My Inquiry
My Account
Texas Instruments CSD95496QVMT
- Part No.:
- CSD95496QVMT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 18-PowerTFDFN
- Datasheet:
-
CSD95496QVMT.pdf
- Description:
- IC HALF BRIDGE DRIVER 40A 18VSON
- Quantity:
- Payment:
- Shipping:
Inventory:730
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CSD95496QVMT from Texas Instruments is a synchronous buck NexFET™ Smart Power Stage integrating driver IC and dual power MOSFETs in a single VSON-CLIP (DMH) package. It delivers 40-A continuous output current at up to 1.25 MHz switching frequency, supports 3.3-V/5-V PWM inputs, and features integrated current sensing (REFIN/IOUT), temperature monitoring (TAO), and diode emulation mode via EN/FCCM pin. It is designed for high-density VR12.x/VR13.x voltage regulator modules in server and graphics applications.
For engineers reviewing the CSD95496QVMT datasheet, CSD95496QVMT pinout, CSD95496QVMT application, or CSD95496QVMT equivalent, key selection considerations include its 40-A continuous current rating, 4.0 mm × 5.0 mm VSON-CLIP footprint, tri-state PWM interface, integrated bootstrap switch, and temperature-compensated bidirectional current sense capability - all critical for multiphase POL converter design.
Technical Context
The CSD95496QVMT implements a fully integrated synchronous buck power stage with monolithic gate driver and optimized high-side/low-side NexFET™ MOSFETs. Its internal current sensing uses REFIN as reference input and IOUT as proportional analog output, calibrated against inductor value set by LSET-to-PGND resistor. The TAO pin provides an analog voltage linearly tracking die temperature, enabling system-level thermal monitoring without external sensors.
Control logic includes tri-state PWM input with automatic shoot-through protection, dead-time optimization, and dual-mode EN/FCCM pin supporting either forced CCM or diode emulation. The BOOT/BOOT_R pins integrate a bootstrap diode and support ≥0.1 µF ceramic capacitor for high-frequency operation up to 1.25 MHz under VIN = 4.5–16 V and VDD = 4.5–5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 40 A at VIN = 12 V, VOUT = 1.2 V, fSW = 500 kHz - enables single-phase support for high-current CPU/GPU VRMs. |
| Switching Frequency | Up to 1250 kHz - allows smaller output inductors and faster transient response in space-constrained designs. |
| Input Voltage Range | VIN = 4.5 V to 16 V - compatible with 5 V, 12 V, and hybrid input rails in modern server/desktop power architectures. |
| PWM Interface | 3.3-V/5-V logic compatible, tri-state capable - eliminates level-shifting and supports seamless integration with TI's TPS53659 and similar controllers. |
| Current Sensing | Temperature-compensated bidirectional analog sensing via REFIN/IOUT - enables accurate phase-current monitoring without external amplifiers or shunts. |
| Thermal Monitoring | Analog TAO output proportional to junction temperature - supports real-time thermal derating and multi-phase temperature arbitration via wired-OR connection. |
| Package | VSON-CLIP (DMH), 4.0 mm × 5.0 mm, 18-pin - ultra-low-inductance layout with exposed thermal pad for <1.5°C/W junction-to-board thermal resistance. |
Pinout & Package
VSON-CLIP (DMH) package with 4.0 mm × 5.0 mm footprint, 18-pin layout, and exposed thermal pad requiring solder attachment to PCB for thermal and mechanical integrity. Pin 1 located at top-left corner (Q1 quadrant per tape orientation).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| REFIN | Reference input for current-sense amplifier | Accepts external precision voltage (≤3.6 V) to calibrate current measurement offset and gain. |
| IOUT | Current-sense amplifier output | Provides analog voltage proportional to phase current (IOUT – REFIN ∝ IL); used for closed-loop current limiting and telemetry. |
| LSET | Inductor-value configuration | Resistor to PGND sets internal gain for current sensing based on actual inductor DCR or value. |
| VDD | Driver supply rail | 4.5–5.5 V supply powering gate drivers and internal logic; decoupling required near pin. |
| VOS | Output voltage sense for current sensing | Connects to output rail to enable accurate DCR-based current sensing with voltage drop compensation. |
| VSW | Switch node (HS source / LS drain) | High dv/dt node connecting to output inductor; requires minimized loop area and tight layout for EMI control. |
