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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Full Half-Bridge (H Bridge) Drivers

Texas Instruments FX021

Name: FX021
Brand: Texas Instruments
SKU: FX021
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: FX021

Manufacturer:: Texas Instruments

Category:: Full Half-Bridge (H Bridge) Drivers

Package:: 8-PowerVFDFN

Datasheet:: FX021.pdf

Description:: IC HALF BRIDGE DRIVER 25A 8VSON

Quantity:: RFQ Add To RFQ list

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Product details

Overview

CSD97374Q4M from Texas Instruments is a synchronous buck NexFET™ power stage integrating driver IC and dual MOSFETs in a single 3.5-mm × 4.5-mm SON package. It delivers up to 25 A continuous output current at 1.8 V out, achieves >92% system efficiency at 15 A, supports 500 kHz–2 MHz switching, and operates with input voltages up to 24 V - optimized for high-density point-of-load conversion in notebook and server VRMs.

For engineers reviewing the CSD97374Q4M datasheet, CSD97374Q4M pinout, CSD97374Q4M application, or CSD97374Q4M equivalent, key selection criteria include its tri-state PWM/ SKIP# interface compatibility with 3.3-V/5-V controllers, integrated bootstrap diode, shoot-through protection, ULQ mode (8 µA standby), and diode emulation for DCM efficiency improvement.

Technical Context

The CSD97374Q4M implements a high-frequency synchronous buck power stage with an integrated gate driver IC featuring adaptive zero-crossing detection, programmable diode emulation via SKIP# control, and ultra-low quiescent current modes. Its architecture combines a high-side control FET and low-side sync FET with matched R_DS(on) and Q_gd characteristics tuned for minimal conduction and switching loss at 500 kHz–2 MHz.

It uses a dedicated bootstrap circuit (BOOT/BOOT_R pins) with integrated boost-switch FET instead of a discrete diode, enabling tighter V_BST regulation and reduced high-side drive loss. UVLO thresholds (4.15 V rise / 3.7 V fall) and tri-state timing (60 ns PWM exit, 50 µs SKIP# wake-up) are precisely defined for robust multi-rail sequencing in CPU/GPU VRMs.

Key Specifications

Parameter	Value and Actual Design Meaning
Continuous Output Current	25 A at VIN = 12 V, VDD = 5 V, VOUT = 1.8 V, fSW = 500 kHz - defines maximum sustained load capability without thermal derating under standard PCB conditions.
Peak Output Current	60 A - supports transient load steps in CPU core power delivery without device saturation or overcurrent shutdown.
System Efficiency	>92% at 15 A - measured at 12 V in, 1.8 V out, enabling high-power density while minimizing thermal management burden.
Switching Frequency Range	200–2000 kHz - allows design flexibility between size (higher fSW → smaller inductor) and efficiency (lower fSW → lower switching loss).
Power Loss	2.3 W at 15 A, 12 V in, 1.8 V out, 25°C - quantifies total dissipation including conduction, switching, and gate drive losses under nominal operating conditions.
Quiescent Current Modes	8 µA (SKIP# tri-state), 130 µA (PWM tri-state), 8.2 mA (active) - enables Connected Standby compliance and rapid wake-up in Windows-based platforms.
Input Voltage Range	2–24 V - supports wide-input DC/DC stages from 5 V rail to 19 V adapter inputs in portable and infrastructure systems.
Package Thermal Resistance	R_θJB = 2.5 °C/W - enables direct board-level heat transfer to internal copper layers, critical for high-current, low-profile designs.

Pinout & Package

Package: SON (Small Outline No-lead), 3.5 mm × 4.5 mm, 9-pin, plastic, exposed thermal pad. Optimized for high-current PCB routing and low-inductance layout.

Pin/Terminal	Circuit Role	Design Meaning
1 - SKIP#	Diode emulation enable / ultra-low-power mode control	Low = DCM operation; High = FCCM; Tri-state = 8 µA ULQ mode with 50 µs wake-up - enables light-load efficiency optimization and system sleep states.
2 - VDD	Gate driver supply input	4.5–5.5 V regulated supply powering internal logic and gate drivers; includes UVLO (4.15 V turn-on, 3.7 V turn-off) for safe startup/shutdown.
3 & 9 - PGND	Power ground return path	Dual PGND pins minimize ground loop inductance and reduce voltage spikes during high di/dt switching events.
4 - VSW	Switch node connection	Connects directly to output inductor; carries full switching waveform (0 to VIN); requires tight layout to minimize EMI and ringing.
5 - VIN	Main input power supply	Accepts 2–24 V; must be decoupled with ≥6×10 µF ceramic capacitors placed adjacent to pin to suppress high-frequency ripple and supply noise.
6 - BOOT_R	Bootstrap capacitor reference	Internally connected to VSW; forms low-impedance return for bootstrap capacitor (min 0.1 µF X5R) to sustain high-side FET gate drive.
7 - BOOT	Bootstrap supply input	Drives high-side FET gate; voltage ≈ VDD + VSW; integrated boost-switch FET replaces external diode for improved reliability and efficiency.
8 - PWM	Tri-state PWM input	Logic high/low controls FET pairing; tri-state (1.3–2 V) forces both gates low and reduces IDD to 130 µA with zero-latency exit (100 ns).

