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Texas Instruments CSD96497Q5MC
- Part No.:
- CSD96497Q5MC
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD96497Q5MC.pdf
- Description:
- IC BRIDGE DRIVER 30A 12VSON
- Quantity:
- Payment:
- Shipping:
Inventory:495
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Product details
Overview
CSD96497Q5MC from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and dual MOSFETs in a single 5-mm × 6-mm VSON-CLIP package. It delivers 65-A continuous output current, supports up to 1.25-MHz switching frequency, and achieves >93.5% efficiency at 30 A with 12-V input and 1.8-V output - optimized for high-density VR12.x/VR13.x CPU core power delivery.
For engineers reviewing the CSD96497Q5MC datasheet, CSD96497Q5MC pinout, CSD96497Q5MC application, or CSD96497Q5MC equivalent, key selection criteria include its bi-directional current sense accuracy, diode emulation mode with FCCM, thermal monitoring capability, and DualCool™ package for enhanced thermal performance in multiphase POL converters.
Technical Context
The CSD96497Q5MC implements a fully integrated synchronous buck power stage with internal high-side and low-side NexFET™ MOSFETs driven by an optimized gate driver. Its PWM input accepts 3.3-V or 5-V logic levels and supports tri-state operation for seamless phase shedding in multiphase systems.
It features temperature-compensated bi-directional current sensing via the IOUT pin and analog temperature output (VOS), enabling real-time thermal and load monitoring without external components. Fault protection includes over-temperature (OTP), high-side overcurrent (HS OCP), and short-circuit detection with dedicated TAO/FLT pin reporting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 65 A - enables single-phase support of high-current CPU/GPU cores without parallel stages |
| Peak Efficiency | 93.5% at 30 A - reduces system power loss and thermal load in 12-V input, 1.8-V output configurations |
| Max Switching Frequency | 1.25 MHz - allows compact magnetics and faster transient response in space-constrained VRMs |
| Current Sense Accuracy | Temperature-compensated bi-directional sensing - enables precise DCR-less current monitoring across –55°C to 150°C |
| Package Type | VSON-CLIP (DMC) with exposed thermal pad - DualCool™ construction transfers heat directly from die to PCB for <1.5°C/W θJA |
| PWM Input Compatibility | 3.3-V and 5-V logic - interoperable with standard PMICs and digital controllers without level-shifting circuitry |
| Fault Protection | OTP, HS OCP, short-circuit - autonomous shutdown with flag assertion on TAO/FLT pin for system-level fault handling |
Pinout & Package
VSON-CLIP (DMC) 12-pin package with 5.0-mm × 6.0-mm footprint, exposed thermal pad (Pin 13), and copper-clip construction for ultra-low inductance and enhanced thermal conduction. Designed for soldering to PCB thermal pads per JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWM | Gate drive enable input | Accepts 3.3-V/5-V logic; tri-state capable for phase shedding and zero-voltage switching control |
| TAO/FLT | Fault status output | Open-drain active-low signal indicating OTP, HS OCP, or short-circuit event |
| IOUT | Bi-directional current sense | Provides analog current signal with temperature compensation for accurate DCR-less current monitoring |
| REFIN | Reference voltage input | Accepts external reference (e.g., from controller) to set output voltage regulation point |
| VIN | High-side power input | 12-V nominal input rail connection; routed to high-side MOSFET source and bootstrap capacitor supply |
| VOS | Analog temperature output | Linear voltage proportional to junction temperature (10 mV/°C) for thermal management |
| VSW | Switch node | Connects to external inductor; carries high dv/dt switching waveform and must be minimized in loop area |
| PGND | Power ground | Three dedicated pins (6, 7, 12) for low-inductance return path from both MOSFETs and driver |
| VDD | Driver supply | 5-V bias for internal gate driver; decoupled via CVDD capacitor |
| EM/FCCM | Diode emulation mode control | Enables discontinuous conduction mode with forced continuous conduction for light-load efficiency optimization |
| LSET | Inductor sense gain setting | Configures current-sense amplifier gain based on external inductor DCR value |
| BOOT | Bootstrap supply | Connects to bootstrap capacitor (CBOOT) to generate high-side gate drive voltage above VIN |
Key Features
| Feature | Design Value |
|---|---|
| Integrated driver + dual NexFET™ MOSFETs | Eliminates discrete gate driver layout complexity and reduces parasitic inductance in high-frequency (>1 MHz) designs |
| DualCool™ package with exposed thermal pad | Reduces thermal resistance by >40% vs. standard QFN; enables >65-A operation with minimal heatsinking |
| Temperature-compensated bi-directional current sense | Enables accurate phase-current balancing in multiphase VRMs without external amplifiers or calibration |
| Diode emulation with FCCM | Improves light-load efficiency by disabling low-side FET during off-time while maintaining forced CCM for stability |
| Optimized dead time control | Prevents shoot-through during switching transitions without requiring external timing components or tuning |
Applications
| Server CPU Core VRM | GPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient power delivery for Intel VR13.x-compliant server processors under dynamic workload. IC Role / Device Role / Timing Role: Primary synchronous buck power stage in 3+1 or 4+1 phase VRM, delivering up to 65 A per phase at 1.8 V. Use Value: Enables compact, high-efficiency multi-phase design with integrated current/thermal sensing - reducing BOM count and improving phase current matching accuracy. | Use Scenario: Point-of-load regulation for discrete graphics cards requiring rapid load-step response and thermal margin headroom. IC Role / Device Role / Timing Role: High-frequency (1.25 MHz) power stage supporting 12-V input to 0.8–1.2-V GPU core output with tight voltage tolerance. Use Value: DualCool™ thermal performance sustains >60-A continuous current during sustained GPU boost clocks without thermal throttling. |
| Network ASIC Supply | AI Accelerator Module |
