My Inquiry
My Account
Texas Instruments CSD97376Q4M
- Part No.:
- CSD97376Q4M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD97376Q4M.pdf
- Description:
- IC HALF BRIDGE DRIVER 20A 8VSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,173
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CSD97376Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5-mm × 4.5-mm SON package. It delivers up to 20 A continuous output current, supports switching frequencies up to 2 MHz, achieves 90% system efficiency at 15 A (VIN = 12 V, VOUT = 1.8 V), and features tri-state PWM input with ultra-low quiescent current (130 µA standby, 8 µA deep-sleep) for Connected Standby in ultrabook/point-of-load applications.
For engineers reviewing the CSD97376Q4M datasheet, CSD97376Q4M pinout, CSD97376Q4M application, or CSD97376Q4M equivalent, key selection considerations include its 20 A continuous/45 A peak current rating, diode emulation mode with FCCM control, integrated bootstrap diode, shoot-through protection, and compatibility with 3.3-V and 5-V PWM controllers in high-density multiphase VRMs.
Technical Context
The CSD97376Q4M implements a high-speed gate driver with adaptive zero-crossing detection for discontinuous conduction mode (DCM), enabling light-load efficiency optimization. Its integrated boost-switch replaces the external bootstrap diode, reducing conduction loss while maintaining BST-SW voltage near VDD.
It incorporates undervoltage lockout (UVLO) with 4.15 V turn-on and 3.7 V turn-off thresholds, tri-state logic on both PWM and SKIP# pins with defined activation/exit timing (e.g., 100 ns PWM tri-state exit), and thermal protection via junction-to-board RθJB = 2.5 °C/W - all optimized for compact PCB layouts requiring <10 kV/µs dV/dt immunity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 20 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability without thermal derating under standard test conditions. |
| Peak Output Current | 45 A - supports transient load demands in CPU/GPU VRMs without device saturation or latch-up. |
| Switching Frequency | Up to 2 MHz - enables smaller magnetics and faster transient response in space-constrained point-of-load designs. |
| System Efficiency | 90% at 15 A - measured at VIN = 12 V, VOUT = 1.8 V, fSW = 500 kHz, LOUT = 0.29 µH - directly reduces thermal load and improves battery life in portable systems. |
| Quiescent Current | 130 µA (standby), 8 µA (deep sleep) - enables Windows™ Connected Standby compliance with immediate wake-up response (<50 µs). |
| Package | SON 3.5 mm × 4.5 mm - ultra-low-inductance, high-density footprint with optimized thermal pad for PCB heat spreading. |
| dV/dt Rating | >10 kV/µs - mandates strict layout rules for input capacitor placement and loop area minimization to prevent false triggering or EMI. |
Pinout & Package
Package: SON (Small Outline No-lead), 3.5 mm × 4.5 mm, 9-pin, exposed thermal pad. Designed for low-inductance, high-current routing with integrated PGND planes and optimized power loop geometry.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Diode emulation enable / ultra-low-power mode control | Low = DCM operation; High = FCCM; Tri-state = 8 µA deep-sleep with 50 µs wake latency - critical for dynamic efficiency scaling. |
| 2: VDD | Gate driver supply input | 4.5–5.5 V supply for internal logic and gate drive; UVLO active at 3.7 V (falling) - ensures robust startup and brownout recovery. |
| 3 & 9: PGND | Power ground return path | Dual PGND pins minimize ground bounce and improve current sharing; must be connected to thermal pad and external ground plane. |
| 4: VSW | Switching node connection | Direct tie to output inductor; experiences full VIN-to-GND swing at high dV/dt - requires shortest possible trace to reduce EMI and ringing. |
| 5: VIN | Main input power rail | 2–24 V input range; connects to high-frequency ceramic input capacitors placed adjacent to pins 3/5/9 to suppress switching noise. |
| 6: BOOT_R | Bootstrap capacitor reference | Internally tied to VSW; forms low-impedance return for bootstrap cap (min 0.1 µF X5R) - eliminates external diode and reduces losses. |
| 7: BOOT | Bootstrap capacitor positive terminal | Drives high-side FET gate; voltage ≈ VDD + VSW - enables full enhancement of control FET with minimal external components. |
| 8: PWM | Tri-state pulse-width modulation input | 3.3-V/5-V compatible; logic high = control FET ON/sync FET OFF; tri-state = both FETs OFF with zero-latency exit - simplifies controller interface. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diode Replacement | FET-based boost-switch reduces conduction loss vs. diode, maintains BST-SW ≈ VDD, and eliminates external component count. |
| Ultra-Low Quiescent (ULQ) Mode | 8 µA supply current with 20 µs wake-up time when SKIP# is tri-stated - meets Windows™ Connected Standby power budget requirements. |
| Shoot-Through Protection | Hardware-level dead-time control prevents simultaneous high-side/low-side FET conduction - eliminates cross-conduction failure risk. |
| System-Optimized PCB Footprint | Minimizes VIN-PGND and VSW-PGND loop inductance; supports >10 kV/µs dV/dt without layout-induced instability or EMI. |
| Diode Emulation with FCCM | Zero-crossing detection enables seamless transition between DCM (light load) and FCCM (heavy load) - maximizes efficiency across full load range. |
Applications
| Ultrabook/Notebook DC/DC Converters | Multiphase Vcore Solutions |
|---|---|
Use Scenario: Primary CPU core voltage regulation in thin-and-light notebooks with dynamic load steps from idle to turbo burst. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering precise 0.5–1.5 V output with fast transient response and sub-100 ns gate drive timing. Use Value: 90% efficiency at 15 A reduces thermal density by ~3 W vs. legacy solutions, enabling fanless operation and extended battery runtime. |
Use Scenario: One phase in a 3+1 or 4+1 multiphase VRM supplying Intel/AMD processors with tight voltage tolerance (±1%) and high ripple rejection. IC Role / Device Role / Timing Role: High-frequency (1–2 MHz) phase-leg module synchronized to master controller clock with matched propagation delay. Use Value: 20 A continuous per phase allows scalable current handling; identical SON footprint enables interleaved layout for reduced input/output ripple. |
