Texas Instruments CSD97374Q4M

Overview

CSD97374Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5-mm × 4.5-mm SON package. It delivers up to 25 A continuous output current, supports input voltages up to 24 V, operates at switching frequencies up to 2 MHz, achieves >92% system efficiency at 15 A, and features tri-state PWM and SKIP# inputs for ultra-low quiescent current modes - deployed in ultrabook DC/DC converters and multiphase Vcore solutions.

For engineers reviewing the CSD97374Q4M datasheet, CSD97374Q4M pinout, CSD97374Q4M application, or CSD97374Q4M equivalent, key selection considerations include its 25-A continuous rating, 10 kV/µs dV/dt capability, integrated bootstrap diode, shoot-through protection, and ULQ mode enabling <8 µA standby current - all critical for high-density point-of-load designs requiring fast transient response and thermal robustness.

Technical Context

The CSD97374Q4M implements a fully integrated synchronous buck power stage with an internal gate driver IC that controls both high-side (control) and low-side (sync) NexFET™ MOSFETs. Its architecture includes adaptive zero-crossing detection for diode emulation mode, undervoltage lockout (UVLO) with 4.15-V turn-on and 3.7-V shutdown thresholds, and integrated bootstrap FET replacing the traditional diode to minimize conduction loss.

It supports three operational modes: forced continuous conduction mode (FCCM), discontinuous conduction mode (DCM) via SKIP#-enabled diode emulation, and ultra-low quiescent (ULQ) mode with 8 µA typical supply current when both PWM and SKIP# are tri-stated. The driver responds to 3.3-V and 5-V PWM logic levels and provides immediate wake-up (<50 µs) from ULQ state.

Key Specifications

Pinout & Package

Package: SON (Small Outline No-lead), 3.5 mm × 4.5 mm, plastic, exposed thermal pad, 9-pin configuration. Optimized for low-inductance, high-current PCB routing and thermal dissipation via bottom-side thermal pad soldered to copper plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Compared with CSD97374Q4M, CSD97372Q4M offers identical interface and layout compatibility at lower current capacity, while MP87653GQ trades configurability for integration - making CSD97374Q4M optimal for high-performance, controller-based multiphase systems demanding precise timing and thermal headroom.

Availability

CSD97374Q4M is available at Aetrix Electronics and suitable for ultrabook CPU core power, multiphase DDR memory supplies, and networking ASIC point-of-load applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production lots.

Supply support for CSD97374Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in high-reliability power solutions.

The CSD97374Q4M belongs to TI's NexFET™ power stage product line, designed specifically for high-frequency, high-current synchronous buck conversion in computing, networking, and telecom infrastructure - prioritizing efficiency, thermal performance, and layout simplicity.

FAQ

What is the maximum recommended junction temperature for continuous operation of the CSD97374Q4M?

The CSD97374Q4M has a maximum operating junction temperature of 150°C, with recommended continuous operation up to 125°C. Thermal design must ensure TJ remains within this limit under worst-case load, ambient, and airflow conditions - validated using the SOA curves in the datasheet and RθJB = 2.5 °C/W thermal metric. Exceeding 125°C continuously accelerates wear-out mechanisms and may trigger thermal shutdown.

Does the CSD97374Q4M require an external bootstrap diode?

No, the CSD97374Q4M integrates a bootstrap FET that replaces the traditional external bootstrap diode. This reduces forward voltage drop and conduction loss, improving light-load efficiency. A 0.1-µF X5R ceramic capacitor must still be placed between BOOT and BOOT_R pins per the datasheet layout guidelines.

How does the CSD97374Q4M achieve ultra-low quiescent current in ULQ mode?

The CSD97374Q4M achieves 8 µA typical IDD in ULQ mode by placing both PWM and SKIP# inputs into tri-state (high-impedance), which disables the internal gate driver circuitry and shuts down the UVLO comparator. This state maintains immediate wake-up capability (<50 µs) while minimizing leakage paths - a key enabler for Windows® Connected Standby compliance.

What is the significance of the 10 kV/µs dV/dt rating specified for the CSD97374Q4M?

The >10 kV/µs dV/dt rating indicates the CSD97374Q4M's ability to withstand extremely rapid voltage transitions at the VSW node without false triggering or latch-up. This necessitates minimized VIN–PGND loop inductance in PCB layout - achieved by placing input capacitors adjacent to Pins 5 and 3/9 - to prevent ringing-induced shoot-through or driver malfunction.

Can the CSD97374Q4M operate with a 3.3-V PWM input signal?

Yes, the CSD97374Q4M supports 3.3-V PWM signals: its VIH threshold is 2.65 V (min) and VIL is 0.6 V (max), with a tri-state window of 1.3–2.0 V. This dual-voltage compatibility allows direct interfacing with both 3.3-V and 5-V controllers without level-shifting, simplifying system integration across diverse controller families.