| VIN | Main input power supply | 4.5–16 V input; multiple pins (10–13) reduce IR drop and improve high-current delivery. |
| BOOT / BOOT_R | Bootstrap circuit terminals | Integrated bootstrap diode; 0.1 µF ceramic cap between BOOT and BOOT_R supplies HS gate drive voltage. |
| PWM | Tri-state gate control input | Logic high → HS on / LS off; logic low → HS off / LS on; Hi-Z > t3HT → both FETs off (safe shutdown). |
| EN/FCCM | Enable / mode-select control | High → FCCM; low → disable; tri-state window → diode emulation mode for light-load efficiency improvement. |
| TAO/FAULT | Temperature amplifier / fault indicator | Analog temp output; pulled to 3.3 V during thermal shutdown, LSOC, or HSS fault - enables system-level fault detection. |
| PGND | Power ground return | Low-impedance return path for high-current switching; separate from AGND to avoid noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete gate driver layout complexity and reduces component count while optimizing switching timing and dead time. |
| Diode emulation function | Enables discontinuous conduction mode (DCM) operation at light loads to improve efficiency without external control circuitry. |
| Temperature-compensated current sense | Delivers ±3% current measurement accuracy across –40°C to 125°C junction range, reducing need for calibration in production. |
| System-optimized PCB footprint | Minimizes high-current loop area and thermal resistance via symmetric VIN/PGND pin distribution and large thermal pad. |
| RoHS-compliant, halogen-free packaging | Meets IPC/JEDEC industry standards for lead-free assembly and environmental compliance in enterprise-grade hardware. |
Applications
| Server VR12.x/VR13.x VRMs | GPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient voltage regulation for dual-socket Xeon Scalable processors in 1U/2U rack servers. IC Role / Device Role / Timing Role: Single-phase smart power stage in multiphase buck converter delivering 1.0–1.8 V @ up to 40 A per phase. Use Value: Enables compact, high-efficiency VRM designs meeting Intel VR12.5/VR13 specifications with <1.25 µs load-step response. |
Use Scenario: Point-of-load regulation for NVIDIA A100 or AMD MI300 GPU memory and core rails in AI accelerators. IC Role / Device Role / Timing Role: High-frequency (≥1 MHz) synchronous buck stage providing stable 0.75–1.2 V output with precise current telemetry. Use Value: Supports dynamic voltage/frequency scaling (DVFS) with real-time current feedback and thermal headroom monitoring via TAO. |
| Desktop High-End Gaming Motherboards | AI Accelerator Reference Designs |
Use Scenario: Overclocking-capable CPU VRM on ATX motherboards supporting Intel Core i9 or AMD Ryzen 9 processors. IC Role / Device Role / Timing Role: High-current phase in 8+2 or 12+2 phase topology, operating at 500–1000 kHz with adaptive diode emulation. Use Value: Delivers >93% peak efficiency at 20 A and maintains <5°C phase-to-phase thermal delta across full load range. |
Use Scenario: Modular power stage in FPGA-based AI inference platforms requiring scalable, validated POL building blocks. IC Role / Device Role / Timing Role: Drop-in-ready power stage with standardized pinout and thermal interface for rapid prototyping of custom VRMs. Use Value: Reduces design cycle time by eliminating gate driver layout validation and enabling direct integration with TI's Fusion Digital Power GUI. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490Q5M | Lower 35-A continuous rating; identical 4×5 mm VSON-CLIP package and pinout; lacks TAO output and diode emulation. | Suitable for cost-sensitive mid-range VRMs where thermal telemetry and light-load efficiency are secondary. | Select when system-level thermal management is handled externally and peak current demand ≤35 A. |
| ISL99227B | 40-A rating, 3×3.5 mm QFN package, integrated current sense but no TAO; supports 1.5 MHz max fSW and 3.3-V-only PWM. | Better suited for ultra-dense mobile/embedded VRMs where board area is more constrained than thermal budget. | Prefer when footprint size is prioritized over thermal monitoring capability and controller compatibility with 5-V PWM is required. |
Compared with CSD95496QVMT, CSD95490Q5M offers reduced feature set and current capability in same footprint, while ISL99227B trades thermal telemetry and dual-voltage PWM support for smaller size - making CSD95496QVMT optimal for thermally demanding, high-performance server and AI accelerator applications requiring full telemetry and flexible control.
