Infineon Technologies IR3557MTRPBF
- Part No.:
- IR3557MTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 30-PowerVFQFN
- Datasheet:
-
IR3557MTRPBF.pdf
- Description:
- IC GATE DRIVER 40A 30PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,251
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IR3557MTRPBF from Infineon Technologies (formerly International Rectifier) is a 40A integrated PowIRstage® power stage combining synchronous buck gate driver, control MOSFET, synchronous MOSFET, and Schottky diode in a single 6 mm × 6 mm PQFN package. It supports 4.5–15 V input, 0.25–5.5 V output, 1 MHz switching, and delivers precise on-chip current sensing (5 mV/A with temperature compensation) for CPU/GPU core VR applications.
For engineers reviewing the IR3557MTRPBF datasheet, IR3557MTRPBF pinout, IR3557MTRPBF application, or IR3557MTRPBF equivalent, key selection criteria include its integrated current-sense accuracy, Body-Braking™ transient support, diode emulation mode for light-load efficiency, thermal flag reporting (8 mV/°C), and compatibility with 3.3 V tri-state PWM controllers in high-density server VRMs.
Technical Context
The IR3557 implements a co-packaged synchronous buck power stage where the driver IC precisely times gate drive signals to minimize shoot-through and switch-node ringing. Its internal current-sense algorithm uses MOSFET RDS(on) tracking with analog temperature compensation, delivering better DC accuracy than external DCR-based sensing.
It integrates cycle-by-cycle overcurrent protection with self-preservation, phase fault detection, preliminary overvoltage flag, and overtemperature protection with analog die temperature output (8 mV/°C) and digital thermal flag pulled up to 3.3 V - all operating within 4.5–7 V VCC/VDRV supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.5 V to 15 V - supports standard 5 V, 12 V intermediate bus architectures in server VRMs. |
| IOUT Max | 40 A continuous - enables single-stage core power delivery for mid-tier CPUs and GPUs without paralleling. |
| Switching Freq | Up to 1.0 MHz - allows smaller output inductors and capacitors while maintaining fast load-step response. |
| Current Sense | 5 mV/A with on-die temperature compensation - provides ±3% full-scale accuracy across temperature, eliminating need for external sense resistors. |
| Thermal Output | 8 mV/°C analog voltage - enables real-time die temperature monitoring without external sensor or ADC. |
| Package | 6 mm × 6 mm × 0.9 mm PQFN - dual-sided cooling design improves thermal resistance by enabling PCB copper fill under both top and bottom surfaces. |
Pinout & Package
IR3557MTRPBF is housed in a thermally enhanced 32-pin PQFN (6 mm × 6 mm, 0.9 mm height) with exposed thermal pad. Pin functions are validated per Infineon's IR3557 datasheet (V3.0, May 2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side power input | Connects to 4.5–15 V input rail; feeds control/sync FETs and internal LDOs. |
| VOUT | Power output node | Switch-node connection point; ties directly to output inductor and low-side return path. |
| PGND | Power ground | Low-impedance return for high-current paths; must be connected to thermal pad and solid ground plane. |
| AGND | Analog ground | Reference for current sense, thermal output, and PWM input; isolated from PGND to reduce noise coupling. |
| PWM | Tri-state PWM input | Accepts 3.3 V logic-level PWM signal; tri-state capability enables Body-Braking™ during load transients. |
| TEMP | Analog temperature output | Provides 8 mV/°C voltage proportional to die temperature; used for closed-loop thermal management. |
| THERM | Digital thermal flag | Open-drain output pulled up to 3.3 V; asserts low when die temperature exceeds OTP threshold. |
| OCFLAG | Overcurrent fault flag | Open-drain output signaling cycle-by-cycle OCP event; used for system fault logging or controller shutdown. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Schottky diode | Reduces body-diode conduction loss during dead-time, improving efficiency at light loads without external components. |
| Diode emulation mode (DEM) | Enables discontinuous conduction mode via ZCD_EN#-controlled zero-cross detection, boosting light-load efficiency by >5% vs. forced CCM. |
| Body-Braking™ support | Leverages PWM tri-state to actively sink load current during negative load steps, reducing required output capacitance by up to 30%. |
| On-chip current sensing | Eliminates external sense resistor and associated layout complexity while maintaining ±3% accuracy from –40°C to +125°C. |
| Dual-sided cooling | Thermal pad on bottom + exposed copper on top allow simultaneous conduction to PCB layers and heatsink, lowering θJA to 13.5°C/W. |
Applications
| CPU Core VRM | GPU Power Stage |
|---|---|
Use Scenario: High-transient, multi-phase 12 V input → 0.8–1.2 V output VRM for dual-socket server CPUs. IC Role / Device Role / Timing Role: Integrated power stage providing synchronized high-side/low-side switching, current feedback, and thermal telemetry per phase. Use Value: Enables <100 ns load-step response with minimal output capacitance due to Body-Braking™ and 1 MHz operation. | Use Scenario: Compact, low-profile 48 V or 12 V input → 0.7–1.0 V output power delivery for AI accelerator GPUs. IC Role / Device Role / Timing Role: Single-phase power stage delivering 40 A peak current with integrated current and temperature sensing for closed-loop control. Use Value: Reduces BOM count by integrating driver, FETs, and diode while maintaining ±3% current accuracy for dynamic current balancing. |
| ASIC Core Supply | DDR Memory VDDQ |
