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Texas Instruments CSD97395Q4M
- Part No.:
- CSD97395Q4M
- Manufacturer:
- Texas Instruments
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-PowerVFDFN
- Datasheet:
-
CSD97395Q4M.pdf
- Description:
- IC HALF BRIDGE DRIVER 25A 8VSON
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CSD97395Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5 mm × 4.5 mm SON package. It delivers up to 25 A continuous output current, supports input voltages up to 24 V, operates at switching frequencies up to 2 MHz, and achieves >92% system efficiency at 15 A - optimized for high-density point-of-load DC/DC conversion in computing and networking systems.
For engineers reviewing the CSD97395Q4M datasheet, CSD97395Q4M pinout, CSD97395Q4M application, or CSD97395Q4M equivalent, key selection criteria include its tri-state PWM/ SKIP# control interface, ultra-low quiescent current (8 µA ULQ mode), integrated bootstrap diode, shoot-through protection, and validated performance under 10 kV/µs dV/dt stress conditions.
Technical Context
The CSD97395Q4M implements a high-speed gate driver with adaptive zero-crossing detection for diode emulation mode, enabling discontinuous conduction mode (DCM) at light loads to improve efficiency. Its driver supports both forced continuous conduction mode (FCCM) and DCM via SKIP# logic control, with configurable tri-state entry/exit timing (e.g., 50 µs SKIP# wake-up, 100 ns PWM exit latency).
It integrates a bootstrap FET switch instead of a passive diode, reducing conduction loss and improving high-side FET gate drive stability. The device features undervoltage lockout (UVLO) with 4.15 V turn-on and 3.7 V turn-off thresholds, and incorporates shoot-through protection with active gate control to prevent simultaneous high- and low-side FET conduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 25 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability without thermal derating under standard test conditions. |
| Peak Output Current | 60 A for tp ≤ 10 ms, duty cycle ≤ 1% - supports transient load demands in CPU/GPU VRMs without saturation or failure. |
| Switching Frequency Range | 200–2000 kHz - enables high-frequency operation to reduce output filter size while maintaining >92% efficiency at 15 A. |
| Input Voltage Range | Up to 24 V - supports 12 V and 19 V input rails common in server, telecom, and notebook power stages. |
| Quiescent Current (ULQ) | 8 µA with SKIP# tri-stated - enables Windows® 8 connected standby compliance by minimizing idle power draw. |
| dV/dt Rating | >10 kV/µs - confirms robustness against fast voltage transients during hard switching, critical for layout reliability. |
| Package Thermal Resistance | RθJB = 2.5 °C/W - indicates efficient heat transfer from junction to PCB board plane via exposed PGND pads and thermal vias. |
Pinout & Package
Package: SON 3.5 mm × 4.5 mm plastic package with exposed thermal pad (PGND-connected). Optimized for high-density PCB layouts with minimal loop inductance and system-level thermal management via bottom-side copper and thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SKIP# | Mode control input | Tri-state logic input enabling Diode Emulation Mode (low), FCCM (high), or ULQ shutdown (floating); wake-up latency ≤50 µs. |
| 2: VDD | Driver supply rail | 4.5–5.5 V gate driver and logic supply; powers internal circuitry and bootstrap charge pump; UVLO threshold 4.15 V (rising). |
| 3, 9: PGND | Power ground reference | Low-inductance return path for high-current switching loops; must be connected directly to PCB ground plane and thermal pad. |
| 4: VSW | Switch node | High-slew-rate connection to output inductor; experiences full VIN-to-GND swing; requires minimized trace length to reduce EMI and ringing. |
| 5: VIN | Main input supply | Accepts up to 24 V DC input; connects to local ceramic input capacitors placed adjacent to pins 3/5/9 to suppress high-frequency ripple. |
| 6: BOOT_R | Bootstrap capacitor return | Reference node for external 0.1 µF bootstrap capacitor; internally tied to VSW; enables high-side FET gate drive above VIN. |
| 7: BOOT | Bootstrap supply | Drives high-side FET gate; supplied via integrated bootstrap FET (not diode), reducing conduction loss and improving reliability. |
| 8: PWM | 3-state control input | Accepts 3.3 V or 5 V logic; tri-state entry forces both FET gates low with zero-latency exit (100 ns); supports skip-cycle and burst-mode control. |
