My Inquiry
My Account
Texas Instruments CSD96497Q5MCT
- Part No.:
- CSD96497Q5MCT
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 12-PowerTFDFN
- Datasheet:
-
CSD96497Q5MCT.pdf
- Description:
- IC BRIDGE DRIVER 30A 12VSON
- Quantity:
- Payment:
- Shipping:
Inventory:250
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CSD96497Q5MCT from Texas Instruments is a synchronous buck NexFET™ smart power stage integrating driver IC and dual MOSFETs in a single 5-mm × 6-mm VSON-CLIP (DMC) package. It delivers 65-A continuous output current, supports up to 1.25-MHz switching frequency, and achieves >93.5% efficiency at 30 A with 12-V input and 1.8-V output - ideal for high-density VR12.x/VR13.x CPU core power delivery.
For engineers reviewing the CSD96497Q5MCT datasheet, CSD96497Q5MCT pinout, CSD96497Q5MCT application, or CSD96497Q5MCT equivalent, key selection criteria include its integrated bi-directional current sense, diode emulation mode with FCCM, tri-state PWM compatibility, thermal monitoring via analog output, and fault protection covering OTP, HS OCP, and short-circuit events.
Technical Context
The CSD96497Q5MCT implements a fully integrated synchronous buck power stage architecture with an internal gate driver controlling high-side and low-side NexFET™ MOSFETs. It features temperature-compensated current sensing and analog temperature reporting, enabling precise system-level thermal management without external sensors.
Its control interface accepts 3.3-V or 5-V PWM signals with tri-state capability, and includes integrated bootstrap switch and optimized dead-time logic to prevent shoot-through. Diode emulation mode enables discontinuous conduction (DCM) operation with forced continuous conduction mode (FCCM) selectable via EM/FCCM pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 65 A - supports high-current POL applications without external current sharing |
| Peak Efficiency | 93.5% at 30 A - reduces thermal load and improves system power density |
| Switching Frequency | Up to 1.25 MHz - enables smaller output inductors and faster transient response |
| Input Voltage Range | VIN = 4.5 V to 16 V - compatible with 5-V, 12-V, and intermediate bus architectures |
| Thermal Protection | OTP with automatic recovery - prevents permanent damage during overload or poor airflow |
| Current Sensing | Temperature-compensated bi-directional analog output - enables accurate real-time phase current monitoring |
| Package Type | VSON-CLIP (DMC), 12-pin, 5.0 mm × 6.0 mm - ultra-low-inductance layout with exposed thermal pad |
Pinout & Package
VSON-CLIP (DMC) package with 12 terminals, 5.0 mm × 6.0 mm footprint, and exposed thermal pad soldered to PCB for optimal thermal performance. Designed for high-current, high-frequency buck converters requiring minimal parasitic inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWM | PWM input signal | Accepts 3.3-V or 5-V logic; tri-state capable for seamless phase shedding |
| TAO/FLT | Fault output / thermal alarm | Open-drain active-low signal indicating OTP, HS OCP, or short-circuit fault |
| IOUT | Current sense output | Analog voltage proportional to inductor current with bi-directional polarity and temperature compensation |
| REFIN | Reference input | Connects to controller's reference node to enable accurate current-sense offset cancellation |
| VIN | High-side power input | Primary DC input supply (4.5–16 V); feeds high-side FET and bootstrap circuitry |
| VOS | Voltage sense input | Monitors output voltage for closed-loop regulation and overvoltage protection |
| VSW | Switch node | Connection point between high-side and low-side FETs; critical for minimizing switching loop inductance |
| PGND | Power ground | Low-side FET source return; multiple pins for low-impedance, high-current path |
| VDD | Driver supply | Internal LDO input (5 V typical); powers gate driver and logic circuits |
| EM/FCCM | Mode select | Configures diode emulation (EM) or forced continuous conduction mode (FCCM) |
| LSET | Inductor sense | Optional connection for inductor DCR sensing calibration |
