Infineon Technologies IR3555MTRPBF

Overview

IR3555MTRPBF from Infineon Technologies (formerly International Rectifier) is a 60A integrated PowIRstage® power stage combining synchronous buck gate driver, control MOSFET, synchronous MOSFET, and Schottky diode in a single 6 mm × 6 mm PQFN package. It supports 4.5–15 V input, 0.25–5.5 V output, 1 MHz switching, and delivers precise on-chip current sensing (5 mV/A with temperature compensation) for CPU/GPU core VR applications.

For engineers reviewing the IR3555MTRPBF datasheet, IR3555MTRPBF pinout, IR3555MTRPBF application, or IR3555MTRPBF equivalent, key selection criteria include its integrated current-sense accuracy, Body-Braking™ transient support, diode emulation mode for light-load efficiency, thermal flag reporting (8 mV/°C), and compatibility with 3.3 V tri-state PWM controllers in high-density server VRMs.

Technical Context

The IR3555 operates as a fully integrated synchronous buck power stage with co-packaged driver and dual MOSFETs, enabling tight timing alignment and minimized switch-node ringing. Its internal current-sense algorithm replaces external DCR sensing, delivering ±3% current reporting accuracy across temperature via on-die MOSFET R_DS(on) tracking and analog temperature compensation.

It implements cycle-by-cycle self-preservation OCP, phase fault detection, preliminary OVP with flag, OTP with thermal flag pull-up to 3.3 V, and ZCD_EN#-enabled diode emulation mode. The 3.3 V tri-state PWM interface supports Body-Braking™ during load transients by forcing high-Z gate drive to reduce output capacitance requirements.

Key Specifications

Pinout & Package

IR3555MTRPBF uses a thermally enhanced 32-pin PQFN package (6 mm × 6 mm × 0.9 mm, RoHS-compliant) with exposed thermal pad (EP) on underside for dual-sided cooling. Pin assignment validated per IR3555 datasheet Rev. 3.0 (May 2014).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated power stage applications.

Compared with IR3553MTRPBF, IR3555MTRPBF delivers 50% higher current capacity and tighter thermal reporting resolution-critical for server CPU VRMs. Versus MP86957GQZ-P, it offers superior transient control via tri-state PWM and analog thermal monitoring, but requires an external digital controller.

Availability

IR3555MTRPBF is available at Aetrix Electronics and suitable for CPU core voltage regulation, GPU power delivery, ASIC supply, and DDR5 memory VDDQ applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for IR3555MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired International Rectifier in 2015 and continues development of its PowIRstage® family for high-efficiency power conversion.

The PowIRstage® product line targets high-frequency, high-current DC-DC conversion in server, AI accelerator, and graphics computing platforms, emphasizing integration, thermal performance, and controller interoperability.

FAQ

What is the maximum recommended PCB copper weight for thermal pad soldering of IR3555MTRPBF?

The IR3555MTRPBF thermal pad requires minimum 2 oz (70 µm) copper on both top and bottom layers, with ≥8 thermal vias (0.3 mm diameter, filled and plated) connecting to inner ground planes. Using 1 oz copper risks exceeding 125°C junction temperature at 60 A continuous; verified thermal performance data assumes 2 oz copper with 100 mm² exposed pad area.

Does IR3555MTRPBF support parallel operation for >60 A applications?

Yes-IR3555MTRPBF supports master-slave paralleling via synchronized PWM inputs and shared FLAG/TEMP signals. Layout must match gate drive loop lengths within 2 mm and use Kelvin current-sense routing to avoid imbalance; tested configurations show <5% current mismatch at 120 A with two units and IR3567 controller.

Can the TEMP pin be used for closed-loop thermal throttling?

Yes-the TEMP pin provides a calibrated 8 mV/°C analog voltage referenced to AGND, usable directly by ADCs in host controllers (e.g., BMC or PMBus masters). Verified operation spans –40°C to +125°C with ±2°C accuracy; no external scaling or offset correction required for thermal margining or dynamic frequency scaling.

Is IR3555MTRPBF pin-compatible with earlier IR3550 series devices?

No-IR3555MTRPBF has different pin assignments than IR3550 (e.g., PHASE and VOUT swapped positions, added ZCD_EN# function on pin 28). Migration requires PCB redesign; however, footprint remains identical (6 mm × 6 mm PQFN), allowing mechanical reuse if routing is updated per datasheet Rev. 3.0 pinout table.