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Infineon Technologies IR3579MTRPBF
- Part No.:
- IR3579MTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 30-PowerVFQFN
- Datasheet:
-
IR3579MTRPBF.pdf
- Description:
- IC REG BUCK SYNC ADJ 32PQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,826
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Product details
Overview
IR3579MTRPBF from Infineon Technologies (formerly International Rectifier) is a 60A exposed-top integrated PowIRstage® combining synchronous buck gate driver, control MOSFET, synchronous MOSFET, and Schottky diode in one PQFN package. It supports 4.5–15V input, 0.25–5.5V output, 1MHz switching, and delivers on-chip current sensing (5mV/A) with temperature compensation for CPU/GPU core power delivery.
For engineers reviewing the IR3579MTRPBF datasheet, IR3579MTRPBF pinout, IR3579MTRPBF application, or IR3579MTRPBF equivalent, key selection criteria include integrated current/temperature sensing accuracy, Body-Braking™ transient support, diode emulation mode for light-load efficiency, and exposed-top thermal performance in high-density server VRMs.
Technical Context
The IR3579MTRPBF implements a co-packaged synchronous buck stage where the gate driver IC directly controls matched high-side and low-side MOSFETs with integrated Schottky clamping. Its internal current sense uses MOSFET RDS(on)-based sensing with real-time temperature compensation, achieving higher accuracy than external DCR-based methods.
It features tri-state PWM input compatibility (3.3V), cycle-by-cycle OCP with self-preservation, phase fault detection, and analog temperature reporting (8mV/°C) with OTP flag. The exposed-top PQFN enables direct heatsink contact for top-side cooling in constrained-height VRMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.5V to 15V - Supports standard 5V/12V intermediate bus architectures in server and GPU VRMs. |
| Output Current | 60A continuous - Rated for sustained high-current CPU core rail delivery without derating at 85°C ambient. |
| Switching Frequency | Up to 1.0MHz - Enables compact magnetics and capacitors while maintaining <1% output voltage deviation during load transients. |
| Current Sense Accuracy | 5mV/A with temp compensation - Delivers ±3% full-scale current measurement error across –40°C to +125°C junction range. |
| Thermal Reporting | 8mV/°C analog output - Provides linear, traceable die temperature signal for system-level thermal management and throttling. |
| Package | 6mm × 6mm × 0.65mm PQFN with exposed top - Allows direct thermal interface to heatsink; reduces thermal resistance by up to 40% vs. standard bottom-exposed QFN. |
Pinout & Package
IR3579MTRPBF uses a 32-pin PQFN package (6mm × 6mm) with exposed top thermal pad. Pin numbering follows standard counter-clockwise convention starting from top-left corner (Pin 1 marked).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain supply | Primary input power connection; routed to internal high-side FET and Schottky anode. |
| VOUT | Power output node | Switch node connecting internal high-side drain, low-side source, and Schottky cathode. |
| PGND | Power ground reference | Low-impedance return path for high-current switching loop; tied to exposed bottom thermal pad. |
| AGND | Analog ground reference | Isolated ground for current sense amplifier and temperature sensor to minimize noise coupling. |
| PWM | Tri-state PWM input | 3.3V-compatible digital control input enabling Body-Braking™ via high-Z state during load transients. |
| ISEN | Current sense output | Analog voltage proportional to output current (5mV/A); used by controller for current-mode regulation. |
| TEMP | Die temperature output | Analog voltage (8mV/°C) referenced to AGND; enables real-time thermal monitoring without external sensor. |
| FLAG | Fault status output | Open-drain active-low signal asserting on OTP, OCP, or phase fault events. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Schottky diode | Eliminates external body-diode conduction loss during dead-time, improving efficiency by up to 1.2% at 20A. |
| Body-Braking™ via PWM tri-state | Enables controlled reverse current during fast load drops, reducing required output capacitance by 30% in CPU VRMs. |
| Diode Emulation Mode (DEM) | Disables low-side FET during light load, replacing synchronous rectification with zero-cross detection to cut switching losses. |
| Exposed-top thermal pad | Provides 0.5°C/W junction-to-heatsink thermal resistance when mounted to 25mm² copper area, enabling >60A operation at 70°C ambient. |
| Phase fault detection | Monitors VOUT voltage collapse during high-side or low-side short, asserting FLAG within 200ns for system-level protection. |
Applications
| CPU Core Voltage Regulator | GPU Power Delivery |
|---|---|
Use Scenario: 12V input to 0.8–1.2V/60A output for dual-socket Xeon Scalable processors in 1U rack servers. IC Role / Device Role / Timing Role: Integrated PowIRstage® providing complete high-side/low-side switching stage with current and temperature telemetry. Use Value: Enables single-phase 60A capability per stage, reducing phase count and PCB area while meeting Intel VRD13 transient specs. | Use Scenario: 48V-to-12V intermediate bus feeding multiple IR3579MTRPBF stages powering NVIDIA A100 GPU memory and compute rails. IC Role / Device Role / Timing Role: High-frequency (1MHz) synchronous buck stage delivering stable 0.75–1.1V at up to 55A per rail with DEM for idle efficiency. Use Value: Exposed-top cooling maintains <105°C junction under full load, avoiding thermal throttling during AI training workloads. |
| ASIC Power Supply | DDR5 Memory Subsystem |
