Infineon Technologies DHP1050N10N5AUMA1

Overview

DHP1050N10N5 from Infineon Technologies is a 100 V symmetrical half-bridge PowerStage integrating level-shifted differential-input gate drivers and OptiMOS™ 5 MOSFETs in a single PQFN-36 package. It delivers 20 A continuous current, supports up to 1 MHz switching, features -8 V to +15 V common-mode input rejection, and includes on-chip 120 V bootstrap diode and dual UVLO (VDD/VHB). It serves as the core power switching stage in telecom bus converters.

For engineers reviewing the DHP1050N10N5 datasheet, DHP1050N10N5 pinout, DHP1050N10N5 application, or DHP1050N10N5 equivalent, key selection criteria include differential input robustness against ground bounce, shoot-through immunity, 7.5 mm × 6.0 mm footprint constraints, 100 V blocking capability, and integrated bootstrap functionality for high-side drive.

Technical Context

The DHP1050N10N5 implements a true differential input architecture with synchronous clock-gated logic that enforces mutually exclusive HO/LO states-eliminating shoot-through by design. Its level-shifted driver uses internal HV isolation to sustain >100 V dV/dt at the HS node while maintaining <6 ns propagation delay matching between high- and low-side paths.

It integrates two matched 100 V OptiMOS™ 5 MOSFETs with R_DS(on) ≤ 5.0 mΩ (typ), ultra-low output impedances (0.5 Ω HS / 0.35 Ω LS pull-down), and a dedicated HB–HS bootstrap path rated for 120 V reverse recovery. UVLO thresholds are 7.0 V (VDD, 0.5 V hysteresis) and 5.75 V (VHB, 0.25 V hysteresis).

Key Specifications

Pinout & Package

Package: PG-IQFN-36-1, 7.5 mm × 6.0 mm × 0.9 mm, lead-free RoHS-compliant surface-mount module with exposed thermal pad (PGND-connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge power stage applications.

Compared with IRS2007MTRPBF and TPS40400RHLR, DHP1050N10N5 delivers higher integration density and faster time-to-market for space-constrained telecom and datacom converters, but trades off flexibility in MOSFET selection and control algorithm customization.

Availability

DHP1050N10N5AUMA1 is available at Aetrix Electronics and suitable for telecom bus converters, synchronous buck regulators, intermediate bus architectures, and full-bridge DC/DC modules requiring stable component supply, consistent parametric performance, and long-term industrial lifecycle support.

Supply support for DHP1050N10N5AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon and wide-bandgap device technologies.

The OptiMOS™ PowerStage product line targets high-efficiency, high-density DC/DC conversion in telecom, server, and industrial power supplies-designed to replace discrete driver + MOSFET combinations with validated, thermally optimized modules.

FAQ

What is the purpose of the HS and HB pins?

The HS (Phase Node) pin connects to the low-side of the external bootstrap capacitor and serves as the switching node reference for high-side drive. The HB (High-Side Bootstrap) pin connects to the high-side of the same capacitor and supplies the floating voltage needed to turn on the high-side MOSFET. Together, they enable self-biased gate drive without an isolated auxiliary supply.

Does DHP1050N10N5 require an external bootstrap diode?

No. DHP1050N10N5 integrates a 120 V-rated bootstrap diode internally, eliminating the need for an external diode. This reduces component count, PCB area, and potential failure points associated with discrete diode reverse-recovery behavior in high-dV/dt environments.

How does the differential input prevent shoot-through?

The differential input logic decodes HI and LI as a single truth-table state-not independent signals-ensuring only three valid output states: both off, high-side on, or low-side on. This hardware-enforced state machine prevents simultaneous HO/LO activation, removing reliance on external dead-time insertion or controller-level timing margins.

What thermal considerations apply to the PGND pad?

PGND pins (10,11,22,23,33) and the exposed bottom thermal pad must be soldered to a minimum 200 mm² copper pour connected to system ground. Thermal resistance from junction to board is 1.8 °C/W; insufficient copper area or poor solder voiding increases junction temperature and risks exceeding 150 °C max rating under 20 A continuous load.