, high-efficiency 3+1 or 4+1 phase VRMs meeting Intel VR12.5/VR13.0 specifications with <200 ns load-step response. |
Use Scenario: Point-of-load regulation for GPU core voltage (VDDC) on PCIe-based graphics cards requiring >30 A per phase. IC Role / Device Role / Timing Role: Smart power stage providing current-sense feedback and thermal telemetry to VR controller (e.g., TPS53659). Use Value: Reduces component count vs. discrete driver+FET solutions while maintaining >93% efficiency at 20 A and supporting 1.25 MHz switching for smaller inductors. |
| Multiphase Memory Regulator | High-Frequency DC-DC Module |
Use Scenario: DDR5 memory subsystem regulation where tight current matching and thermal uniformity across phases are critical. IC Role / Device Role / Timing Role: Synchronous buck stage with OR-wired TAO and matched current sensing for inter-phase current balancing. Use Value: Achieves ±2% current matching across phases using integrated bi-directional sensing and temperature compensation-reducing need for external calibration. |
Use Scenario: Compact, high-frequency DC-DC module for FPGA or ASIC auxiliary rails requiring rapid design iteration. IC Role / Device Role / Timing Role: Fully integrated power stage enabling simplified layout with minimal external components (no bootstrap diode, no current sense resistors). Use Value: Cuts design cycle time by eliminating gate driver layout complexity and enabling direct use of TI's reference designs (e.g., TIDA-01432). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490Q5M | Same VSON-CLIP package, 35-A continuous rating, lower max fSW (1 MHz), no TAO output | Lacks analog temperature telemetry and OR-wire capability; suited for cost-sensitive single-phase designs without multiphase coordination | Select when thermal monitoring across phases is unnecessary and peak current demand ≤35 A |
| ISL99227B | 40-A rating, 5×6 mm QFN, integrated current sense but no diode emulation mode, different pinout | Requires external diode emulation control; lacks tri-state PWM and EN/FCCM dual-function pin | Choose when legacy controller interface compatibility outweighs integrated feature set and board space constraints |
Compared with CSD95496QVM, CSD95490Q5M offers lower cost and simpler thermal design but sacrifices multiphase telemetry and light-load efficiency modes; ISL99227B provides comparable current capability but demands more external components and controller coordination for DCM operation.
Availability
CSD95496QVM is available at Aetrix Electronics and suitable for server VRMs, graphics card POL converters, DDR5 memory regulators, and high-frequency DC-DC modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95496QVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with decades of leadership in power conversion ICs and silicon innovation.
The CSD95496QVM belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-efficiency, high-density multiphase VRMs in datacenter, AI accelerator, and high-performance computing applications.
FAQ
What is the maximum continuous output current supported by the CSD95496QVM?
The CSD95496QVM supports 40-A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, and fSW = 500 kHz. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a sufficient copper area. Peak current capability reaches 60 A for short durations (tp = 50 µs), as specified in the absolute maximum ratings table of the CSD95496QVM datasheet.
Does the CSD95496QVM require an external bootstrap diode?
No, the CSD95496QVM does not require an external bootstrap diode because it integrates a bootstrap switch internally. The BOOT pin connects to a minimum 0.1-µF, 16-V X5R ceramic capacitor referenced to BOOT_R, which serves as the floating supply for the high-side gate driver. This integration reduces component count, improves reliability, and simplifies layout compared to discrete driver+FET solutions.
How does the CSD95496QVM implement current sensing without external shunt resistors?
The CSD95496QVM uses an integrated, temperature-compensated bi-directional current sensing architecture that relies on MOSFET RDS(on) and internal amplifiers-not external shunts. It measures voltage drop across the low-side FET using VOS and REFIN inputs, with gain calibrated via the LSET-to-PGND resistor. This method eliminates power loss and board space associated with shunt resistors while maintaining accuracy across temperature and load conditions.
Can the CSD95496QVM be used in multiphase configurations with automatic current balancing?
Yes, the CSD95496QVM supports multiphase operation with automatic current balancing via its TAO pin and bi-directional current sense outputs. The TAO pins from multiple CSD95496QVM units can be wire-OR'd together so only the highest temperature is reported, enabling coordinated thermal derating. Combined with matched IOUT/REFIN signals and identical LSET programming, this allows precise inter-phase current sharing in VR12.x/VR13.x systems.
What is the function of the EN/FCCM pin on the CSD95496QVM?
The EN/FCCM pin on the CSD95496QVM serves two distinct functions: when held in the tri-state window (>t3HT), it enables diode emulation mode for improved light-load efficiency; when driven high, it forces continuous conduction mode (FCCM); when driven low, it disables both FETs. An internal pull-down resistor ensures safe default-off behavior if the pin is left floating, making the CSD95496QVM robust in unconfigured or faulted controller states.
CSD95496QVM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 18-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 40A
- Current - Peak Output:
- 60A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-VSON (5x4)
CSD95496QVM FAQ
1.How can I place an order for CSD95496QVM through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95496QVM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95496QVM reliable?
The price and inventory of CSD95496QVM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95496QVM is usually 5 days.
3.What payment methods are accepted for CSD95496QVM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95496QVM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95496QVM?
CSD95496QVM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95496QVM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95496QVM?
For technical support, including CSD95496QVM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95496QVM requirements.
6.How does Aetrix verify that CSD95496QVM is sourced from the original manufacturer or authorized distributors?
All CSD95496QVM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95496QVM meets industry standards.
7.What is the process for return or replacement of CSD95496QVM?
All CSD95496QVM units undergo pre-shipment inspection (PSI). If there is an issue with CSD95496QVM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95496QVM part is unused and in its original packaging.
Return procedure for CSD95496QVM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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