Infineon Technologies IR3556MTRPBF
- Part No.:
- IR3556MTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 30-PowerVFQFN
- Datasheet:
-
IR3556MTRPBF.pdf
- Description:
- IC GATE DRIVER 50A 30PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,516
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Product details
Overview
IR3556MTRPBF from Infineon Technologies (formerly International Rectifier) is a 50A integrated PowIRstage® power stage combining synchronous buck gate driver, control MOSFET, synchronous MOSFET, Schottky diode, and on-die current/temperature sensing in a single 6 mm × 6 mm PQFN package. It supports 4.5–15 V input, 0.25–5.5 V output, 1 MHz switching, and delivers CPU/GPU core power in server-grade VRMs.
For engineers reviewing the IR3556MTRPBF datasheet, IR3556MTRPBF pinout, IR3556MTRPBF application, or IR3556MTRPBF equivalent, key selection criteria include its 5 mV/A temperature-compensated current sense accuracy, Body-Braking™ transient support via tri-state PWM, diode emulation mode for light-load efficiency, and phase fault detection capability.
Technical Context
The IR3556 implements a co-packaged synchronous buck power stage with integrated driver logic that directly controls high-side and low-side MOSFETs using internal timing calibration to minimize shoot-through risk. Its on-die current sensing uses MOSFET RDS(on) tracking with 5 mV/A gain and analog temperature compensation, eliminating external DCR networks.
It features dual thermal monitoring: an 8 mV/°C analog temperature output and a digital thermal flag pulled up to 3.3 V, both derived from die temperature. Protection includes cycle-by-cycle OCP, preliminary OVP, OTP, and MOSFET phase fault detection-all implemented in hardware without controller dependency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.5 V to 15 V - Supports standard 5 V, 12 V intermediate bus architectures in server VRMs. |
| IOUT Max | 50 A continuous - Rated for sustained high-current CPU/GPU core rail delivery with dual-sided cooling. |
| fSW Max | 1.0 MHz - Enables compact magnetics and capacitors while maintaining <500 ns load-step response. |
| Current Sense | 5 mV/A with temp compensation - Replaces lossy DCR sensing; achieves ±3% full-scale accuracy across –40°C to +125°C. |
| Package | 6 mm × 6 mm × 0.9 mm PQFN - Optimized for low-inductance layout, thermal vias, and minimal switch-node ringing. |
| Thermal Output | 8 mV/°C analog voltage - Provides real-time die temperature feedback for dynamic thermal throttling in digital controllers. |
| PWM Input | 3.3 V tri-state compatible - Enables Body-Braking™ during load transients without external level-shifting. |
Pinout & Package
IR3556MTRPBF is housed in a thermally enhanced 32-pin PQFN (6 mm × 6 mm, 0.9 mm height) with exposed thermal pad. Pin assignment follows Infineon's standardized PowIRstage® layout for optimal PCB routing and thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain input | Primary power input node; connects to bulk capacitor and must be routed with low-inductance path. |
| VOUT | Power output node | Switch-node connection point; ties to inductor and output capacitor; critical for EMI control. |
| PGND | Power ground reference | Low-impedance return path for high di/dt currents; tied directly to thermal pad and PCB ground plane. |
| AGND | Analog ground reference | Isolated ground for current/temp sensing circuitry; must be star-connected to avoid noise coupling. |
| ISEN | Current sense output | Analog voltage proportional to output current (5 mV/A); used by controller for current-mode regulation. |
| TEMP | Digital thermal flag | Open-drain output pulled up to 3.3 V; asserts low when die temperature exceeds OTP threshold. |
| ZCD_EN# | Zero-cross detect enable | Active-low input enabling diode emulation mode; disables synchronous rectification at light loads. |
| PWM | Gate drive input | 3.3 V logic-compatible tri-state input controlling high-side MOSFET; enables Body-Braking™ during transients. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Schottky Diode | Reduces body-diode conduction losses during dead-time, improving efficiency at light loads without external components. |
| Body-Braking™ Support | Tri-state PWM input allows rapid discharge of output inductor energy during load steps, cutting required output capacitance by up to 30%. |
| Diode Emulation Mode (DEM) | ZCD_EN#-controlled zero-cross detection disables low-side FET conduction when current reverses, eliminating reverse recovery losses. |
| Phase Fault Detection | Dedicated hardware flag signals open-circuit or short-circuit failure in either MOSFET leg, enabling fast system-level fault shutdown. |
| Dual-Sided Cooling | Top-side copper paddle and bottom thermal pad allow simultaneous heatsink and PCB thermal interface, reducing θJA to 12°C/W. |
Applications
| Server CPU Core VRM | GPU Power Delivery |
|---|---|
Use Scenario: High-current, fast-transient power delivery to multi-core Xeon or EPYC processors in 1U/2U rack servers. IC Role / Device Role / Timing Role: Integrated power stage providing regulated 0.8–1.2 V output at up to 50 A with sub-200 ns load-step response. Use Value: Eliminates discrete driver/MOSFET layout complexity and improves current-sense accuracy over DCR-based solutions by ±2.5%. | Use Scenario: Compact, high-efficiency power stage for NVIDIA A100 or AMD MI250X GPU memory and core rails in AI accelerators. IC Role / Device Role / Timing Role: Synchronous buck stage delivering 0.75–1.1 V at 40–50 A with 1 MHz operation and Body-Braking™ for PCIe slot power constraints. Use Value: Reduces total solution size by 35% vs. discrete alternatives while maintaining <92% efficiency at 20 A. |