Key Features

Feature	Design Value
Integrated NexFET™ power stage + driver IC	Eliminates external gate driver and discrete MOSFET layout complexity; reduces parasitic inductance and improves switching speed consistency.
Diode emulation with FCCM mode selection	Enables discontinuous conduction mode below critical current (improving light-load efficiency) or forced CCM for low-noise applications - selectable via SKIP# pin.
Ultra-Low Quiescent (ULQ) current mode	8 µA standby current when SKIP# is tri-stated - meets Windows Connected Standby (S0ix) requirements without sacrificing wake-up responsiveness.
Shoot-through protection	Hardware-level dead-time control prevents simultaneous high-side/low-side FET conduction - eliminates risk of destructive shoot-through current.
3.3-V and 5-V PWM signal compatibility	VIH = 2.65 V min, VIL = 0.6 V max, VTS = 1.3–2 V - interoperates with legacy and modern controller ICs without level-shifting circuitry.
System-optimized PCB footprint	SON 3.5 × 4.5 mm layout minimizes trace length between VIN, PGND, VSW, and BOOT; reduces EMI and simplifies thermal pad soldering.

Applications

Ultrabook/Notebook Core VRM	Multiphase DDR Memory Power
Use Scenario: Delivering tightly regulated 1.05–1.35 V at up to 40 A peak to DDR4/DDR5 memory subsystems in thin-and-light laptops. IC Role / Device Role / Timing Role: Synchronous buck power stage providing fast transient response and low output impedance for memory bus stability. Use Value: Diode emulation mode maintains >88% efficiency at 2 A idle current; 2.5 °C/W R_θJB enables compact thermal design on limited PCB real estate.	Use Scenario: High-efficiency, low-noise 1.2 V core supply for Intel/AMD CPU voltage regulator modules in ultraportable platforms. IC Role / Device Role / Timing Role: Primary power stage in 2–4 phase interleaved buck converter, synchronized to controller's PWM clock. Use Value: >92% efficiency at 15 A reduces thermal load by ~1.5 W vs. discrete solutions; tri-state PWM supports dynamic phase shedding.
Networking ASIC Point-of-Load	Telecom Baseband Processor Supply
Use Scenario: 0.8–1.8 V, 20 A PoL supply for FPGA or network processor SoCs in 1U rack-mounted switches. IC Role / Device Role / Timing Role: High-density buck stage operating at 1 MHz to shrink magnetics while maintaining <1% output ripple. Use Value: 2 MHz max fSW allows use of 0.15 µH inductors; integrated bootstrap switch improves high-side drive margin under heavy load.	Use Scenario: Dual-rail 1.1 V / 1.8 V supply for LTE/5G baseband processors requiring rapid load-step response and low standby power. IC Role / Device Role / Timing Role: Secondary-stage buck converter following primary intermediate bus; accepts 5–12 V input. Use Value: ULQ mode (8 µA) extends battery life in portable test equipment; shoot-through protection ensures reliability in harsh telecom environments.

Ultrabook/Notebook Core VRM

Multiphase DDR Memory Power

Use Scenario: Delivering tightly regulated 1.05–1.35 V at up to 40 A peak to DDR4/DDR5 memory subsystems in thin-and-light laptops.

IC Role / Device Role / Timing Role: Synchronous buck power stage providing fast transient response and low output impedance for memory bus stability.

Use Value: Diode emulation mode maintains >88% efficiency at 2 A idle current; 2.5 °C/W R_θJB enables compact thermal design on limited PCB real estate.

Use Scenario: High-efficiency, low-noise 1.2 V core supply for Intel/AMD CPU voltage regulator modules in ultraportable platforms.

IC Role / Device Role / Timing Role: Primary power stage in 2–4 phase interleaved buck converter, synchronized to controller's PWM clock.

Use Value: >92% efficiency at 15 A reduces thermal load by ~1.5 W vs. discrete solutions; tri-state PWM supports dynamic phase shedding.

Networking ASIC Point-of-Load

Telecom Baseband Processor Supply

Use Scenario: 0.8–1.8 V, 20 A PoL supply for FPGA or network processor SoCs in 1U rack-mounted switches.

IC Role / Device Role / Timing Role: High-density buck stage operating at 1 MHz to shrink magnetics while maintaining <1% output ripple.

Use Value: 2 MHz max fSW allows use of 0.15 µH inductors; integrated bootstrap switch improves high-side drive margin under heavy load.

Use Scenario: Dual-rail 1.1 V / 1.8 V supply for LTE/5G baseband processors requiring rapid load-step response and low standby power.

IC Role / Device Role / Timing Role: Secondary-stage buck converter following primary intermediate bus; accepts 5–12 V input.

