Texas Instruments CSD97394Q4M
- Part No.:
- CSD97394Q4M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD97394Q4M.pdf
- Description:
- IC HALF BRIDGE DRIVER 20A 8VSON
- Quantity:
- Payment:

- Shipping:

Inventory:4,131
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CSD97394Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs for high-density DC/DC conversion. It delivers 20 A continuous / 45 A peak output, operates up to 2 MHz, achieves 90% system efficiency at 15 A, and targets point-of-load regulation in computing and networking systems.
For engineers reviewing the CSD97394Q4M datasheet, CSD97394Q4M pinout, CSD97394Q4M application, or CSD97394Q4M equivalent, key selection criteria include its 3.5 × 4.5 mm SON package, tri-state PWM/ SKIP# inputs enabling ultra-low quiescent current (8 µA ULQ mode), integrated bootstrap diode, and diode emulation for light-load efficiency in Vcore and DDR supplies.
Technical Context
The CSD97394Q4M implements a current-mode synchronous buck topology with integrated gate driver, control FET, and sync FET. Its driver supports forced continuous conduction mode (FCCM) and diode emulation mode via SKIP# pin control, with adaptive zero-crossing detection for discontinuous conduction mode (DCM) transition.
It features ultralow-inductance packaging optimized for >10 kV/µs dV/dt switching, integrated bootstrap switch replacing external diode, and UVLO with 4.15 V turn-on / 3.7 V shutdown thresholds. The device requires external 0.1 µF ceramic bootstrap capacitor between BOOT and BOOT_R pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 20 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability under thermal limits |
| Peak Output Current | 45 A for tp ≤ 10 ms, duty cycle ≤ 1% - supports transient load demands without saturation |
| Switching Frequency | Up to 2000 kHz - enables compact magnetics and fast transient response in high-density designs |
| Efficiency | 90% at 15 A, VIN = 12 V, VOUT = 1.8 V - measured system-level efficiency including gate drive loss |
| Quiescent Current | 8 µA in ULQ mode (SKIP# tri-state) - enables connected standby for Windows® 8 platforms |
| Package | SON 3.5 × 4.5 mm - ultra-low-inductance, thermally enhanced surface-mount footprint |
| dV/dt Rating | >10 kV/µs - dictates strict PCB layout requirements for input capacitors and VSW node routing |
Pinout & Package
Package: SON 3.5 × 4.5 mm plastic package with exposed thermal pad; optimized for low parasitic inductance and high thermal conductivity to PCB ground planes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Diode emulation mode control | Low = DCM enabled; High = FCCM; Tri-state = ULQ mode (8 µA IQ) |
| 2: VDD | Driver supply input | 4.5–5.5 V gate drive rail; powers internal logic and gate drivers |
| 3, 9: PGND | Power ground return | Common source reference for both FETs; must be low-impedance connection to PCB ground plane |
| 4: VSW | Switching node | Connects to output inductor; experiences full VIN-to-GND voltage swing at high dV/dt |
| 5: VIN | Main input supply | 2–24 V input; requires local ceramic decoupling directly at pin |
| 6: BOOT_R | Bootstrap capacitor return | Internal connection to VSW; forms bootstrap loop with BOOT pin |
| 7: BOOT | Bootstrap supply node | Drives control FET gate; requires 0.1 µF ceramic cap to BOOT_R |
| 8: PWM | Tri-state PWM input | Logic Low = Control FET off / Sync FET on; Logic High = Control FET on / Sync FET off; Tri-state = LQ mode (130 µA IQ) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated bootstrap switch | Replaces external bootstrap diode, reducing component count and improving reliability in high-frequency operation |
| Tri-state PWM and SKIP# inputs | Enables immediate-response low-power states: 130 µA LQ (PWM tri-state) and 8 µA ULQ (SKIP# tri-state) |
| Diode emulation with adaptive ZX detection | Improves light-load efficiency by disabling sync FET at zero inductor current, avoiding reverse conduction loss |
| System-optimized PCB footprint | Minimizes high-current loop area and parasitic inductance, supporting >10 kV/µs switching without excessive ringing |
| Ultra-low quiescent current mode | Reduces system standby power in connected-sleep states while maintaining sub-20 µs wake-up latency |
Applications
| Ultrabook/Notebook CPU Core Power | Multiphase Vcore for Desktop Processors |
|---|---|
Use Scenario: Regulating 1.0–1.5 V core voltage for Intel/AMD mobile CPUs under dynamic load from 0 A to 20 A. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering high-current, fast-transient response with diode emulation for idle efficiency. Use Value: Achieves 90% efficiency at 15 A while enabling Windows® 8 connected standby via 8 µA ULQ mode. | Use Scenario: One phase of a 4–6-phase VR12/VR13-compatible multiphase regulator supplying desktop CPU Vcore. IC Role / Device Role / Timing Role: High-frequency (up to 2 MHz) power stage synchronized to multi-phase controller for ripple cancellation and thermal balancing. Use Value: Enables compact, high-density phase design with 3.5 × 4.5 mm footprint and <10 ns propagation delay matching across phases. |
| DDR Memory Point-of-Load Supply | Networking ASIC Core Voltage Regulation |
Use Scenario: Providing 1.2 V or 1.35 V to DDR4 memory modules with tight voltage tolerance and fast load-step response. IC Role / Device Role / Timing Role: Synchronous buck stage operating in FCCM mode to maintain low output ripple during burst data transfers. Use Value: Delivers 20 A continuous current with <2.5 W power loss at 12 A, minimizing thermal impact on memory subsystem. | Use Scenario: Regulating 0.8–1.2 V core supply for high-throughput network processors in routers and switches. IC Role / Device Role / Timing Role: High-efficiency, high-reliability power stage handling 15–20 A loads with robust thermal management via exposed pad and thermal vias. Use Value: Supports 24 V input with 2000 kHz switching, reducing output filter size and improving transient response for packet-processing workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD97374Q5M | Same 3.5 × 4.5 mm SON package but rated for 30 A continuous; higher RDS(ON) control FET (1.6 mΩ vs 1.2 mΩ) | Better suited for higher-current, lower-frequency applications where thermal headroom is critical | Select when system requires >20 A continuous current and can accommodate slightly higher conduction loss |