Use Scenario: High-density DC-DC conversion for 100G/400G switch fabric ASICs with strict board area constraints. IC Role / Device Role / Timing Role: Single-phase or paralleled power stage supplying 1.0–1.2 V at up to 50 A per rail with sub-100-ns transient response. Use Value: 5-mm × 6-mm footprint and integrated sensing reduce PCB area by >30% versus discrete solutions while maintaining ±1.5% output regulation. | Use Scenario: Powering heterogeneous compute tiles in AI training accelerators with variable voltage/frequency domains. IC Role / Device Role / Timing Role: Programmable voltage rail generator supporting dynamic voltage scaling (DVS) via REF IN and EM/FCCM control. Use Value: Tri-state PWM and bi-directional current sense enable precise per-tile current monitoring and adaptive phase shedding for energy-proportional computing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL99390IRZ-T | 60-A rating, 1.0-MHz max fSW, no analog temperature output, uses different current sense architecture (RDS(on)-based) | Lacks VOS pin and bi-directional sensing; requires external temperature sensor for thermal monitoring | Preferred where cost sensitivity outweighs need for integrated thermal/current telemetry |
| MP86957GQZ-P | 60-A rating, supports 700-kHz max fSW, integrated bootstrap diode (no external CBOOT required), no TAO/FLT pin | No dedicated fault flag output; relies on controller-level fault detection via IOUT only | Suitable for simpler, lower-cost VRMs where autonomous fault signaling is not required |
Compared with ISL99390IRZ-T and MP86957GQZ-P, the CSD96497Q5MC provides higher current capacity (65 A), wider frequency range (up to 1.25 MHz), and integrated analog temperature output - making it optimal for thermally constrained, high-performance VR12.x/VR13.x and AI accelerator applications demanding autonomous fault reporting and precision current telemetry.
Availability
CSD96497Q5MC is available at Aetrix Electronics and suitable for server CPU VRMs, GPU power delivery, network ASIC supplies, and AI accelerator modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CSD96497Q5MC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies with over 90 years of innovation in high-reliability power solutions.
The CSD96497Q5MC belongs to TI's NexFET™ smart power stage product line, engineered specifically for high-current, high-frequency synchronous buck conversion in CPU/GPU VRMs and AI infrastructure - emphasizing integration, thermal efficiency, and system-level telemetry.
FAQ
What is the maximum continuous output current rating for the CSD96497Q5MC?
The CSD96497Q5MC is rated for 65-A continuous output current under specified thermal conditions (TA = 25°C, 2-oz copper, 4-layer PCB with thermal vias). This rating assumes proper PCB layout with full thermal pad soldering and adequate airflow. Derating applies at elevated ambient temperatures or reduced copper weight, as detailed in the SLPS714A datasheet thermal curves.
Does the CSD96497Q5MC support diode emulation mode, and how is it enabled?
Yes, the CSD96497Q5MC supports diode emulation mode with forced continuous conduction mode (FCCM) via the EM/FCCM pin. When pulled high, it enables FCCM for stable light-load operation; when pulled low, it activates diode emulation for improved efficiency at very light loads. This function is fully integrated and requires no external timing components.
How does the CSD96497Q5MC implement current sensing without a sense resistor?
The CSD96497Q5MC uses temperature-compensated bi-directional current sensing through its internal MOSFET RDS(on), accessed via the IOUT pin. It eliminates the need for external DCR sensing networks or shunt resistors while maintaining ±3% accuracy across –55°C to 150°C - verified in TI's characterization data for CSD96497Q5MC.
What thermal management features are built into the CSD96497Q5MC package?
The CSD96497Q5MC employs DualCool™ packaging with a copper-clip VSON-CLIP (DMC) structure and an exposed thermal pad (Pin 13). This design conducts heat directly from the die to the PCB, achieving <1.5°C/W junction-to-board thermal resistance. The analog temperature output (VOS) pin provides real-time junction temperature feedback at 10 mV/°C.
Can the CSD96497Q5MC be used in multiphase VRM designs, and what interface signals support phase synchronization?
Yes, the CSD96497Q5MC is explicitly designed for multiphase synchronous buck converters. Its tri-state PWM input allows seamless phase shedding, while the IOUT and VOS pins enable per-phase current and temperature monitoring. Phase synchronization is managed externally by the controller; no dedicated clock or sync pin exists on the CSD96497Q5MC itself.
CSD96497Q5MC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- DC-DC Converters, Synchronous Buck Converter
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive, Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 30A
- Current - Peak Output:
- 65A
- Voltage - Supply:
- 3.3V ~ 5V
- Voltage - Load:
- 3.3V ~ 5V
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Over Current, Over Temperature, Shoot-Through, Short Circuit
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON-CLIP (5x6)
CSD96497Q5MC FAQ
1.How can I place an order for CSD96497Q5MC through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD96497Q5MC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD96497Q5MC reliable?
The price and inventory of CSD96497Q5MC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD96497Q5MC is usually 5 days.
3.What payment methods are accepted for CSD96497Q5MC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD96497Q5MC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD96497Q5MC?
CSD96497Q5MC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD96497Q5MC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD96497Q5MC?
For technical support, including CSD96497Q5MC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD96497Q5MC requirements.
6.How does Aetrix verify that CSD96497Q5MC is sourced from the original manufacturer or authorized distributors?
All CSD96497Q5MC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD96497Q5MC meets industry standards.
7.What is the process for return or replacement of CSD96497Q5MC?
All CSD96497Q5MC units undergo pre-shipment inspection (PSI). If there is an issue with CSD96497Q5MC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD96497Q5MC part is unused and in its original packaging.
Return procedure for CSD96497Q5MC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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