Texas Instruments CSD96371Q5M

Overview

CSD96371Q5M from Texas Instruments is a synchronous buck NexFET™ power stage integrating gate driver IC and dual Power MOSFETs in a single 22-pin SON 5-mm × 6-mm package. It delivers 50 A continuous output current at 12 V_IN/1.2 V_OUT, achieves 92% system efficiency at 30 A, and supports switching frequencies up to 2 MHz for high-density POL DC-DC converters in server VR12 and graphics card applications.

For engineers reviewing the CSD96371Q5M datasheet, CSD96371Q5M pinout, CSD96371Q5M application, or CSD96371Q5M equivalent, key selection criteria include its 3.4 W power loss at 30 A, integrated bootstrap diode, 3-state PWM input compatibility with 3.3 V/5 V controllers, pre-bias start-up protection, and shoot-through prevention logic - all critical for stable high-frequency multiphase buck designs.

Technical Context

The CSD96371Q5M implements a fully integrated synchronous buck power stage architecture with adaptive shoot-through protection, minimizing dead-time while preventing cross-conduction between control and sync FETs. Its gate driver supplies >4 A peak current and supports 40 ns minimum PWM on-time.

It operates with 4.5–5.5 V gate drive (V_DD), accepts 3.3–13.2 V input (V_IN), and features TTL-compatible ENABLE and 3-state PWM inputs with 100 ns hold-off timing. The integrated bootstrap diode and BOOT/BOOT_R terminals enable self-contained high-side gate drive without external components.

Key Specifications

Pinout & Package

Package: SON 5-mm × 6-mm, 22-pin LSON-CLIP (DQP) with exposed thermal pad. Optimized for low-inductance, high-current PCB routing and thermal dissipation via board-level copper planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Compared with CSD96371Q5M, CSD96370Q5M trades 10 A current capacity and integrated bootstrap for lower cost, while ISL99227B offers higher peak current but demands external support components - making CSD96371Q5M optimal for balanced high-efficiency, high-density server and GPU VRMs where integration and layout simplicity are prioritized.

Availability

CSD96371Q5M is available at Aetrix Electronics and suitable for server VR12 V-core regulation, graphics card GPU core power, and POL DC-DC for memory subsystems requiring stable component supply across long production lifecycles.

Supply support for CSD96371Q5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in high-reliability power solutions.

The CSD96371Q5M belongs to TI's NexFET™ Power Stage product line, engineered specifically for high-frequency, high-current synchronous buck converters in computing and graphics infrastructure where power density, efficiency, and thermal performance are critical.

FAQ

What is the maximum continuous output current rating for the CSD96371Q5M?

The CSD96371Q5M is rated for 50 A continuous output current under recommended operating conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.2 V, fSW = 500 kHz, and LOUT = 0.3 µH. This rating assumes proper PCB thermal design with adequate copper area and airflow per TI's SOA curves. At 125°C junction temperature, peak output current reaches 75 A for 50 µs pulses. Derating applies at higher ambient temperatures or reduced airflow.

Does the CSD96371Q5M require an external bootstrap diode?

No, the CSD96371Q5M integrates a bootstrap diode internally. A 0.1 µF ceramic capacitor must be placed between BOOT and BOOT_R pins to form the bootstrap circuit. External diodes are unnecessary and would conflict with the internal implementation. TI specifies X5R dielectric, 16 V rating, and 0603 footprint for this capacitor to ensure reliable high-side gate drive under 2 MHz switching.

What is the purpose of the 3-state function on the PWM pin of the CSD96371Q5M?

The 3-state function on the PWM pin of the CSD96371Q5M allows the device to enter a safe high-impedance state when the PWM signal is floating or disconnected. After 100 ns, both control and sync FET gates are actively pulled low, preventing unintended switching and ensuring the output remains in a known, non-conductive state. This feature enhances system safety during controller reset, communication loss, or soft-start sequencing.

How does the CSD96371Q5M handle pre-biased output voltage conditions during startup?

The CSD96371Q5M implements hardware-based pre-bias start-up protection: after power-on reset and ENABLE activation, both internal FETs remain held low until the first PWM pulse exceeds the logic-high threshold and satisfies the 40 ns minimum on-time requirement. This prevents discharging of an existing output voltage and avoids large reverse inductor currents that could damage downstream components or cause bus faults.

What thermal resistance values are specified for the CSD96371Q5M, and how do they impact PCB layout?

The CSD96371Q5M specifies RθJB = 2 °C/W (junction-to-board) and RθJC = 20 °C/W (junction-to-case). The low RθJB value indicates primary heat extraction occurs through the exposed thermal pad into the PCB ground plane. Layout must use ≥9 thermal vias (0.3 mm drill, tented) under the pad, connected to inner-layer copper pours, to realize this spec. RθJC is secondary; heatsinking to case is not recommended due to the clip-package construction.