Key Features
| Feature | Design Value |
|---|---|
| System-optimized PCB footprint | SON 3.5 × 4.5 mm outline with symmetric PGND pads and dedicated VIN/VSW routing zones reduces layout iteration time and improves EMI performance. |
| Ultra-low quiescent (ULQ) current mode | 8 µA supply current with SKIP# tri-stated - enables sub-10 µA system standby power in Windows® 8/10 connected standby designs. |
| Integrated bootstrap FET | Replaces conventional bootstrap diode to lower forward voltage drop and eliminate reverse recovery loss - improves light-load efficiency and thermal margin. |
| Diode emulation with FCCM select | SKIP# pin selects between DCM (light-load efficiency) and FCCM (low-noise, predictable ripple) - no external components required. |
| Shoot-through protection | Hardware-enforced dead-time and gate-drive interlock prevent simultaneous conduction of high- and low-side FETs - eliminates risk of catastrophic short-circuit. |
Applications
| Ultrabook/Notebook DC/DC Converters | Multiphase Vcore and DDR Solutions |
|---|---|
Use Scenario: Point-of-load regulation for CPU core voltage (Vcore) and DDR memory rails in thin-and-light notebooks with strict thermal and space constraints. IC Role / Device Role / Timing Role: Synchronous buck power stage delivering tightly regulated 1.8 V or lower output with fast transient response and <100 ns control latency. Use Value: Enables >92% efficiency at 15 A with 25 A continuous rating, reducing heatsink requirements and extending battery runtime under dynamic workloads. |
Use Scenario: One phase in a multi-phase VRM supplying high-current, low-voltage rails to modern CPUs and GPUs requiring precise current sharing and phase interleaving. IC Role / Device Role / Timing Role: High-frequency (up to 2 MHz) power stage synchronized to master controller clock; supports tri-state PWM for phase shedding and ULQ mode during idle cycles. Use Value: Delivers 25 A per phase with <2.5 W power loss at 15 A, allowing scalable multi-phase designs with minimized board area and improved thermal distribution. |
| Point-of-Load Synchronous Buck in Networking | Point-of-Load Synchronous Buck in Telecom Systems |
Use Scenario: Regulation of ASIC/FPGA I/O and core supplies in 1U rack-mounted switches and routers operating in thermally constrained environments. IC Role / Device Role / Timing Role: High-efficiency, high-density power stage supporting 12 V or 48 V intermediate bus architectures with fast load-step response. Use Value: Achieves >92% efficiency across 5–25 A load range while maintaining <10 kV/µs dV/dt immunity - reduces system cooling cost and improves MTBF. |
Use Scenario: Baseband processor and RF front-end power delivery in 4G/5G small cells and remote radio units requiring high reliability and low standby power. IC Role / Device Role / Timing Role: Synchronous buck stage with ULQ mode (8 µA) and diode emulation for intermittent traffic patterns; supports 24 V input with 1.8 V/3.3 V outputs. Use Value: Enables always-on connectivity with <10 mW idle power per rail, meeting ETSI Class I energy efficiency requirements for telecom infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CSD97374Q4M | Lower 20 A continuous rating, same 3.5 × 4.5 mm SON package, identical pinout, but reduced peak current (45 A vs. 60 A) and higher RDS(on) in both FETs. | Targeted at mid-power applications (e.g., SoC I/O rails) where 25 A headroom is unnecessary; less suitable for CPU Vcore with aggressive transient demands. | Select when system peak current remains below 45 A and cost optimization is prioritized over maximum transient capability. |
| ISL99227BIRZ | 40 V max VIN, 30 A continuous, 50 A peak, 3.5 × 4.5 mm QFN; includes integrated current sense amplifier and PMBus telemetry, but no ULQ mode or tri-state SKIP#. | Designed for digitally controlled VRMs requiring real-time current monitoring and fault reporting; lacks Windows® 8 connected standby support. | Select when digital interface, telemetry, and higher voltage tolerance outweigh need for ultra-low quiescent current and analog mode flexibility. |
Compared with CSD97374Q4M and ISL99227BIRZ, the CSD97395Q4M uniquely balances 25 A continuous/60 A peak capability, 8 µA ULQ mode, and tri-state control in a pin-compatible SON package - making it optimal for high-efficiency, thermally constrained, and standby-sensitive computing and networking point-of-load designs.
