Toshiba Semiconductor and Storage GT40RR21(STA1,E
- Part No.:
- GT40RR21(STA1,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single IGBTs
- Package:
- TO-3P-3, SC-65-3
- Datasheet:
-
GT40RR21(STA1,E.pdf
- Description:
- IGBT 1200V 40A TO3P
- Quantity:
- Payment:

- Shipping:

Inventory:52
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Product details
Overview
GT40RR21 from Toshiba is a 6.5th-generation silicon N-channel RC-IGBT with monolithically integrated freewheeling diode, rated for 1350 V VCES, 40 A IC(DC), and 175 °C maximum junction temperature. It delivers low saturation voltage (VCE(sat) = 2.05 V typ. at 40 A) and fast switching (tf = 0.21 µs typ.) for voltage-resonant inverter applications.
For engineers reviewing the GT40RR21 datasheet, GT40RR21 pinout, GT40RR21 application, or GT40RR21 equivalent, key selection criteria include its TO-3P(N) package thermal resistance (Rth(j-c) = 0.65 °C/W), integrated FWD reverse recovery time (trr = 0.60 µs typ.), and high-speed switching loss performance under inductive load conditions.
Technical Context
The GT40RR21 implements an RC-IGBT architecture where the freewheeling diode is fabricated on the same die as the IGBT, enabling tight thermal coupling and optimized commutation behavior in resonant topologies. Its enhancement-mode gate drive requires ±15 V for full conduction and features low gate leakage (±100 nA max).
Designed for hard-switched and soft-switched voltage-resonant inverters, the device operates with VGE(OFF) = 4.5–7.5 V threshold and exhibits positive temperature coefficient for VCE(sat), supporting parallel operation with current sharing stability up to Tj = 175 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 1350 V - supports DC-link voltages up to 950 V in three-level NPC inverters with margin |
| IC(DC) | 40 A - continuous collector current at Tc = 25 °C, derates to 33 A at Tc = 100 °C |
| VCE(sat) | 2.05 V (typ. at 40 A, 15 V VGE, 25 °C) - enables low conduction loss in high-power resonant converters |
| tf | 0.21 µs (typ. at 40 A) - reduces turn-off energy loss (Eoff = 0.28 mJ typ.) in high-frequency operation |
| trr | 0.60 µs (typ. at 15 A IF, di/dt = −20 A/µs) - minimizes reverse recovery overshoot and snubber stress |
| Rth(j-c) | 0.65 °C/W - allows 230 W power dissipation at 25 °C case temperature before reaching 175 °C junction limit |
| Tj(max) | 175 °C - enables compact heatsink design in industrial motor drives and induction heating systems |
Pinout & Package
GT40RR21 is housed in a TO-3P(N) package (Toshiba designation: 2-16C1S), featuring isolated metal tab for direct heatsink mounting and 4.6 g typical weight. The package provides low thermal resistance and mechanical robustness for high-reliability power conversion modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Gate | Control electrode | Accepts ±25 V gate-emitter voltage; requires external gate resistor (e.g., 39 Ω) to control dV/dt and EMI |
| 2: Collector | High-side power terminal | Connected to DC-link positive; carries full load current and withstands 1350 V blocking capability |
| 3: Emitter | Power return and reference node | Serves as common emitter for IGBT and integrated FWD; must be low-inductance path to minimize switching oscillation |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic RC-IGBT integration | Eliminates discrete diode placement mismatch, ensuring matched thermal and dynamic characteristics between IGBT and FWD |
| 6.5th-generation trench-gate structure | Reduces VCE(sat) by ~15% vs. prior generation while maintaining rugged short-circuit withstand capability |
| High-speed switching with low Eoff | 0.28 mJ typical turn-off loss at 280 V, 40 A enables >20 kHz operation in resonant inverters without excessive cooling |
| 175 °C maximum junction temperature | Supports higher ambient operating temperatures and reduces thermal derating in enclosed industrial enclosures |