| TPS53679 | Integrated controller + power stage in 5 mm × 6 mm QFN; includes PMBus interface and telemetry | Targeted at digitally controlled, multi-rail server and telecom power systems requiring monitoring and sequencing | Choose when digital control, fault logging, or multi-rail coordination outweighs the benefit of discrete power stage flexibility |
Compared with CSD97374Q5M and TPS53679, the CSD97394Q4M provides optimal balance of current rating, efficiency, and board space for mid-range computing point-of-load applications-offering higher peak current than the TPS53679's integrated solution and lower conduction loss than the CSD97374Q5M at typical 15 A loads.
Availability
CSD97394Q4M is available at Aetrix Electronics and suitable for Ultrabook CPU core power, multiphase Vcore supplies, and DDR memory point-of-load regulation requiring stable component supply and long-term production continuity.
Supply support for CSD97394Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company designing analog and embedded processing chips for industrial, automotive, and computing applications.
The CSD97394Q4M belongs to TI's NexFET™ power stage product line, engineered specifically for high-efficiency, high-frequency synchronous buck converters in space-constrained computing and networking equipment.
FAQ
What is the maximum input voltage rating for the CSD97394Q4M?
The CSD97394Q4M has an absolute maximum VIN-to-PGND rating of 30 V, with recommended operating input voltage up to 24 V. Operation above 24 V increases risk of VSW node overshoot exceeding the 33 V transient rating, potentially causing reliability issues. For reliable 24 V operation, ensure proper input capacitance placement and layout per Section 9.1.2 of the SLPS542 datasheet.
How does the CSD97394Q4M achieve 90% system efficiency at 15 A?
The CSD97394Q4M achieves 90% system efficiency at 15 A through co-optimized NexFET silicon (1.2 mΩ control FET, 1.6 mΩ sync FET), ultra-low-inductance 3.5 × 4.5 mm SON packaging, integrated gate driver minimizing dead-time loss, and diode emulation mode reducing light-load conduction loss. Measured at VIN = 12 V, VOUT = 1.8 V, fSW = 500 kHz, and TA = 25°C with six 10 µF ceramic input capacitors.
What is the purpose of the SKIP# pin on the CSD97394Q4M?
The SKIP# pin on the CSD97394Q4M controls diode emulation mode and ultra-low quiescent current states. When pulled low, it enables discontinuous conduction mode (DCM) via adaptive zero-crossing detection to improve light-load efficiency. When tri-stated, it activates ULQ mode with 8 µA supply current, enabling connected standby for Windows® 8 platforms. Its function is independent of PWM state and defined in Table 1 of the SLPS542 datasheet.
Can the CSD97394Q4M operate at 2 MHz switching frequency?
Yes, the CSD97394Q4M supports switching frequencies up to 2000 kHz, as specified in Section 6.3 Recommended Operating Conditions. Stable 2 MHz operation requires careful PCB layout-including minimized VSW loop area, tight input capacitor placement, and proper bootstrap capacitor (0.1 µF X5R ceramic) routing-to manage >10 kV/µs dV/dt transients and maintain gate drive integrity.
What thermal management features does the CSD97394Q4M include?
The CSD97394Q4M uses its exposed thermal pad as the primary heat path to the PCB, with a junction-to-board thermal resistance (RθJB) of 2.5°C/W. Effective thermal management requires ≥8 thermal vias (10 mil drill, 16 mil pad) connecting the pad to inner ground planes, plus copper pour on top/bottom layers. Layout guidelines in Section 9.3 specify via spacing, tenting, and solder-void mitigation techniques to maximize heat transfer.
CSD97394Q4M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 20A
- Current - Peak Output:
- 45A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 24V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD97394Q4M FAQ
1.How can I place an order for CSD97394Q4M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD97394Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD97394Q4M reliable?
The price and inventory of CSD97394Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD97394Q4M is usually 5 days.
3.What payment methods are accepted for CSD97394Q4M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD97394Q4M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD97394Q4M?
CSD97394Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD97394Q4M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD97394Q4M?
For technical support, including CSD97394Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD97394Q4M requirements.
6.How does Aetrix verify that CSD97394Q4M is sourced from the original manufacturer or authorized distributors?
All CSD97394Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD97394Q4M meets industry standards.
7.What is the process for return or replacement of CSD97394Q4M?
All CSD97394Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD97394Q4M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD97394Q4M part is unused and in its original packaging.
Return procedure for CSD97394Q4M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CSD97394Q4M Tags
-
NCP1393BDR2G
onsemi

-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi

-
A3909GLYTR-T
Allegro MicroSystems

-
SIC631CD-T1-GE3
Vishay Siliconix

-
BTN70301EPAXUMA1
Infineon Technologies

-
TDA21520AUMA1
Infineon Technologies

-
AOZ5116QI
Alpha & Omega Semiconductor Inc.

-
IRSM005-301MHTR
Infineon Technologies

-
IRSM005-301MH
Infineon Technologies

-
MP6610GJ-Z
Monolithic Power Systems Inc.

-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
