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Texas Instruments CSD97394Q4M

Part No.:
CSD97394Q4M
Manufacturer:
Texas Instruments
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
8-PowerVFDFN
Datasheet:
AetrixCSD97394Q4M.pdf
Description:
IC HALF BRIDGE DRIVER 20A 8VSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,131

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Product details

Overview

CSD97394Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs for high-density DC/DC conversion. It delivers 20 A continuous / 45 A peak output, operates up to 2 MHz, achieves 90% system efficiency at 15 A, and targets point-of-load regulation in computing and networking systems.

For engineers reviewing the CSD97394Q4M datasheet, CSD97394Q4M pinout, CSD97394Q4M application, or CSD97394Q4M equivalent, key selection criteria include its 3.5 × 4.5 mm SON package, tri-state PWM/ SKIP# inputs enabling ultra-low quiescent current (8 µA ULQ mode), integrated bootstrap diode, and diode emulation for light-load efficiency in Vcore and DDR supplies.

Technical Context

The CSD97394Q4M implements a current-mode synchronous buck topology with integrated gate driver, control FET, and sync FET. Its driver supports forced continuous conduction mode (FCCM) and diode emulation mode via SKIP# pin control, with adaptive zero-crossing detection for discontinuous conduction mode (DCM) transition.

It features ultralow-inductance packaging optimized for >10 kV/µs dV/dt switching, integrated bootstrap switch replacing external diode, and UVLO with 4.15 V turn-on / 3.7 V shutdown thresholds. The device requires external 0.1 µF ceramic bootstrap capacitor between BOOT and BOOT_R pins.

Key Specifications

ParameterValue and Actual Design Meaning
Continuous Output Current20 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability under thermal limits
Peak Output Current45 A for tp ≤ 10 ms, duty cycle ≤ 1% - supports transient load demands without saturation
Switching FrequencyUp to 2000 kHz - enables compact magnetics and fast transient response in high-density designs
Efficiency90% at 15 A, VIN = 12 V, VOUT = 1.8 V - measured system-level efficiency including gate drive loss
Quiescent Current8 µA in ULQ mode (SKIP# tri-state) - enables connected standby for Windows® 8 platforms
PackageSON 3.5 × 4.5 mm - ultra-low-inductance, thermally enhanced surface-mount footprint
dV/dt Rating>10 kV/µs - dictates strict PCB layout requirements for input capacitors and VSW node routing

Pinout & Package

Package: SON 3.5 × 4.5 mm plastic package with exposed thermal pad; optimized for low parasitic inductance and high thermal conductivity to PCB ground planes.

Pin/TerminalCircuit RoleDesign Meaning
1: SKIP#Diode emulation mode controlLow = DCM enabled; High = FCCM; Tri-state = ULQ mode (8 µA IQ)
2: VDDDriver supply input4.5–5.5 V gate drive rail; powers internal logic and gate drivers
3, 9: PGNDPower ground returnCommon source reference for both FETs; must be low-impedance connection to PCB ground plane
4: VSWSwitching nodeConnects to output inductor; experiences full VIN-to-GND voltage swing at high dV/dt
5: VINMain input supply2–24 V input; requires local ceramic decoupling directly at pin
6: BOOT_RBootstrap capacitor returnInternal connection to VSW; forms bootstrap loop with BOOT pin
7: BOOTBootstrap supply nodeDrives control FET gate; requires 0.1 µF ceramic cap to BOOT_R
8: PWMTri-state PWM inputLogic Low = Control FET off / Sync FET on; Logic High = Control FET on / Sync FET off; Tri-state = LQ mode (130 µA IQ)

Key Features

FeatureDesign Value
Integrated bootstrap switchReplaces external bootstrap diode, reducing component count and improving reliability in high-frequency operation
Tri-state PWM and SKIP# inputsEnables immediate-response low-power states: 130 µA LQ (PWM tri-state) and 8 µA ULQ (SKIP# tri-state)
Diode emulation with adaptive ZX detectionImproves light-load efficiency by disabling sync FET at zero inductor current, avoiding reverse conduction loss
System-optimized PCB footprintMinimizes high-current loop area and parasitic inductance, supporting >10 kV/µs switching without excessive ringing
Ultra-low quiescent current modeReduces system standby power in connected-sleep states while maintaining sub-20 µs wake-up latency

Applications

Ultrabook/Notebook CPU Core PowerMultiphase Vcore for Desktop Processors

Use Scenario: Regulating 1.0–1.5 V core voltage for Intel/AMD mobile CPUs under dynamic load from 0 A to 20 A.

IC Role / Device Role / Timing Role: Synchronous buck power stage delivering high-current, fast-transient response with diode emulation for idle efficiency.

Use Value: Achieves 90% efficiency at 15 A while enabling Windows® 8 connected standby via 8 µA ULQ mode.

Use Scenario: One phase of a 4–6-phase VR12/VR13-compatible multiphase regulator supplying desktop CPU Vcore.

IC Role / Device Role / Timing Role: High-frequency (up to 2 MHz) power stage synchronized to multi-phase controller for ripple cancellation and thermal balancing.

Use Value: Enables compact, high-density phase design with 3.5 × 4.5 mm footprint and <10 ns propagation delay matching across phases.

DDR Memory Point-of-Load SupplyNetworking ASIC Core Voltage Regulation

Use Scenario: Providing 1.2 V or 1.35 V to DDR4 memory modules with tight voltage tolerance and fast load-step response.

IC Role / Device Role / Timing Role: Synchronous buck stage operating in FCCM mode to maintain low output ripple during burst data transfers.

Use Value: Delivers 20 A continuous current with <2.5 W power loss at 12 A, minimizing thermal impact on memory subsystem.

