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Texas Instruments CSD97370Q5M

Part No.:
CSD97370Q5M
Manufacturer:
Texas Instruments
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
22-PowerLFDFN
Datasheet:
AetrixCSD97370Q5M.pdf
Description:
IC HALF BRIDGE DRIVER 40A 22LSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,229

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Product details

Overview

CSD97370Q5M from Texas Instruments is a synchronous buck NexFET™ power stage integrating gate driver IC and dual MOSFETs in a single 5-mm × 6-mm SON package. It delivers 90% system efficiency at 25A, supports input voltages up to 22V, operates up to 2MHz, and targets high-density POL DC-DC converters for server VR12.x V-Core applications.

For engineers reviewing the CSD97370Q5M datasheet, CSD97370Q5M pinout, CSD97370Q5M application, or CSD97370Q5M equivalent, key selection criteria include its 2.8W power loss at 25A, 40A continuous output current rating, integrated bootstrap diode, pre-bias start-up protection, and 10kV/µs dV/dt capability requiring careful PCB layout.

Technical Context

The CSD97370Q5M implements a high-frequency synchronous buck power stage with an integrated adaptive shoot-through protection scheme and fast gate drivers capable of >4A peak sink/source current. Its functional block includes control and sync FETs, bootstrap circuitry with integrated diode, UVLO monitoring, and 3-state PWM input logic compatible with both 3.3V and 5V controllers.

It uses Power Block Technology with ultra-low-inductance packaging and a large thermal pad for junction-to-board thermal resistance of 2°C/W. The device requires external VDD supply (4.5–5.5V), supports pre-biased output startup, and enforces minimum 40ns PWM on-time to prevent body diode conduction during soft-start.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range3.3V to 22V - supports wide-input POL systems including 12V server rails and 5V intermediate buses.
Continuous Output Current40A at TJ = 125°C - enables high-current CPU/GPU core supplies without parallel stages.
Power Loss2.8W at 25A, VIN=12V, VOUT=1.2V, fSW=500kHz - directly measurable system-level loss simplifying thermal design.
Switching Frequency200–2000 kHz - allows optimization between size (higher fSW) and efficiency (lower fSW).
Thermal Resistance (Junction-to-Board)2°C/W - enables direct heat transfer into PCB ground plane, critical for compact multi-phase layouts.
dV/dt Rating>10 kV/µs - mandates minimized VSW loop area and tight input capacitor placement to suppress EMI and ringing.
PWM Logic Compatibility3.3V and 5V - interoperable with common VR controller ICs without level-shifting.

Pinout & Package

Package: SON 5-mm × 6-mm, 22-pin, exposed thermal pad (PGND-connected). Optimized for low-inductance, high-current POL layouts with six VIN and six VSW pins for current sharing and reduced parasitic impedance.

Pin/TerminalCircuit RoleDesign Meaning
ENABLEEnable control inputTTL-compatible logic input with internal 100kΩ pull-down; asserts active-low shutdown and forces both FET gates low.
VDDGate driver supply4.5–5.5V supply for internal logic and gate drivers; requires local 1µF ceramic bypass to PGND.
VIN (Pins 12–17)Main input power railSix parallel pins reduce current density and inductance; must be connected to low-ESR/ESL input capacitors placed <1mm away.
VSW (Pins 6–11)Switching nodeSix parallel high-side switching outputs tied to inductor; layout must minimize loop area due to >10kV/µs dV/dt.
BOOT / BOOT_RBootstrap supply terminalsIntegrated bootstrap diode charges external 0.1µF ceramic cap; BOOT_R is return path for bootstrap capacitor.
PWM3-state PWM inputAccepts 3.3V/5V logic; floating state (>100ns) forces both FETs off; supports seamless integration with VR controllers.
PGNDPower ground referenceExposed thermal pad and Pin 23 form primary thermal path; must be connected to solid inner-layer ground plane via ≥12 thermal vias.

Key Features

FeatureDesign Value
Integrated Bootstrap DiodeEliminates external diode, reduces BOM count and layout area while maintaining reliable high-side FET turn-on.
Pre-Bias Start-Up ProtectionPrevents negative inductor current and output voltage collapse when powering up into pre-biased loads like memory subsystems.
Adaptive Shoot-Through ProtectionHardware-based dead-time control prevents cross-conduction between control and sync FETs, improving reliability at high frequencies.
System-Optimized PCB FootprintPin assignment and thermal pad geometry match standard 6-layer server PCB stack-ups, reducing layout iteration time.
3-State PWM InputEnables seamless phase shedding in multi-phase systems by allowing individual power stages to enter high-impedance state without affecting others.

Applications

Server VR12.x V-Core SupplyGPU Core Power Delivery

Use Scenario: High-current, dynamically scaled CPU core voltage regulation in dual-socket servers with VR12.x compliance requirements.

IC Role / Device Role / Timing Role: Primary synchronous buck power stage delivering up to 40A per phase with precise transient response and 2MHz capability.

Use Value: Enables 90% efficiency at 25A and supports tight voltage tolerances (±1%) required by Intel VR12.x specifications.

Use Scenario: Multi-phase POL conversion for discrete graphics processing units requiring rapid load-step response and thermal headroom.

IC Role / Device Role / Timing Role: High-frequency (up to 2MHz), low-loss power stage enabling compact inductor selection and fast transient recovery.

Use Value: 2.8W power loss at 25A reduces localized heating near GPU die, supporting higher sustained clock frequencies.

Memory Subsystem POLHigh-Density Network Switch ASIC Supply

Use Scenario: Point-of-load regulation for DDR4/DDR5 memory modules where pre-biased startup and low noise are mandatory.

