Texas Instruments CSD97396Q4MT

Overview

CSD97396Q4MT from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5 mm × 4.5 mm SON package. It delivers up to 30 A continuous output current, achieves >93% system efficiency at 15 A (VIN = 12 V, VOUT = 1.8 V, fSW = 500 kHz), supports up to 2 MHz switching frequency, and features tri-state PWM/ SKIP# inputs for ultra-low quiescent current modes - deployed in high-density point-of-load converters for notebook CPU core voltage regulation.

For engineers reviewing the CSD97396Q4MT datasheet, CSD97396Q4MT pinout, CSD97396Q4MT application, or CSD97396Q4MT equivalent, key selection criteria include its 30 A continuous rating, integrated bootstrap diode, ULQ mode (8 µA standby), diode emulation capability, and compatibility with 3.3 V/5 V PWM controllers in multiphase Vcore and DDR power delivery systems.

Technical Context

The CSD97396Q4MT implements a high-frequency synchronous buck power stage with an integrated gate driver IC that controls discrete Control FET and Sync FET silicon optimized for low RDS(ON) and Qgd. Its functional modes are governed by PWM and SKIP# logic states, enabling FCCM, DCM via zero-crossing detection, LQ (130 µA), and ULQ (8 µA) operation - all without external bias circuitry beyond VDD and bootstrap capacitor.

It uses a dedicated BOOT_R pin with internal connection to VSW and integrates a bootstrap switch replacing the external diode. UVLO thresholds (4.15 V turn-on, 3.7 V turn-off) protect gate drive integrity, while shoot-through protection and adaptive zero-crossing comparator ensure safe, efficient light-load operation across –40°C to +125°C junction temperature range.

Key Specifications

Pinout & Package

Package: SON 3.5 mm × 4.5 mm plastic package with exposed thermal pad (PGND-connected). Optimized for minimal loop inductance and high-current PCB routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Compared with CSD97396Q4MT, CSD97374Q4M offers pin-compatible downsizing for lighter loads, while MP87653GQ trades external control flexibility and ULQ capability for monolithic simplicity - making CSD97396Q4MT optimal for high-performance, controller-based multiphase systems demanding lowest possible standby power.

Availability

CSD97396Q4MT is available at Aetrix Electronics and suitable for notebook CPU core power, multiphase Vcore VRMs, and DDR memory supply applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for volume production.

Supply support for CSD97396Q4MT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog, embedded processing, and power management ICs, with leadership in high-efficiency power conversion and automotive-grade reliability.

The CSD97396Q4MT belongs to TI's NexFET™ Power Stage product line, engineered specifically for high-current, high-frequency synchronous buck converters in computing and networking infrastructure where thermal density, efficiency, and fast transient response are critical.

FAQ

What is the maximum continuous output current rating for the CSD97396Q4MT?

The CSD97396Q4MT is rated for 30 A continuous output current under specified conditions: VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz, LOUT = 0.29 µH, and ambient temperature of 25°C. This rating assumes proper PCB thermal design with adequate copper area and thermal vias per TI's layout guidelines. Peak current capability reaches 65 A for short durations (≤10 ms).

Does the CSD97396Q4MT require an external bootstrap diode?

No, the CSD97396Q4MT integrates a bootstrap switch that replaces the traditional external bootstrap diode. The device uses pins BOOT and BOOT_R - with BOOT_R internally connected to VSW - and requires only a 0.1 µF ceramic capacitor between them. This integration reduces component count, improves reliability, and maintains consistent bootstrap voltage during high-frequency operation.

How does the ULQ (ultra-low quiescent) mode function in the CSD97396Q4MT?

The CSD97396Q4MT enters ULQ mode when the SKIP# pin is held in tri-state (floating or at intermediate voltage), reducing supply current to 8 µA typical. In this state, the driver remains responsive: wake-up occurs within 50 µs of SKIP# reassertion, enabling immediate PWM acceptance. This feature directly supports Windows® 8 connected standby requirements without compromising system responsiveness.

Can the CSD97396Q4MT operate with both 3.3 V and 5 V PWM controllers?

Yes, the CSD97396Q4MT PWM input is compatible with both 3.3 V and 5 V logic levels. Its VIH threshold is 2.65 V and VIL is 0.6 V, with 0.2 V hysteresis - ensuring reliable recognition of logic high/low across both standards. The tri-state window (1.3 V ±0.2 V) further guarantees interoperability with controllers offering high-impedance PWM outputs during idle or low-power states.

What thermal performance can be expected from the CSD97396Q4MT in a standard 6-layer PCB?

In a validated 6-layer PCB (4" × 3.5", 1 oz copper, thermal vias under exposed pad), the CSD97396Q4MT achieves RθJB = 2.5°C/W. At 30 A continuous load, this translates to ~75°C junction rise above board temperature - well within its 125°C max operating junction limit. Performance scales with airflow: natural convection supports ~20 A, while 400 LFM forced air enables full 30 A rating per TI's SOA curves.