Availability
CSD97395Q4M is available at Aetrix Electronics and suitable for ultrabook DC/DC converters, multiphase Vcore solutions, and point-of-load applications in networking and telecom systems requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for CSD97395Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and system-level integration.
The CSD97395Q4M belongs to TI's NexFET™ Power Stage product line, engineered specifically for high-frequency, high-density synchronous buck conversion in computing, networking, and telecom infrastructure - emphasizing low-loss silicon, integrated drivers, and layout-optimized packaging.
FAQ
What is the maximum input voltage rating for the CSD97395Q4M?
The CSD97395Q4M has an absolute maximum VIN-to-PGND rating of 30 V, but its recommended operating condition specifies up to 24 V. Operation near the 30 V limit risks excessive VSW node overshoot during switching transients; TI recommends limiting VIN to ≤24 V for reliable long-term operation with proper snubbing and layout.
Does the CSD97395Q4M support both 3.3 V and 5 V PWM input signals?
Yes, the CSD97395Q4M PWM input is compatible with both 3.3 V and 5 V logic levels. Its VIH threshold is 2.65 V and VIL is 0.6 V, with 0.2 V hysteresis - ensuring robust recognition of either logic family without level-shifting circuitry.
How does the ULQ (ultra-low quiescent) mode function in the CSD97395Q4M?
The CSD97395Q4M enters ULQ mode when SKIP# is held in tri-state (floating), reducing IDD to 8 µA typical. In this state, the driver remains responsive: applying a valid logic level to SKIP# resumes full operation within 50 µs, enabling rapid wake-up from connected standby without boot delay.
What is the purpose of the integrated bootstrap FET in the CSD97395Q4M?
The CSD97395Q4M replaces the traditional bootstrap diode with an integrated FET, lowering forward voltage drop and eliminating reverse recovery charge. This reduces high-side gate drive loss, improves light-load efficiency, and enhances reliability under high-frequency, high-dV/dt operation.
Can the CSD97395Q4M be used in multiphase configurations?
Yes, the CSD97395Q4M is explicitly designed for multiphase Vcore and DDR solutions. Its tri-state PWM input enables seamless phase shedding, and its matched FET characteristics ensure consistent current sharing across parallel phases when driven by a compatible multi-phase controller.
CSD97395Q4M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- NexFET™
- Package/Case:
- 8-PowerVFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 25A
- Current - Peak Output:
- 60A
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 24V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSON (3.5x4.5)
CSD97395Q4M FAQ
1.How can I place an order for CSD97395Q4M through Aetrix?
Please submit a Request for Quotation (RFQ) for CSD97395Q4M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CSD97395Q4M reliable?
The price and inventory of CSD97395Q4M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CSD97395Q4M is usually 5 days.
3.What payment methods are accepted for CSD97395Q4M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CSD97395Q4M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CSD97395Q4M?
CSD97395Q4M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CSD97395Q4M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CSD97395Q4M?
For technical support, including CSD97395Q4M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CSD97395Q4M requirements.
6.How does Aetrix verify that CSD97395Q4M is sourced from the original manufacturer or authorized distributors?
All CSD97395Q4M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CSD97395Q4M meets industry standards.
7.What is the process for return or replacement of CSD97395Q4M?
All CSD97395Q4M units undergo pre-shipment inspection (PSI). If there is an issue with CSD97395Q4M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CSD97395Q4M part is unused and in its original packaging.
Return procedure for CSD97395Q4M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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