Availability
CSD95496QVMT is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery, desktop overclocking platforms, and AI accelerator reference designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD95496QVMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and digital power control solutions.
The CSD95496QVMT belongs to TI's NexFET™ Smart Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in datacenter, graphics, and high-end computing applications where density, efficiency, and integrated telemetry are critical.
FAQ
What is the maximum continuous output current rating for the CSD95496QVMT?
The CSD95496QVMT is rated for 40-A continuous output current under standard test conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and TA = 25°C. This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a sufficient copper area. Derating is required at higher ambient temperatures or elevated switching frequencies.
Does the CSD95496QVMT support both 3.3-V and 5-V PWM input signals?
Yes, the CSD95496QVMT PWM input is explicitly specified as compatible with both 3.3-V and 5-V logic levels, enabling direct interfacing with a wide range of controllers including TI's TPS53659, ISL95815, and MP2960 without level-shifting circuitry. The input threshold is referenced to PGND and supports tri-state operation for safe shutdown.
How does the EN/FCCM pin function on the CSD95496QVMT?
The EN/FCCM pin on the CSD95496QVMT provides dual functionality: driving it high enables Forced Continuous Conduction Mode (FCCM), pulling it low disables the device, and holding it in the tri-state window (>t3HT) activates Diode Emulation Mode for improved light-load efficiency. This eliminates the need for external mode-selection logic in adaptive VRM designs.
What is the purpose of the TAO pin on the CSD95496QVMT?
TAO is the Temperature Amplifier Output pin on the CSD95496QVMT, delivering an analog voltage linearly proportional to the silicon junction temperature. In multiphase systems, multiple TAO pins can be wired-OR'd together so only the highest temperature is reported - simplifying system thermal management without additional sensors or ADC channels.
Is the CSD95496QVMT pin-compatible with other devices in the CSD9549x family?
Yes, the CSD95496QVMT shares identical pinout, package dimensions, and thermal pad layout with other members of the CSD9549x family including CSD95490Q5M and CSD95492Q5M. This enables drop-in replacement within the same family for performance tuning or cost optimization, provided the application's current, thermal, and feature requirements align with the selected variant.
CSD95496QVMT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 18-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge (3)
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 40A
- Current - Peak Output:
- 60A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-VSON (5x4)
CSD95496QVMT FAQ
1.How can I place an order for CSD95496QVMT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD95496QVMT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD95496QVMT reliable?
The price and inventory of CSD95496QVMT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD95496QVMT is usually 5 days.
3.What payment methods are accepted for CSD95496QVMT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD95496QVMT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD95496QVMT?
CSD95496QVMT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD95496QVMT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD95496QVMT?
For technical support, including CSD95496QVMT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD95496QVMT requirements.
6.How does Aetrix verify that CSD95496QVMT is sourced from the original manufacturer or authorized distributors?
All CSD95496QVMT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD95496QVMT meets industry standards.
7.What is the process for return or replacement of CSD95496QVMT?
All CSD95496QVMT units undergo pre-shipment inspection (PSI). If there is an issue with CSD95496QVMT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD95496QVMT part is unused and in its original packaging.
Return procedure for CSD95496QVMT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSD95496QVMT Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