| Point-of-Load Synchronous Buck | DDR Memory Power Delivery |
Use Scenario: Dedicated 1.2 V or 1.35 V rail for FPGA, ASIC, or GPU auxiliary supplies in networking switches and telecom baseband units. IC Role / Device Role / Timing Role: Compact, self-contained power stage replacing discrete driver + MOSFET combos; accepts standard PWM commands. Use Value: 3.5 mm × 4.5 mm footprint saves >40% board area vs. discrete alternatives; integrated shoot-through protection increases system reliability. |
Use Scenario: Dual-rail DDR4/DDR5 memory subsystem requiring tightly regulated VDDQ (1.2 V) and VPP (2.5 V) with fast load-step response. IC Role / Device Role / Timing Role: High-efficiency buck stage operating in FCCM during memory access bursts and DCM during refresh/idle cycles. Use Value: Diode emulation mode cuts light-load power loss by up to 40%, extending system uptime in always-on edge computing nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD97374Q4M | Lower 15 A continuous rating, same 3.5 mm × 4.5 mm SON package and pinout - shares identical thermal and layout design. | Targeted at cost-sensitive, lower-power applications (e.g., SoC I/O rails) where 20 A headroom is unnecessary. | Select when system peak current ≤15 A and BOM cost reduction is prioritized over margin. |
| ISL99227BIRZ | 25 A continuous rating, 4 mm × 5 mm QFN package, supports 3.3-V-only PWM input - no ULQ/deep-sleep mode. | Better suited for server VRMs requiring higher current density but lacking Connected Standby requirements. | Choose for high-current, high-temperature environments where 8 µA deep-sleep is not needed and larger footprint is acceptable. |
Compared with CSD97376Q4M, CSD97374Q4M offers identical integration and layout compatibility at reduced current capacity, while ISL99227BIRZ provides higher current headroom but lacks tri-state ULQ mode and requires different PCB land pattern - making CSD97376Q4M optimal for ultrabook and mobile VRM designs balancing efficiency, size, and low-power states.
Availability
CSD97376Q4M is available at Aetrix Electronics and suitable for ultrabook DC/DC converters, multiphase Vcore solutions, and point-of-load synchronous buck applications requiring stable component supply, long-term lifecycle support, and consistent electrical performance across production batches.
Supply support for CSD97376Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and precision analog signal chains.
The CSD97376Q4M belongs to TI's NexFET™ power stage product line, engineered specifically for high-frequency, high-density synchronous buck converters in computing, networking, and portable electronics - emphasizing system-level efficiency, thermal performance, and layout simplicity.
FAQ
What is the maximum input voltage supported by the CSD97376Q4M?
The CSD97376Q4M supports an absolute maximum input voltage (VIN to PGND) of 30 V, with recommended operation up to 24 V. This rating enables use in 12 V and 19 V input systems common in notebooks and telecom equipment, while providing margin against voltage transients and overshoot.
How does the CSD97376Q4M achieve 90% efficiency at 15 A?
The CSD97376Q4M achieves 90% system efficiency at 15 A through co-optimized NexFET™ silicon (low RDS(on) and Qgd), integrated gate driver with minimal propagation delay, ultra-low-inductance SON packaging, and system-level tuning for 12 V input / 1.8 V output at 500 kHz - all validated per JEDEC JESD51-2 thermal standards.
Does the CSD97376Q4M require an external bootstrap diode?
No, the CSD97376Q4M integrates a FET-based boost-switch that replaces the traditional bootstrap diode. This eliminates forward voltage drop and associated power loss, improves reliability, and simplifies layout - only a 0.1 µF ceramic capacitor between BOOT and BOOT_R is required.
What is the purpose of the SKIP# pin on the CSD97376Q4M?
The SKIP# pin on the CSD97376Q4M controls diode emulation mode and ultra-low-power states: pulled low enables DCM for light-load efficiency; pulled high forces FCCM; tri-stated enables 8 µA deep-sleep mode with 50 µs wake latency - essential for Windows™ Connected Standby compliance.
Can the CSD97376Q4M operate with a 3.3-V PWM controller?
Yes, the CSD97376Q4M PWM input is compatible with both 3.3-V and 5-V logic levels, with VIH = 2.65 V and VIL = 0.6 V. Its tri-state window (1.3–2 V) ensures reliable operation across mixed-voltage controller interfaces without level-shifting circuitry.
CSD97376Q4M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 20A
- Current - Peak Output:
- 45A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 24V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD97376Q4M FAQ
1.How can I place an order for CSD97376Q4M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD97376Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD97376Q4M reliable?
The price and inventory of CSD97376Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD97376Q4M is usually 5 days.
3.What payment methods are accepted for CSD97376Q4M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD97376Q4M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD97376Q4M?
CSD97376Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD97376Q4M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD97376Q4M?
For technical support, including CSD97376Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD97376Q4M requirements.
6.How does Aetrix verify that CSD97376Q4M is sourced from the original manufacturer or authorized distributors?
All CSD97376Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD97376Q4M meets industry standards.
7.What is the process for return or replacement of CSD97376Q4M?
All CSD97376Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD97376Q4M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD97376Q4M part is unused and in its original packaging.
Return procedure for CSD97376Q4M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSD97376Q4M Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