| ASIC Core Supply | DDR5 Memory VDDQ Rail |
Use Scenario: Powering high-performance networking ASICs (e.g., Broadcom Tomahawk, Marvell Prestera) requiring tight voltage tolerance and fast transient immunity. IC Role / Device Role / Timing Role: Primary power stage in multiphase VRM delivering 0.6–0.85 V at 30–45 A per phase with precise current reporting for phase shedding. Use Value: On-die current sense enables accurate per-phase current balancing without external current monitors. | Use Scenario: Low-profile, high-efficiency supply for DDR5 VDDQ (1.25 V) in memory modules and server DIMMs where height and thermal density are constrained. IC Role / Device Role / Timing Role: Single-phase buck stage supporting 1.25 V @ 25 A with diode emulation mode active below 5 A to maintain >88% efficiency at light load. Use Value: Dual-sided cooling and 0.9 mm profile meet JEDEC height limits while sustaining 100% rated current at 85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35203MTRPBF | 30 A rating, 6×6 mm PQFN, no integrated Schottky diode, lower current sense gain (10 mV/A). | Suitable for mid-tier CPUs or SoCs with <35 A demand; lacks Body-Braking™ and DEM. | Select when cost sensitivity outweighs transient performance and light-load efficiency requirements. |
| MP86957GQZ-10 | 50 A rating, 5×6 mm QFN, integrated driver/MOSFET only (no Schottky), 1.2 MHz max fSW, no analog TEMP output. | Better suited for space-constrained telecom PoL converters; missing phase fault flag and ZCD_EN#. | Prefer for higher-frequency designs where thermal flag granularity is less critical than footprint reduction. |
Compared with IR3556MTRPBF, IR35203MTRPBF trades current capacity and feature set for cost, while MP86957GQZ-10 prioritizes switching frequency and size over integrated protection and analog telemetry-making IR3556MTRPBF optimal for server-grade reliability and controller interoperability.
Availability
IR3556MTRPBF is available at Aetrix Electronics and suitable for server CPU VRMs, GPU power delivery, ASIC core supplies, and DDR5 VDDQ rails requiring stable component supply, long-lifecycle support, and validated thermal performance under sustained 50 A load.
Supply support for IR3556MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control ICs, with deep expertise in silicon and silicon carbide power devices.
The PowIRstage® product line delivers fully integrated, co-packaged power stages optimized for high-efficiency, high-density DC-DC conversion in datacenter and AI accelerator applications.
FAQ
What is the recommended PCB layout for thermal performance?
Use ≥6 thermal vias (0.3 mm diameter, 0.6 mm pitch) under the exposed thermal pad, connected to a solid internal ground plane. Route VIN and VOUT traces with ≥2 oz copper and minimum 3 mm width. Keep ISEN and TEMP traces short and away from noisy switching nodes to preserve analog accuracy.
Does IR3556MTRPBF require external bootstrap components?
No. The IR3556MTRPBF integrates all bootstrap circuitry internally, including charge pump and high-side gate driver supply regulation. No external capacitors or diodes are needed for bootstrap operation-only the standard VCC and VDRV supplies (4.5–7 V) must be provided.
How does the phase fault detection work?
Phase fault detection monitors voltage across each MOSFET leg using internal comparators. It flags open-circuit (e.g., bond wire lift) if VDS remains high during expected conduction, or short-circuit if VDS stays near 0 V during off-time. The TEMP pin asserts low within 100 ns of fault detection.
Can IR3556MTRPBF operate without a digital controller?
Yes-it functions as a standalone power stage with analog PWM input. However, full utilization of Body-Braking™, DEM, and current/temperature telemetry requires a compatible digital controller (e.g., IR3567B or ISL993xx series) that supports tri-state PWM and reads ISEN/TEMP analog outputs.
IR3556MTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- PowIRstage®
- Package/Case:
- 30-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- Synchronous Buck Converters, Voltage Regulators
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- 50A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 4.5V ~ 15V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Over Voltage, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-PQFN (6x6)
IR3556MTRPBF FAQ
1.How can I place an order for IR3556MTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IR3556MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IR3556MTRPBF reliable?
The price and inventory of IR3556MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3556MTRPBF is usually 5 days.
3.What payment methods are accepted for IR3556MTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3556MTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IR3556MTRPBF?
IR3556MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IR3556MTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IR3556MTRPBF?
For technical support, including IR3556MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3556MTRPBF requirements.
6.How does Aetrix verify that IR3556MTRPBF is sourced from the original manufacturer or authorized distributors?
All IR3556MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3556MTRPBF meets industry standards.
7.What is the process for return or replacement of IR3556MTRPBF?
All IR3556MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3556MTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IR3556MTRPBF part is unused and in its original packaging.
Return procedure for IR3556MTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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