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Infineon Technologies IR3551MTRPBF
- Part No.:
- IR3551MTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 28-VFQFN Exposed Pad
- Datasheet:
-
IR3551MTRPBF.pdf
- Description:
- IC HALF BRIDGE DRIVER 50A PQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,622
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Product details
Overview
IR3551MTRPBF from Infineon Technologies is a 50A integrated PowIRstage® synchronous buck power stage combining gate driver, control MOSFET, synchronous MOSFET, and integrated Schottky diode in a single 5mm × 6mm PQFN package. It delivers up to 94.5% peak efficiency at 1.2V output, supports 4.5–15V input, operates up to 1.0MHz, and integrates a current sense amplifier with 32.5 V/V gain - optimized for CPU/GPU core voltage regulation in server-grade power delivery.
For engineers reviewing the IR3551MTRPBF datasheet, IR3551MTRPBF pinout, IR3551MTRPBF application, or IR3551MTRPBF equivalent, key selection criteria include its Body-Braking® transient support, diode-emulation mode for light-load efficiency, Intel DrMOS V4.0 compliance, thermal flag output, and PCB footprint compatibility with IR3550 (60A) and IR3553 (40A).
Technical Context
The IR3551 implements a co-packaged synchronous buck power stage with monolithic integration of high-side and low-side MOSFETs, bootstrap gate driver, and precision current-sense amplifier referenced to REFIN. Its internal timing alignment minimizes shoot-through risk while enabling tight dead-time control via PWM tri-state transitions.
It features dual-mode operation: standard synchronous rectification and diode-emulation mode activated by BBRK# pin sequencing, eliminating zero-current detection burden on the controller. Phase fault detection (PHSFLT#) and thermal flag (160°C trip) provide real-time protection without external circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 50A DC continuous - supports high-current CPU/GPU core rails without parallel stages |
| Peak Efficiency | 94.5% at 1.2V/300kHz - reduces thermal load and enables compact heatsink-free designs |
| Switching Frequency | 200–1000 kHz - allows miniaturized magnetics and capacitors while maintaining transient response |
| Current Sense Gain | 32.5 V/V ±2.5 - delivers accurate, low-noise IOUT signal for precise system current monitoring |
| VIN Range | 4.5V to 15V - compatible with 5V, 12V intermediate bus architectures in servers and workstations |
| Package | 28-pin PQFN, 5mm × 6mm × 0.9mm - enables dual-sided cooling and matches IR3550/IR3553 footprints |
| Thermal Resistance θJB | 2.1 °C/W (junction-to-PCB via pin 15) - ensures efficient heat transfer to copper planes under full load |
Pinout & Package
IR3551MTRPBF uses a 28-lead PQFN package (5mm × 6mm × 0.9mm) with exposed thermal pad (pin 15) and dual ground isolation: PGND (pins 4,14,15) for power switching, LGND (pin 24) for analog/signal reference, and TGND (pin 27) for internal substrate grounding - critical for current sense accuracy.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 (CSIN−, CSIN+) | Differential current sense inputs | Interface to external shunt or DCR network; enable 32.5× gain IOUT signal referenced to REFIN |
| 3 (VCC) | Bias supply for logic and driver | 4.5–7V input; requires ≥0.22µF decoupling to PGND (or ≥1µF if current sense active) |
| 4,14,15 (PGND) | Power ground return | High-current return path for MOSFET switching; connects to thermal pad for θJB = 2.1°C/W |
| 5,28 (GATEL) | Low-side gate driver outputs | Accessible test points for observing GATEL waveform; rated for 200mA DC drive |
| 6–13 (SW) | Switch node | High dv/dt node connecting control/synchronous MOSFET sources; must be routed with minimal loop area |
| 16–19 (VIN) | Main input voltage connection | Parallel high-current input pins; require local 10µF + 0.22µF ceramic decoupling per datasheet layout rules |
| 20 (BOOST) | Bootstrap capacitor node | Charges high-side gate driver; requires ≥0.22µF cap tied directly to SW with minimal trace inductance |
| 21 (PHSFLT#) | Open-drain phase fault indicator | Pulls low on MOSFET short/open or junction temperature >160°C; requires external pull-up |
| 22 (PWM) | 3.3V logic-level tri-state input | "High" = HS on, "Low" = LS on, "Tri-state" = Body-Braking® or diode emulation activation |