Use Scenario: Regulating 0.8–1.2 V core supply for high-throughput network processors in routers and switches.

IC Role / Device Role / Timing Role: High-efficiency, high-reliability power stage handling 15–20 A loads with robust thermal management via exposed pad and thermal vias.

Use Value: Supports 24 V input with 2000 kHz switching, reducing output filter size and improving transient response for packet-processing workloads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CSD97374Q5MSame 3.5 × 4.5 mm SON package but rated for 30 A continuous; higher RDS(ON) control FET (1.6 mΩ vs 1.2 mΩ)Better suited for higher-current, lower-frequency applications where thermal headroom is criticalSelect when system requires >20 A continuous current and can accommodate slightly higher conduction loss
TPS53679Integrated controller + power stage in 5 mm × 6 mm QFN; includes PMBus interface and telemetryTargeted at digitally controlled, multi-rail server and telecom power systems requiring monitoring and sequencingChoose when digital control, fault logging, or multi-rail coordination outweighs the benefit of discrete power stage flexibility

Compared with CSD97374Q5M and TPS53679, the CSD97394Q4M provides optimal balance of current rating, efficiency, and board space for mid-range computing point-of-load applications-offering higher peak current than the TPS53679's integrated solution and lower conduction loss than the CSD97374Q5M at typical 15 A loads.

Availability

CSD97394Q4M is available at Aetrix Electronics and suitable for Ultrabook CPU core power, multiphase Vcore supplies, and DDR memory point-of-load regulation requiring stable component supply and long-term production continuity.

Supply support for CSD97394Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog and embedded processing chips for industrial, automotive, and computing applications.

The CSD97394Q4M belongs to TI's NexFET™ power stage product line, engineered specifically for high-efficiency, high-frequency synchronous buck converters in space-constrained computing and networking equipment.

FAQ

What is the maximum input voltage rating for the CSD97394Q4M?

The CSD97394Q4M has an absolute maximum VIN-to-PGND rating of 30 V, with recommended operating input voltage up to 24 V. Operation above 24 V increases risk of VSW node overshoot exceeding the 33 V transient rating, potentially causing reliability issues. For reliable 24 V operation, ensure proper input capacitance placement and layout per Section 9.1.2 of the SLPS542 datasheet.

How does the CSD97394Q4M achieve 90% system efficiency at 15 A?

The CSD97394Q4M achieves 90% system efficiency at 15 A through co-optimized NexFET silicon (1.2 mΩ control FET, 1.6 mΩ sync FET), ultra-low-inductance 3.5 × 4.5 mm SON packaging, integrated gate driver minimizing dead-time loss, and diode emulation mode reducing light-load conduction loss. Measured at VIN = 12 V, VOUT = 1.8 V, fSW = 500 kHz, and TA = 25°C with six 10 µF ceramic input capacitors.

What is the purpose of the SKIP# pin on the CSD97394Q4M?

The SKIP# pin on the CSD97394Q4M controls diode emulation mode and ultra-low quiescent current states. When pulled low, it enables discontinuous conduction mode (DCM) via adaptive zero-crossing detection to improve light-load efficiency. When tri-stated, it activates ULQ mode with 8 µA supply current, enabling connected standby for Windows® 8 platforms. Its function is independent of PWM state and defined in Table 1 of the SLPS542 datasheet.

Can the CSD97394Q4M operate at 2 MHz switching frequency?

Yes, the CSD97394Q4M supports switching frequencies up to 2000 kHz, as specified in Section 6.3 Recommended Operating Conditions. Stable 2 MHz operation requires careful PCB layout-including minimized VSW loop area, tight input capacitor placement, and proper bootstrap capacitor (0.1 µF X5R ceramic) routing-to manage >10 kV/µs dV/dt transients and maintain gate drive integrity.

What thermal management features does the CSD97394Q4M include?

The CSD97394Q4M uses its exposed thermal pad as the primary heat path to the PCB, with a junction-to-board thermal resistance (RθJB) of 2.5°C/W. Effective thermal management requires ≥8 thermal vias (10 mil drill, 16 mil pad) connecting the pad to inner ground planes, plus copper pour on top/bottom layers. Layout guidelines in Section 9.3 specify via spacing, tenting, and solder-void mitigation techniques to maximize heat transfer.

CSD97394Q4M Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
NexFET™
Package/Case:
8-PowerVFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
Synchronous Buck Converters
Interface:
PWM
Load Type:
Inductive
Technology:
Power MOSFET
Rds On (Typ):
-
Current - Output / Channel:
20A
Current - Peak Output:
45A
Voltage - Supply:
4.5V ~ 5.5V
Voltage - Load:
4.5V ~ 24V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit
Fault Protection:
Shoot-Through, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
8-VSON (3.5x4.5)

CSD97394Q4M FAQ

1.How can I place an order for CSD97394Q4M through Aetrix?

Please submit a Request for Quotation (RFQ) for CSD97394Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CSD97394Q4M reliable?

The price and inventory of CSD97394Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD97394Q4M is usually 5 days.

3.What payment methods are accepted for CSD97394Q4M?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD97394Q4M transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CSD97394Q4M?

CSD97394Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CSD97394Q4M order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CSD97394Q4M?

For technical support, including CSD97394Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD97394Q4M requirements.

6.How does Aetrix verify that CSD97394Q4M is sourced from the original manufacturer or authorized distributors?

All CSD97394Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD97394Q4M meets industry standards.

7.What is the process for return or replacement of CSD97394Q4M?

All CSD97394Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD97394Q4M, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CSD97394Q4M part is unused and in its original packaging.

Return procedure for CSD97394Q4M:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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