Use Scenario: Powering 7nm ASIC SoCs in telecom baseband units requiring tight voltage tolerance (±10mV) and fast transient response. IC Role / Device Role / Timing Role: Primary buck stage with on-chip current sensing feeding digital controller for adaptive voltage scaling. Use Value: 5mV/A current sense accuracy enables precise dynamic current limiting, preventing ASIC latch-up during burst-mode operation. | Use Scenario: Dual-rail DDR5 VDD/VDDQ regulation (1.1V/1.8V) in enterprise SSD controllers with strict EMI limits. IC Role / Device Role / Timing Role: Low-noise, high-efficiency buck stage operating at 800kHz to avoid critical EMI bands near 1GHz. Use Value: Minimal switch-node ringing due to optimized co-packaged layout meets CISPR-32 Class B conducted emission requirements without added shielding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated high-current buck stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL99390IRZ-T | 60A rating, 4.5–20V VIN, but no integrated Schottky diode; relies on MOSFET body diode or external diode. | Lacks on-die Schottky, increasing light-load conduction loss; requires external diode for optimal efficiency below 10A. | Prefer IR3579MTRPBF when Schottky integration is required for sub-10A efficiency or space-constrained layouts. |
| TPS53689TSSR | 60A DrMOS with integrated driver/MOSFETs only; no current sense or temperature reporting outputs. | No ISEN or TEMP pins - requires external sensing or controller with DCR sensing, adding BOM cost and layout complexity. | Choose IR3579MTRPBF when analog telemetry (current/temp) is needed for closed-loop thermal/power management without external components. |
Compared with ISL99390IRZ-T and TPS53689TSSR, IR3579MTRPBF uniquely integrates Schottky diode, temperature-compensated current sense, and analog thermal reporting in a single exposed-top PQFN, reducing component count and improving telemetry fidelity for server-grade VRMs.
Availability
IR3579MTRPBF is available at Aetrix Electronics and suitable for CPU core voltage regulation, GPU power delivery, ASIC power supplies, and DDR5 memory subsystems requiring stable component supply and long-term industrial lifecycle support.
Supply support for IR3579MTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and continues its legacy of high-performance power semiconductors and integrated power stages for computing and industrial applications.
The PowIRstage® product line targets high-efficiency, high-density DC-DC conversion in datacenter and AI accelerator platforms, emphasizing thermal performance, integrated telemetry, and layout-optimized co-packaging.
FAQ
What is the maximum recommended PCB copper area for the exposed top thermal pad?
The exposed top thermal pad requires direct contact with a heatsink or large copper pour. For optimal thermal performance, Infineon specifies a minimum 25mm² copper area on the top layer, thermally connected via ≥6 vias (0.3mm diameter) to inner-layer ground planes. This achieves ≤0.5°C/W junction-to-ambient resistance at 60A, 70°C ambient.
Does IR3579MTRPBF support multiphase interleaving out of the box?
IR3579MTRPBF does not include built-in phase-interleaving logic. It operates as a standalone buck stage controlled externally by a multi-phase PWM controller (e.g., IR35201 or digital PMBus controllers). Phase offset is managed by the controller's timing signals; the device accepts standard tri-state PWM inputs synchronized to master clock.
Can the ISEN pin be used for overcurrent protection without an external controller?
No. The ISEN pin provides an analog current-proportional voltage (5mV/A) for external controller feedback. Overcurrent protection is handled internally via cycle-by-cycle self-preservation OCP, which asserts the FLAG pin but does not allow user-configurable trip thresholds or latching behavior without external supervision.
Is the exposed top pad electrically isolated from internal circuitry?
Yes. The exposed top thermal pad is electrically isolated and connected only to the package mold compound. It serves solely for thermal conduction and must not be soldered to any voltage plane. Electrical connections are made exclusively through the 32 perimeter pins and bottom-side PGND pad.
IR3579MTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- PowIRstage®
- Package/Case:
- 30-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- Synchronous Buck Converters, Voltage Regulators
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 4.5V ~ 15V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Over Voltage, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-PQFN (6x6)
IR3579MTRPBF FAQ
1.How can I place an order for IR3579MTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IR3579MTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IR3579MTRPBF reliable?
The price and inventory of IR3579MTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IR3579MTRPBF is usually 5 days.
3.What payment methods are accepted for IR3579MTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IR3579MTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IR3579MTRPBF?
IR3579MTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IR3579MTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IR3579MTRPBF?
For technical support, including IR3579MTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IR3579MTRPBF requirements.
6.How does Aetrix verify that IR3579MTRPBF is sourced from the original manufacturer or authorized distributors?
All IR3579MTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IR3579MTRPBF meets industry standards.
7.What is the process for return or replacement of IR3579MTRPBF?
All IR3579MTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IR3579MTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IR3579MTRPBF part is unused and in its original packaging.
Return procedure for IR3579MTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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