| BOOT | Bootstrap capacitor connection | Provides gate drive voltage for high-side FET; integrated bootstrap switch eliminates external diode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated NexFET™ MOSFETs + driver | Eliminates discrete gate driver design effort and layout sensitivity while reducing BOM count |
| DualCool™ packaging | Exposes both top-side FETs and bottom thermal pad for dual-sided heat dissipation in space-constrained modules |
| System-optimized PCB footprint | Minimizes high-di/dt loop area to reduce EMI and improve stability in multi-phase layouts |
| Accurate bi-directional current sensing | Enables true DCM detection, phase shedding, and precise current balancing across multiphase rails |
| Tri-state PWM input | Supports seamless entry/exit from power-down states without external level-shifting or pull-up networks |
Applications
| Desktop & Server VR12.x/VR13.x Core Power | High-Current POL for Network Switches |
|---|---|
Use Scenario: Delivering tightly regulated 1.8-V core voltage to modern x86 CPUs under dynamic 60-A+ load transients. IC Role / Device Role / Timing Role: Synchronous buck power stage providing high-efficiency, high-bandwidth energy conversion with integrated current and thermal telemetry. Use Value: Enables fast transient response and accurate current reporting required by Intel VR12.5/VR13 controllers for dynamic phase control. | Use Scenario: Supplying 0.8–1.2 V at up to 50 A per rail to ASICs and FPGAs in 1U network switches with strict thermal limits. IC Role / Device Role / Timing Role: High-density, high-frequency power stage operating at 1 MHz to minimize output filter size and board area. Use Value: Reduces total solution size by 30% vs. discrete solutions while maintaining >92% efficiency at full load. |
| Multiphase Memory Subsystem Power | GPU/VPU Core Voltage Regulation |
Use Scenario: Providing 1.2-V DDR5 memory VDDQ/VPP rails with tight voltage tolerance and ripple control in AI accelerator modules. IC Role / Device Role / Timing Role: Multiphase-compatible smart power stage with synchronized PWM inputs and matched current-sense gain across phases. Use Value: Ensures phase current balance within ±3% across 4+ phases, improving memory subsystem reliability and timing margin. | Use Scenario: Delivering scalable 0.7–1.0 V core power to high-performance GPUs in gaming and datacenter accelerators. IC Role / Device Role / Timing Role: High-current buck stage supporting FCCM for smooth light-load efficiency and diode emulation for ultra-low idle power. Use Value: Achieves <15 mW quiescent power in diode emulation mode while sustaining >90% efficiency at 5-A partial load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD95490Q5MC | Lower 50-A continuous rating; same 5×6-mm VSON-CLIP package and pinout | Suitable for mid-range CPU/GPU cores with <50-A peak demand | Select when system thermal budget or cost constraints preclude 65-A capability |
| ISL99227BIRZ | 60-A rating; different pinout (13-pin QFN); no analog temperature output | Requires PCB redesign; lacks integrated thermal telemetry for closed-loop fan control | Choose only if legacy ISL99227-based designs require drop-in upgrade with minimal firmware change |
Compared with CSD96497Q5MCT, CSD95490Q5MC offers lower current capacity but identical footprint and feature set, while ISL99227BIRZ provides competitive efficiency but requires layout revision and sacrifices thermal monitoring capability.
Availability
CSD96497Q5MCT is available at Aetrix Electronics and suitable for desktop/server VR12.x/VR13.x core power, high-current POL for network switches, and GPU/VPU voltage regulation requiring stable component supply and long-term production continuity.
Supply support for CSD96497Q5MCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The CSD96497Q5MCT belongs to TI's NexFET™ smart power stage product line, engineered specifically for high-efficiency, high-density multiphase CPU/GPU core power delivery with integrated sensing and protection.
FAQ
What is the maximum continuous output current rating of the CSD96497Q5MCT?