| 23 (BBRK#) | Body-Braking® / diode emulation control | Pull-low after VCC UVLO to enable diode emulation; weak internal 3.3V pull-up (69–338 kΩ) |
| 24 (LGND) | Signal/analog ground reference | Reference for PWM, REFIN, CSIN+, CSIN−; must be isolated from PGND in PCB layout |
| 25 (REFIN) | Current sense reference voltage | IOUT = V(REFIN) + 32.5×[V(CSIN+)−V(CSIN−)]; connect to LGND if unused |
| 26 (IOUT) | Current sense amplifier output | Analog output voltage proportional to sensed current; floats if current sense disabled |
| 27 (TGND) | Internal substrate ground | Must be electrically isolated from PGND/LGND on PCB to preserve current sense accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Body-Braking® load transient support | Tri-state PWM forces both MOSFETs off during fast load steps, reducing required output capacitance by up to 30% |
| Diode-emulation high-efficiency mode | Eliminates zero-current detection requirement from controller, improving light-load efficiency without added complexity |
| Integrated current sense amplifier | 32.5 V/V gain with ±450 µV offset enables <1% current sensing error across -40°C to 125°C |
| Intel DrMOS V4.0 compliance | Meets specification for digital power management interface timing, voltage tolerance, and thermal reporting in server VRMs |
| Dual-sided cooling capability | Exposed thermal pad (pin 15) and top-surface thermal resistance (θJC_TOP = 17.5°C/W) support stacked heatsink or thermal interface |
Applications
| CPU Core Voltage Regulation | GPU Power Delivery |
|---|---|
Use Scenario: High-current, dynamically scaled core rail for dual-socket x86 servers with rapid load transients up to 50A/µs. IC Role / Device Role / Timing Role: Integrated PowIRstage® power stage providing synchronous buck conversion with Body-Braking® for sub-100ns transient recovery. Use Value: Reduces output capacitance count by 25% versus discrete solutions while maintaining Intel VR13/VR14 compliance. | Use Scenario: Compact, low-profile 12V-to-0.8V conversion for PCIe-based GPU modules in AI accelerators and gaming workstations. IC Role / Device Role / Timing Role: Single-package power stage delivering 50A at ≤1.0MHz with diode-emulation mode for idle power optimization. Use Value: Enables 5mm × 6mm board area per phase, supporting multi-phase layouts in space-constrained GPU carrier cards. |
| DDR Memory Array Supply | High-Density Server VRM |
Use Scenario: Dual-rail 1.2V/1.35V supply for DDR4/DDR5 memory subsystems requiring tight voltage regulation and low noise. IC Role / Device Role / Timing Role: Synchronous buck stage with integrated Schottky diode and current sense amplifier for precise current balancing across memory channels. Use Value: Achieves <±3mV load regulation over 0–50A using REFIN-referenced IOUT feedback, minimizing memory timing jitter. | Use Scenario: Multi-phase core VRM for cloud infrastructure CPUs with strict thermal envelope and lifecycle reliability requirements. IC Role / Device Role / Timing Role: DrMOS-compliant power stage with PHSFLT# fault signaling and thermal flag for predictive maintenance and firmware-controlled shutdown. Use Value: Supports 150°C max junction temperature and MSL3 reflow compatibility, enabling long-term field deployment in unventilated chassis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR3550MTRPBF | 60A DC rating, identical pinout and package; higher RDS(on) on synchronous MOSFET increases conduction loss above 40A | Preferred for higher-current CPU cores where thermal margin permits larger steady-state losses | Select when peak current exceeds 50A but layout constraints prevent adding phases |
| IR3553MTRPBF | 40A DC rating, same footprint; lower gate charge and reduced die size yield ~2% higher light-load efficiency below 10A | Better suited for auxiliary rails (e.g., SoC I/O, cache voltage) with moderate current demand | Choose for cost-sensitive, thermally constrained designs where 40A headroom suffices |
Compared with IR3550MTRPBF and IR3553MTRPBF, the IR3551MTRPBF delivers optimal balance of 50A capacity, 94.5% peak efficiency, and Body-Braking® transient response - making it the preferred choice for mainstream server CPU core VRMs where thermal density and transient performance are equally critical.