IC Role / Device Role / Timing Role: Synchronous buck stage with pre-bias start-up protection and 3-state PWM for controlled enable/disable sequencing.

Use Value: Prevents reverse current flow into pre-charged memory rails, eliminating risk of data corruption during hot-plug events.

Use Scenario: Compact, high-efficiency core supply for multi-core network processors in 1U switches with strict airflow and board space constraints.

IC Role / Device Role / Timing Role: Thermally optimized power stage leveraging 2°C/W RθJB to dissipate heat directly into PCB, minimizing heatsink dependency.

Use Value: Reduces thermal interface complexity and enables fanless operation in edge networking equipment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CSD97394Q5MHigher 60A continuous rating, 1.8mΩ high-side RDS(on), same 5×6mm SON package.Better suited for >40A single-phase or lower-loss multi-phase designs; requires higher gate drive current.Select when output current exceeds 40A or when lower conduction loss at light load is prioritized.
TPS53679Integrated controller + power stage (not discrete); includes PMBus, telemetry, and digital loop compensation.Targeted at smart POL systems requiring real-time monitoring and dynamic margining; larger solution size.Select when digital control, fault logging, or adaptive loop tuning are required over pure analog simplicity.

Compared with CSD97370Q5M, CSD97394Q5M offers higher current capacity in identical footprint but increases gate drive demand, while TPS53679 trades analog simplicity for digital intelligence and system-level integration-neither is pin-compatible, and both require PCB redesign.

Availability

CSD97370Q5M is available at Aetrix Electronics and suitable for server VR12.x V-Core supplies, GPU core power delivery, and high-density network switch ASIC supplies requiring stable component supply and long-term industrial availability.

Supply support for CSD97370Q5M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies with broad industrial and enterprise infrastructure reach.

The CSD97370Q5M belongs to TI's NexFET™ Power Stage product line, engineered specifically for high-efficiency, high-frequency synchronous buck conversion in space-constrained computing and communications power systems.

FAQ

What is the maximum continuous output current rating for the CSD97370Q5M?

The CSD97370Q5M is rated for 40A continuous output current under recommended operating conditions (VIN = 12V, VDD = 5V, VOUT = 1.2V, fSW = 500kHz, LOUT = 0.3µH, TJ = 125°C). This rating assumes proper PCB thermal design with ≥12 thermal vias under the exposed pad and adequate airflow. Peak current capability reaches 60A for short durations (tp = 50µs).

Does the CSD97370Q5M require an external bootstrap diode?

No, the CSD97370Q5M integrates a bootstrap diode internally. Users must connect a 0.1µF, 16V X5R ceramic capacitor between BOOT and BOOT_R pins to complete the bootstrap circuit. Adding an external diode is unnecessary and may interfere with internal timing or cause latch-up.

How does the CSD97370Q5M handle pre-biased output voltage conditions?

The CSD97370Q5M incorporates hardware-based pre-bias start-up protection. After power-on reset, both internal FETs remain actively held low until the PWM signal crosses the logic-high threshold and meets the 40ns minimum on-time requirement. This prevents discharging of pre-charged output rails, avoiding negative inductor current and potential system instability.

What is the significance of the >10kV/µs dV/dt rating specified for the CSD97370Q5M?

The >10kV/µs dV/dt rating reflects the CSD97370Q5M's ability to withstand extremely fast voltage transients at the VSW node. This necessitates minimized VSW loop area, tight placement of input capacitors adjacent to VIN/PGND pins, and avoidance of long traces-failure to observe these layout rules risks EMI, gate driver malfunction, or MOSFET failure.

Can the CSD97370Q5M operate with a 3.3V PWM controller?

Yes, the CSD97370Q5M PWM input is explicitly designed for 3.3V and 5V logic compatibility. Its VIH threshold is 1.6–2.0V and VIL is 0.8–1.0V, ensuring robust recognition of 3.3V logic levels across temperature and process variation. No level-shifter is required when interfacing with standard 3.3V PWM controllers.

CSD97370Q5M Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
NexFET™
Package/Case:
22-PowerLFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
Synchronous Buck Converters
Interface:
PWM
Load Type:
Inductive
Technology:
Power MOSFET
Rds On (Typ):
-
Current - Output / Channel:
40A
Current - Peak Output:
60A
Voltage - Supply:
4.5V ~ 5.5V
Voltage - Load:
3.3V ~ 22V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit
Fault Protection:
Shoot-Through, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
22-LSON-CLIP (6x5)

CSD97370Q5M FAQ

1.How can I place an order for CSD97370Q5M through Aetrix?

Please submit a Request for Quotation (RFQ) for CSD97370Q5M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CSD97370Q5M reliable?

The price and inventory of CSD97370Q5M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD97370Q5M is usually 5 days.

3.What payment methods are accepted for CSD97370Q5M?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD97370Q5M transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CSD97370Q5M?

CSD97370Q5M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CSD97370Q5M order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CSD97370Q5M?

For technical support, including CSD97370Q5M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD97370Q5M requirements.

6.How does Aetrix verify that CSD97370Q5M is sourced from the original manufacturer or authorized distributors?

All CSD97370Q5M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD97370Q5M meets industry standards.

7.What is the process for return or replacement of CSD97370Q5M?

All CSD97370Q5M units undergo pre-shipment inspection (PSI). If there is an issue with CSD97370Q5M, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CSD97370Q5M part is unused and in its original packaging.

Return procedure for CSD97370Q5M:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CSD97370Q5M Tags

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