Use Scenario: Point-of-load regulation for high-performance networking ASICs requiring tight voltage tolerance (<±10 mV) and fast transient recovery. IC Role / Device Role / Timing Role: Primary power stage in multiphase VRM, supplying regulated core voltage with real-time die temperature reporting. Use Value: On-die 8 mV/°C analog temperature output enables predictive thermal throttling before junction limits are exceeded. | Use Scenario: Dual-rail DDR4/DDR5 memory subsystem powering VDDQ (1.2 V or 1.1 V) with high current slew rate demands. IC Role / Device Role / Timing Role: High-efficiency, low-noise power stage supporting diode emulation mode to maintain efficiency at standby currents <1 A. Use Value: DEM mode increases light-load efficiency by 6–8 percentage points versus forced CCM, extending system idle time in data centers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35203MTRPBF | 25 A rating, 30 V max VIN, integrated current sense but no analog TEMP output; requires external temperature monitoring. | Suitable for lower-current client CPU VRMs where thermal telemetry is less critical. | Select when cost-sensitive designs tolerate reduced current capacity and lack of on-die thermal voltage output. |
| MP86957GQZ-P | 40 A rating, 16 V max VIN, includes PMBus interface and digital telemetry; no analog TEMP output; larger 7 mm × 7 mm QFN. | Preferred for digitally managed VRMs requiring voltage/current/temperature register reads via PMBus. | Choose when system-level digital control, fault logging, and programmable OCP thresholds outweigh analog simplicity and footprint advantage. |
Compared with IR3557MTRPBF, IR35203MTRPBF trades current capacity and thermal telemetry for lower cost and smaller size, while MP86957GQZ-P adds digital configurability at the expense of analog simplicity and board area - making IR3557 optimal for analog-controlled, space-constrained server CPU VRMs demanding precision thermal and current feedback.
Availability
IR3557MTRPBF is available at Aetrix Electronics and suitable for CPU core VRMs, GPU power stages, ASIC point-of-load converters, and DDR memory VDDQ supplies requiring stable component supply, high thermal reliability, and precise analog telemetry.
Supply support for IR3557MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and continues development of its PowIRstage® family for high-efficiency power conversion.
The PowIRstage® product line targets high-frequency, high-current DC-DC conversion in server, AI accelerator, and telecom infrastructure, emphasizing integration, thermal performance, and analog sensing fidelity.
FAQ
What is the recommended PCB layout for optimal thermal performance?
Use a minimum 2 oz copper thermal pad connected to ≥4 internal ground planes via ≥12 thermal vias (0.3 mm diameter, 0.6 mm pitch). Keep AGND and PGND traces separate until star-point connection at the thermal pad. Route PWM and TEMP traces away from high-dI/dt paths to avoid noise coupling into analog sensing.
Does IR3557MTRPBF require an external bootstrap capacitor?
No. The IR3557MTRPBF integrates a charge pump for high-side gate drive, eliminating the need for an external bootstrap capacitor. This simplifies layout, reduces component count, and avoids bootstrap-related startup issues or voltage droop during sustained 100% duty cycle operation.
How does the on-chip current sensing compare to external DCR sensing?
IR3557MTRPBF achieves ±3% full-scale current measurement accuracy from –40°C to +125°C using MOSFET RDS(on) tracking with on-die temperature compensation. This outperforms typical DCR-based methods (±5–8% error) that suffer from inductor tolerance, temperature drift, and PCB trace resistance errors.
Can IR3557MTRPBF operate with a 3.3 V-only supply?
Yes - the PWM input is compatible with 3.3 V tri-state logic, and the VCC/VDRV supply accepts 4.5–7 V. However, a separate 5 V or 6 V bias supply is required for VCC/VDRV; the device does not generate its own gate-drive bias from the 3.3 V PWM rail.
IR3557MTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- PowIRstage®
- Package/Case:
- 30-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- Synchronous Buck Converters, Voltage Regulators
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- 40A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 4.5V ~ 15V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Over Voltage, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-PQFN (6x6)
IR3557MTRPBF FAQ
1.How can I place an order for IR3557MTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IR3557MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IR3557MTRPBF reliable?
The price and inventory of IR3557MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3557MTRPBF is usually 5 days.
3.What payment methods are accepted for IR3557MTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3557MTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IR3557MTRPBF?
IR3557MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IR3557MTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IR3557MTRPBF?
For technical support, including IR3557MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3557MTRPBF requirements.
6.How does Aetrix verify that IR3557MTRPBF is sourced from the original manufacturer or authorized distributors?
All IR3557MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3557MTRPBF meets industry standards.
7.What is the process for return or replacement of IR3557MTRPBF?
All IR3557MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3557MTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IR3557MTRPBF part is unused and in its original packaging.
Return procedure for IR3557MTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IR3557MTRPBF Tags
-
NCP1393BDR2G
onsemi

-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi

-
A3909GLYTR-T
Allegro MicroSystems

-
SIC631CD-T1-GE3
Vishay Siliconix

-
BTN70301EPAXUMA1
Infineon Technologies

-
TDA21520AUMA1
Infineon Technologies

-
AOZ5116QI
Alpha & Omega Semiconductor Inc.

-
IRSM005-301MHTR
Infineon Technologies

-
IRSM005-301MH
Infineon Technologies

-
MP6610GJ-Z
Monolithic Power Systems Inc.

-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