Availability
IR3551MTRPBF is available at Aetrix Electronics and suitable for CPU core voltage regulation, GPU power delivery, and DDR memory array supplies requiring stable component supply, long-lifecycle support, and RoHS-compliant manufacturing.
Supply support for IR3551MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and advanced power stage integration.
The PowIRstage® product line delivers fully integrated, high-efficiency buck power stages targeting server, workstation, and AI accelerator VRMs - designed to replace discrete MOSFET + driver combinations while improving thermal performance and simplifying PCB layout.
FAQ
What is the recommended decoupling for VIN and VCC?
VIN requires at least two 10µF 1206 ceramic capacitors plus one 0.22µF 0402 capacitor placed adjacent to pins 16–19 and PGND (pins 14–15). VCC needs a minimum 0.22µF capacitor to PGND (pin 4); increase to 1µF if the current sense amplifier is enabled. All capacitors must be placed with minimal trace length to maintain high-frequency stability.
How does Body-Braking® reduce output capacitance?
Body-Braking® activates when PWM enters tri-state, turning off both MOSFETs to allow the synchronous MOSFET body diode to conduct reverse current during fast load decrements. This rapidly discharges output capacitance, cutting required bulk capacitance by up to 30% compared to standard synchronous operation - verified in Intel VR13/VR14 validation reports.
Can IR3551MTRPBF operate without the current sense amplifier?
Yes - tie CSIN+ and CSIN− to LGND, float IOUT, and connect REFIN to LGND. The device functions as a standard DrMOS stage with PWM-controlled switching only. Diode-emulation and Body-Braking® remain fully operational, but current monitoring and phase-current balancing capabilities are disabled.
What is the thermal derating behavior above 125°C junction temperature?
The IR3551MTRPBF includes a thermal flag that pulls PHSFLT# low at 160°C (rising threshold) and releases at 135°C (falling threshold). Above 125°C, conduction losses rise linearly due to RDS(on) increase, but no automatic throttling occurs - system-level thermal management must respond to PHSFLT# assertion before reaching 150°C absolute maximum junction temperature.
IR3551MTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- PowIRstage®
- Package/Case:
- 28-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters, Voltage Regulators
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 50A
- Current - Peak Output:
- 75A
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 4.5V ~ 15V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation, Status Flag
- Fault Protection:
- Over Temperature, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PQFN (5x6)
IR3551MTRPBF FAQ
1.How can I place an order for IR3551MTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IR3551MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IR3551MTRPBF reliable?
The price and inventory of IR3551MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3551MTRPBF is usually 5 days.
3.What payment methods are accepted for IR3551MTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3551MTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IR3551MTRPBF?
IR3551MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IR3551MTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IR3551MTRPBF?
For technical support, including IR3551MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3551MTRPBF requirements.
6.How does Aetrix verify that IR3551MTRPBF is sourced from the original manufacturer or authorized distributors?
All IR3551MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3551MTRPBF meets industry standards.
7.What is the process for return or replacement of IR3551MTRPBF?
All IR3551MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3551MTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IR3551MTRPBF part is unused and in its original packaging.
Return procedure for IR3551MTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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