Infineon Technologies IGI60F1414A1LAUMA1

Overview

IGI60F1414A1LAUMA1 from Infineon is a CoolGaN™ Integrated Power Stage (IPS) combining two 140 mΩ / 600 V enhancement-mode GaN HEMTs in a half-bridge configuration with isolated gate drivers, supporting up to 3 MHz PWM switching, 47 ns propagation delay, and >300 V/ns CMTI - deployed in high-density AC/DC chargers and active-clamp flyback converters.

For engineers reviewing the IGI60F1414A1LAUMA1 datasheet, IGI60F1414A1LAUMA1 pinout, IGI60F1414A1LAUMA1 application, or IGI60F1414A1LAUMA1 equivalent, key selection criteria include isolated gate drive architecture, dual UVLO protection per supply rail, configurable turn-on/off speed via external RC, low-side open-source current sensing, and QFN-28 thermal performance for industrial SMPS designs.

Technical Context

The device integrates coreless transformer (CT)-based galvanic isolation between input logic and both high- and low-side driver outputs, enabling robust level-shifting without optocouplers or external isolators. Each driver features independent undervoltage lockout (UVLO) for VDDI (2.85 V), VDDL (6.5 V), and VDDH (6.5 V), ensuring safe startup and fault recovery.

It implements rail-to-rail gate drive with 1 A source / 2 A sink capability, optimized for CoolGaN HEMTs with 3.2 nC total gate charge. Input logic supports LV-TTL thresholds with 0.8 V hysteresis, and ENABLE pin forces both outputs low during power-up or fault conditions.

Key Specifications

Pinout & Package

Delivered in thermally enhanced PG-TIQFN-28-1 package (8 × 8 mm, 0.5 mm pitch) with exposed thermal pad on underside for PCB-level heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar GaN half-bridge power stage applications.

Compared with LMG3425R030 and TPH3205WS, IGI60F1414A1LAUMA1 delivers verified system-level integration - including CT isolation, matched propagation delay, and unified thermal management - reducing design risk and layout iterations for industrial AC/DC and DC/DC converters.

Availability

IGI60F1414A1LAUMA1 is available at Aetrix Electronics and suitable for high-frequency AC/DC chargers, server power supplies, and LED driver modules requiring stable component supply, JEDEC-qualified industrial reliability, and consistent thermal performance across production batches.

Supply support for IGI60F1414A1LAUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and gallium nitride power devices.

This part belongs to Infineon's CoolGaN™ Integrated Power Stage product line, engineered to simplify high-efficiency, high-frequency SMPS design by merging GaN switches and isolated gate drivers into a single qualified package for industrial and computing applications.

FAQ

What is the recommended minimum external bootstrap capacitor value for VDDH generation?

A minimum 100 nF X7R ceramic capacitor placed directly between VDDH and SW is required to sustain high-side driver operation during continuous conduction. For 3 MHz operation with 50% duty cycle, a 220 nF capacitor is recommended to limit voltage droop below 0.5 V under peak load, ensuring reliable UVLO margin and gate drive strength.

Can I operate IGI60F1414A1LAUMA1 with only a 5 V input supply?

Yes - VDDI can be supplied directly with 5 V, but the internal SLDO must be disabled by connecting SLDON to VDDI (not GNDI). The input logic remains functional, though VDDI UVLO threshold (2.85 V) still applies. Note that VDDL and VDDH must still be supplied at ~8 V for proper gate drive swing and GaN turn-on margin.

Does the device support adaptive dead-time control?

No - IGI60F1414A1LAUMA1 does not include internal dead-time generation or sensing. Dead time must be implemented externally in the controller (e.g., via complementary PWM with programmable delay) since INL and INH are fully independent inputs with no cross-coupling or blanking logic.

How is thermal performance affected if the exposed pad is not soldered to the PCB?

Without thermal pad connection, R_θJA increases from 32 °C/W to >75 °C/W, limiting usable power to <3 W at 25 °C ambient. Full-rated 10 W+ operation requires minimum 90% solder coverage of the 6 × 6 mm exposed pad to a 4-layer PCB with ≥4 thermal vias (0.3 mm diameter, 1 mm pitch) connected to inner ground plane.