Use Value: ULQ mode (8 µA) extends battery life in portable test equipment; shoot-through protection ensures reliability in harsh telecom environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CSD97394Q4M	Higher 30 A continuous rating, 2.2 mΩ high-side R_DS(on), same 3.5 × 4.5 mm SON package	Better suited for 12–19 V input, >25 A applications where thermal headroom is constrained	Select when higher current headroom or lower conduction loss at 25+ A is required; pin-compatible drop-in replacement.
MP87651GQ-Z	Monolithic 30 V, 25 A buck converter (integrated controller + FETs), 2.5 mm × 3.5 mm QFN	Requires no external controller; lacks tri-state PWM/SKIP# and ULQ mode; lower integration density than CSD97374Q4M	Choose for simplified BOM and space-constrained designs where controller integration is preferred over flexibility.

Compared with CSD97374Q4M, CSD97394Q4M offers higher current capability in identical footprint, while MP87651GQ-Z trades external control flexibility for monolithic simplicity - making CSD97374Q4M optimal for high-performance, controller-based multiphase VRMs demanding precise timing and low-quiescent operation.

Availability

CSD97374Q4M is available at Aetrix Electronics and suitable for notebook VRMs, DDR memory power, networking ASIC PoL, and telecom baseband processor supplies requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CSD97374Q4M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with leadership in high-efficiency power conversion and precision analog solutions.

The CSD97374Q4M belongs to TI's NexFET™ Power Stage product line, designed specifically for high-current, high-frequency synchronous buck converters in computing, communications, and enterprise infrastructure applications where density, efficiency, and thermal performance are critical.

FAQ

What is the maximum recommended junction temperature for continuous operation of the CSD97374Q4M?

The CSD97374Q4M has a maximum operating junction temperature (T_J) of 150°C per its Absolute Maximum Ratings table. However, for reliable continuous operation, TI specifies a maximum recommended T_J of 125°C - validated across all electrical characteristics and thermal curves in the datasheet, including power loss and SOA data.

Does the CSD97374Q4M require an external bootstrap diode?

No, the CSD97374Q4M integrates a bootstrap switch FET in place of a conventional diode. The BOOT and BOOT_R pins form a self-contained bootstrap circuit; only a 0.1 µF ceramic capacitor is required between them. This eliminates external diode selection, reduces component count, and improves high-side gate drive efficiency.

How does the SKIP# pin affect light-load efficiency in the CSD97374Q4M?

When SKIP# is pulled low, the CSD97374Q4M enables diode emulation mode, allowing discontinuous conduction mode (DCM) operation below the critical current threshold. This reduces switching losses at light loads, improving system efficiency - e.g., achieving >85% at 2 A output versus ~75% in forced CCM - as confirmed in Figure 1 efficiency curves.

Can the CSD97374Q4M operate with a 3.3-V PWM controller?

Yes, the CSD97374Q4M supports 3.3-V PWM signals: VIH minimum is 2.65 V and VIL maximum is 0.6 V, with a tri-state window of 1.3–2.0 V. Its input structure accommodates both 3.3-V and 5-V logic levels without external level shifters, verified across all recommended operating conditions in Section 6.3.

What thermal metrics define the CSD97374Q4M's PCB-level cooling performance?

The CSD97374Q4M specifies R_θJB = 2.5 °C/W (junction-to-board) and R_θJC = 22.8 °C/W (junction-to-case). R_θJB is the dominant metric for typical PCB mounting, indicating that with proper thermal pad soldering and internal copper planes, each watt of dissipation raises the junction temperature only 2.5°C above board temperature.

FX021 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: NexFET™

Package/Case:: 8-PowerVFDFN

Packaging:: Tape & Reel (TR)

Product Status:: Not For New Designs

Output Configuration:: Half Bridge

Applications:: Synchronous Buck Converters

Interface:: PWM

Load Type:: Inductive

Technology:: Power MOSFET

Rds On (Typ):: -

Current - Output / Channel:: 25A

Current - Peak Output:: 60A

Voltage - Supply:: 4.5V ~ 5.5V

Voltage - Load:: 4.5V ~ 24V

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Features:: Bootstrap Circuit, Diode Emulation

Fault Protection:: Shoot-Through, UVLO

Mounting Type:: Surface Mount

Supplier Device Package:: 8-VSON (3.5x4.5)

FX021 FAQ

1.How can I place an order for FX021 through Aetrix?

Please submit a Request for Quotation (RFQ) for FX021 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FX021 reliable?

The price and inventory of FX021 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FX021 is usually 5 days.

3.What payment methods are accepted for FX021?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FX021 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FX021?

FX021 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FX021 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FX021?

For technical support, including FX021 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FX021 requirements.

6.How does Aetrix verify that FX021 is sourced from the original manufacturer or authorized distributors?

All FX021 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FX021 meets industry standards.

7.What is the process for return or replacement of FX021?

All FX021 units undergo pre-shipment inspection (PSI). If there is an issue with FX021, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FX021 part is unused and in its original packaging.

Return procedure for FX021:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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