The CSD96497Q5MCT is rated for 65-A continuous output current under specified thermal conditions (TA = 25°C, with adequate PCB copper and airflow). This rating assumes proper thermal management using the exposed thermal pad and recommended PCB land pattern. Derating applies above 25°C ambient or with reduced copper area. The CSD96497Q5MCT maintains this current capability while delivering >93.5% efficiency at 30 A with 12-V input and 1.8-V output.
Does the CSD96497Q5MCT support both forced continuous conduction mode (FCCM) and diode emulation mode?
Yes, the CSD96497Q5MCT supports both modes via the EM/FCCM pin. When pulled high, it operates in diode emulation mode for improved light-load efficiency; when pulled low, it enters forced continuous conduction mode for predictable ripple and easier controller loop compensation. This dual-mode capability is implemented in hardware and does not require external configuration registers. The CSD96497Q5MCT automatically adjusts dead time and gate drive timing based on selected mode.
What package type and pin count does the CSD96497Q5MCT use?
The CSD96497Q5MCT uses a VSON-CLIP (DMC) package with 12 terminals, measuring 5.0 mm × 6.0 mm with an exposed thermal pad. It is distinct from standard QFN packages due to its copper-clip construction that directly connects source terminals to the thermal pad, reducing RDS(on) and thermal resistance. The CSD96497Q5MCT shares pin compatibility with other devices in the CSD9649x family, including identical PWM, TAO/FLT, IOUT, and BOOT pin assignments.
How does the CSD96497Q5MCT implement current sensing, and what is its accuracy?
The CSD96497Q5MCT provides temperature-compensated bi-directional analog current sensing through the IOUT pin, with a nominal gain of 200 mV/A and ±3% gain error over temperature. It senses current in both directions (charge and discharge), enabling accurate DCM detection and phase current balancing. The CSD96497Q5MCT also includes REFIN for offset cancellation and supports DCR-based inductor sensing via LSET. No external amplifiers or calibration resistors are required.
What fault protections are integrated into the CSD96497Q5MCT?
The CSD96497Q5MCT integrates three primary fault protections: overtemperature protection (OTP), high-side overcurrent protection (HS OCP), and output short-circuit protection. Fault status is reported via the open-drain TAO/FLT pin, which asserts low during any fault condition. Recovery is automatic after fault removal and thermal cooldown. The CSD96497Q5MCT also includes shoot-through prevention via optimized dead-time control and bootstrap under-voltage lockout.
CSD96497Q5MCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 12-PowerTFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- DC-DC Converters, Synchronous Buck Converter
- Interface:
- PWM
- Load Type:
- Inductive, Capacitive, Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 30A
- Current - Peak Output:
- 65A
- Voltage - Supply:
- 3.3V ~ 5V
- Voltage - Load:
- 3.3V ~ 5V
- Operating Temperature:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Over Current, Over Temperature, Shoot-Through, Short Circuit
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-VSON-CLIP (5x6)
CSD96497Q5MCT FAQ
1.How can I place an order for CSD96497Q5MCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD96497Q5MCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD96497Q5MCT reliable?
The price and inventory of CSD96497Q5MCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD96497Q5MCT is usually 5 days.
3.What payment methods are accepted for CSD96497Q5MCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD96497Q5MCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD96497Q5MCT?
CSD96497Q5MCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD96497Q5MCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD96497Q5MCT?
For technical support, including CSD96497Q5MCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD96497Q5MCT requirements.
6.How does Aetrix verify that CSD96497Q5MCT is sourced from the original manufacturer or authorized distributors?
All CSD96497Q5MCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD96497Q5MCT meets industry standards.
7.What is the process for return or replacement of CSD96497Q5MCT?
All CSD96497Q5MCT units undergo pre-shipment inspection (PSI). If there is an issue with CSD96497Q5MCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD96497Q5MCT part is unused and in its original packaging.
Return procedure for CSD96497Q5MCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSD96497Q5MCT Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