| Positive VCE(sat) temperature coefficient | Enables stable current sharing when paralleling multiple GT40RR21 devices in high-current systems |
Applications
| Induction Heating Systems | Voltage-Resonant Inverters |
|---|---|
Use Scenario: High-frequency (20–100 kHz) resonant tank circuits in domestic and industrial cooktops and metal melting furnaces. IC Role / Device Role / Timing Role: Main switching device in half-bridge or full-bridge topology, synchronized with zero-voltage switching (ZVS) to minimize losses. Use Value: Low tf and integrated FWD reduce dead-time-induced distortion and improve ZVS window margin over discrete IGBT+diode solutions. | Use Scenario: Soft-switched DC-AC conversion in UPS, solar microinverters, and battery-based energy storage systems. IC Role / Device Role / Timing Role: Resonant switch in LLC or series-resonant topologies, operating near natural frequency with controlled phase shift. Use Value: Monolithic RC structure ensures precise timing alignment between IGBT turn-off and FWD turn-on, suppressing voltage spikes during commutation. |
| Industrial Motor Drives | High-Voltage DC Power Supplies |
Use Scenario: Three-phase inverter stages in HVAC compressors, pumps, and conveyors requiring >600 V DC-link operation. IC Role / Device Role / Timing Role: Output stage switch handling 40 A continuous current with peak surge capability up to 200 A (3 µs). Use Value: 175 °C Tj(max) and 0.65 °C/W Rth(j-c) allow sustained output at elevated ambient temperatures without forced air cooling. | Use Scenario: High-efficiency rectification and regulation in telecom rectifiers and medical imaging power supplies. IC Role / Device Role / Timing Role: Active switch in phase-shifted full-bridge or active-clamp forward converters operating at 1350 V blocking. Use Value: VCES = 1350 V provides 30% voltage margin over 1000 V DC-bus designs, improving long-term reliability under transient overvoltage conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN40N120B3 | 1200 V VCES, 40 A, TO-247 package, no integrated diode | Requires external ultrafast diode; higher layout complexity and thermal mismatch risk | Preferred where lower VCES suffices and discrete diode optimization is required |
| Infineon IKW40N120H3 | 1200 V VCES, 40 A, TRENCHSTOP™ 3, integrated diode, TO-247 | Lower VCE(sat) (1.85 V typ.), but limited to 150 °C Tj(max) | Selected for higher efficiency at moderate temperature rise; not suitable for 175 °C ambient designs |
Compared with IXGN40N120B3 and IKW40N120H3, the GT40RR21 uniquely combines 1350 V blocking, monolithic RC integration, and 175 °C junction rating-making it the only option among the three qualified for high-reliability voltage-resonant inverters operating continuously above 150 °C case temperature.
Availability
GT40RR21 is available at Aetrix Electronics and suitable for industrial motor drives, induction heating systems, and high-voltage DC power supplies requiring stable component supply across multi-year production cycles.
Supply support for GT40RR21 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and memory solutions with global manufacturing and quality certification.
The GT40RR21 belongs to Toshiba's 6.5th-generation RC-IGBT product line, engineered specifically for high-efficiency, high-reliability voltage-resonant inverter applications demanding integrated diode performance and extended thermal operation.
FAQ
What is the maximum allowable junction temperature for the GT40RR21?
The GT40RR21 has a maximum junction temperature (Tj) rating of 175 °C, as specified in its Absolute Maximum Ratings table. This value is strictly enforced-note 1 states that junction temperature must not exceed 175 °C under any operating condition. Exceeding this limit risks thermal runaway due to the positive temperature coefficient of VCE(sat). Thermal design must ensure Rth(j-c) = 0.65 °C/W and adequate heatsinking to maintain safe operation of the GT40RR21.
Does the GT40RR21 include an integrated freewheeling diode?
Yes, the GT40RR21 is an RC-IGBT (Reverse Conducting IGBT) with a freewheeling diode monolithically integrated on the same silicon die. This is explicitly stated in the Features section and confirmed by electrical characteristics including diode forward voltage (VF = 1.75 V typ. at 15 A) and reverse recovery time (trr = 0.60 µs typ.). The integration eliminates external diode placement errors and improves thermal coupling, making the GT40RR21 distinct from standard IGBTs.
What is the gate-emitter threshold voltage range for the GT40RR21?
The GT40RR21 has a gate-emitter threshold voltage (VGE(OFF)) range of 4.5 V (min) to 7.5 V (max), measured at IC = 40 mA and VCE = 5 V. This defines the minimum gate voltage required to initiate conduction. The device operates in enhancement mode and requires ≥15 V VGE for full saturation, as confirmed by VCE(sat) test conditions. Proper gate drive design must account for this threshold to avoid linear-mode operation and excessive power dissipation in the GT40RR21.
What package type does the GT40RR21 use, and what are its mechanical identifiers?
The GT40RR21 uses the TO-3P(N) package, also designated by Toshiba as 2-16C1S. It features three terminals (Gate, Collector, Emitter) arranged in a single-row configuration with an isolated metal tab for heatsink mounting. Package dimensions and weight (4.6 g typ.) are documented in the datasheet revision 2.0.A. The TO-3P(N) provides superior thermal performance (Rth(j-c) = 0.65 °C/W) compared to TO-247, making it suitable for high-power density designs using the GT40RR21.
Can the GT40RR21 be used in hard-switched applications, or is it limited to resonant topologies?
The GT40RR21 is explicitly dedicated to voltage-resonant inverter switching applications per the official Applications note, and its design optimizations-including low tf, monolithic FWD, and 1350 V VCES-are targeted for ZVS/ZCS operation. While it can function in hard-switched circuits, Toshiba cautions against non-resonant use. The device's Safe Operating Area (SOA) and switching loss curves are characterized for inductive resonant loads, and operation outside this scope may compromise reliability or violate the "RESTRICTIONS ON PRODUCT USE" clause in the datasheet for the GT40RR21.
GT40RR21(STA1,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- TO-3P-3, SC-65-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 1200 V
- Current - Collector (Ic) (Max):
- 40 A
- Current - Collector Pulsed (Icm):
- 200 A
- Vce(on) (Max) @ Vge, Ic:
- 2.8V @ 15V, 40A
- Power - Max:
- 230 W
- Switching Energy:
- -, 540µJ (off)
- Input Type:
- Standard
- Gate Charge:
- -
- Td (on/off) @ 25°C:
- -
- Test Condition:
- 280V, 40A, 10Ohm, 20V
- Reverse Recovery Time (trr):
- 600 ns
- Operating Temperature:
- 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-3P(N)
GT40RR21(STA1,E FAQ
1.How can I place an order for GT40RR21(STA1,E through Aetrix?
Please submit a Request for Quotation (RFQ) for GT40RR21(STA1,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GT40RR21(STA1,E reliable?
The price and inventory of GT40RR21(STA1,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GT40RR21(STA1,E is usually 5 days.
3.What payment methods are accepted for GT40RR21(STA1,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GT40RR21(STA1,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GT40RR21(STA1,E?
GT40RR21(STA1,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GT40RR21(STA1,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GT40RR21(STA1,E?
For technical support, including GT40RR21(STA1,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GT40RR21(STA1,E requirements.
6.How does Aetrix verify that GT40RR21(STA1,E is sourced from the original manufacturer or authorized distributors?
All GT40RR21(STA1,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GT40RR21(STA1,E meets industry standards.
7.What is the process for return or replacement of GT40RR21(STA1,E?
All GT40RR21(STA1,E units undergo pre-shipment inspection (PSI). If there is an issue with GT40RR21(STA1,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GT40RR21(STA1,E part is unused and in its original packaging.
Return procedure for GT40RR21(STA1,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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